Parametric Failures in COTS Capacitors

Insertion of COTS components into hi-rel systems require extensive environmental testing of the parts that often results in parametric failures. Based on experience with commercial and hi-rel PME and BME ceramic capacitors and polymer and MnO2 cathode tantalum capacitors, this presentation discusses two major reasons for parametric failures. One is due to the marketing pressure that forces manufacturers to squeeze performance of COTS components thus leaving insufficient margin between the rated and actual characteristics. Another, and probably a more serious reason is degradation of characteristics caused by physico-chemical processes in materials under environmental stresses. Reliability assessment requires development of models to predict behavior of the parts during applications based on accelerated testing that might be outside the specified conditions and target applications. Examples of models developed to simulate and predict wear-out failures are presented. Risks associated with overstressing during HALT are discussed

Analysis of Weibull Grading Test for Solid Tantalum Capacitors

Weibull grading test is a powerful technique that allows selection and reliability rating of solid tantalum capacitors for military and space applications. However, inaccuracies in the existing method and non-adequate acceleration factors can result in significant, up to three orders of magnitude, errors in the calculated failure rate of capacitors. This paper analyzes deficiencies of the existing technique and recommends more accurate method of calculations. A physical model presenting failures of tantalum capacitors as time-dependent-dielectric-breakdown is used to determine voltage and temperature acceleration factors and select adequate Weibull grading test conditions. This, model is verified by highly accelerated life testing (HALT) at different temperature and voltage conditions for three types of solid chip tantalum capacitors. It is shown that parameters of the model and acceleration factors can be calculated using a general log-linear relationship for the characteristic life with two stress levels

Reliability of High-Voltage Tantalum Capacitors. Parts 3 and 4)

Weibull grading test is a powerful technique that allows selection and reliability rating of solid tantalum capacitors for military and space applications. However, inaccuracies in the existing method and non-adequate acceleration factors can result in significant, up to three orders of magnitude, errors in the calculated failure rate of capacitors. This paper analyzes deficiencies of the existing technique and recommends more accurate method of calculations. A physical model presenting failures of tantalum capacitors as time-dependent-dielectric-breakdown is used to determine voltage and temperature acceleration factors and select adequate Weibull grading test conditions. This model is verified by highly accelerated life testing (HALT) at different temperature and voltage conditions for three types of solid chip tantalum capacitors. It is shown that parameters of the model and acceleration factors can be calculated using a general log-linear relationship for the characteristic life with two stress levels

SCINTILLATION CONDITIONING OF TANTALUM CAPACITORS WITH MANGANESE DIOXIDE CATHODES

Scintillation testing is a method that activates the self-healing mechanism in tantalum capacitors. In preliminary experiments, the deliberate activation of self-healing yielded up to 27% higher breakdown voltages in weak parts that had an increased risk of ignition failure. This improvement results in a better performance under surge current conditions. This paper demonstrates that scintillation conditioning reduces surge current failures in tantalum capacitors with manganese dioxide cathodes. Tantalum capacitors with MnO2 cathodes from two manufacturers are subjected to scintillation conditioning and compared to non-conditioned populations in a surge current test. To ensure that the activation of the self-healing mechanism has no detrimental effect on the reliability of the parts, a life test is conducted. The results show that the conditioning method increases the breakdown voltage of self-healed tantalum capacitors by up to 25% under surge current conditions, which mitigates the risk of ignition failures. No detrimental effect on the life of the conditioned samples was observed. Additional tests to assess the reliability of tantalum capacitors with manganese dioxide cathodes under simultaneous thermo-mechanical and voltage stresses were performed. Even though these tests are not directly related to scintillation conditioning the study was included as an additional chapter, since it pertains to the general subject of tantalum capacitor reliability

Scintillation Breakdowns in Chip Tantalum Capacitors

Scintillations in solid tantalum capacitors are momentarily local breakdowns terminated by a self-healing or conversion to a high-resistive state of the manganese oxide cathode. This conversion effectively caps the defective area of the tantalum pentoxide dielectric and prevents short-circuit failures. Typically, this type of breakdown has no immediate catastrophic consequences and is often considered as nuisance rather than a failure. Scintillation breakdowns likely do not affect failures of parts under surge current conditions, and so-called "proofing" of tantalum chip capacitors, which is a controllable exposure of the part after soldering to voltages slightly higher than the operating voltage to verify that possible scintillations are self-healed, has been shown to improve the quality of the parts. However, no in-depth studies of the effect of scintillations on reliability of tantalum capacitors have been performed so far. KEMET is using scintillation breakdown testing as a tool for assessing process improvements and to compare quality of different manufacturing lots. Nevertheless, the relationship between failures and scintillation breakdowns is not clear, and this test is not considered as suitable for lot acceptance testing. In this work, scintillation breakdowns in different military-graded and commercial tantalum capacitors were characterized and related to the rated voltages and to life test failures. A model for assessment of times to failure, based on distributions of breakdown voltages, and accelerating factors of life testing are discussed

Degradation of Leakage Currents and Reliability Prediction for Tantalum Capacitors

Two types of failures in solid tantalum capacitors, catastrophic and parametric, and their mechanisms are described. Analysis of voltage and temperature reliability acceleration factors reported in literature shows a wide spread of results and requires more investigation. In this work, leakage currents in two types of chip tantalum capacitors were monitored during highly accelerated life testing (HALT) at different temperatures and voltages. Distributions of degradation rates were approximated using a general log-linear Weibull model and yielded voltage acceleration constants B = 9.8 +/- 0.5 and 5.5. The activation energies were Ea = 1.65 eV and 1.42 eV. The model allows for conservative estimations of times to failure and was validated by long-term life test data. Parametric degradation and failures are reversible and can be annealed at high temperatures. The process is attributed to migration of charged oxygen vacancies that reduce the barrier height at the MnO2/Ta2O5 interface and increase injection of electrons from the MnO2 cathode. Analysis showed that the activation energy of the vacancies' migration is ~ 1.1 eV

Long-life mission reliability for outer planet atmospheric entry probes

The results of a literature analysis on the effects of prolonged exposure to deep space environment on the properties of outer planet atmospheric entry probe components are presented. Materials considered included elastomers and plastics, pyrotechnic devices, thermal control components, metal springs and electronic components. The rates of degradation of each component were determined and extrapolation techniques were used to predict the effects of exposure for up to eight years to deep space. Pyrotechnic devices were aged under accelerated conditions to an equivalent of eight years in space and functionally tested. Results of the literature analysis of the selected components and testing of the devices indicated that no severe degradation should be expected during an eight year space mission

Reliability studies on solid tantalum electrolytic capacitors by means of accelerated life tests

The purpose of this thesis is to understand the failure mechanisms in Solid Tantalum Capacitors encapsulated in plastic, and to suggest the precautionary measures that prevent the occurrence of these failures. The reliability of Solid Tantalum Capacitors encapsulated in plastic is of considerable interest because in some applications where the mechanical accelerations or shocks are considerable the better hermitically sealed type are not able to sustain themselves. Poor adherence between the dielectric film and the base metal Tantalum under the conditions of sudden mechanical shocks, causes problems. Our study was carried out in two different directions, theoretical and experimental. The theoretical part is comprehensive review of the work done on Tantalum Capacitors from 1960 to upto date. The experimental part of the study is done by means of accelerated life testing under the conditions of high humidity & high temperature as well as various high temperatures without added humidity

Tantalum Capacitors: New Trends and Old Myths

No abstract availabl

Failure Modes in Capacitors When Tested Under a Time-Varying Stress

Power-on failure has been the prevalent failure mechanism for solid tantalum capacitors in decoupling applications. A surge step stress test (SSST) has been previously applied to identify the critical stress level of a capacitor batch to give some predictability to the power-on failure mechanism [1]. But SSST can also be viewed as an electrically destructive test under a time-varying stress (voltage). It consists of rapidly charging the capacitor with incremental voltage increases, through a low resistance in series, until the capacitor under test is electrically shorted. When the reliability of capacitors is evaluated, a highly accelerated life test (HALT) is usually adopted since it is a time-efficient method of determining the failure mechanism; however, a destructive test under a time-varying stress such as SSST is even more time efficient. It usually takes days or weeks to complete a HALT test, but it only takes minutes for a time-varying stress test to produce failures. The advantage of incorporating a specific time-varying stress profile into a statistical model is significant in providing an alternative life test method for quickly revealing the failure mechanism in capacitors. In this paper, a time-varying stress that mimics a typical SSST has been incorporated into the Weibull model to characterize the failure mechanism in different types of capacitors. The SSST circuit and transient conditions for correctly surge testing capacitors are discussed. Finally, the SSST was applied for testing Ta capacitors, polymer aluminum capacitors (PA capacitors), and multi-layer ceramic (MLC) capacitors with both precious metal electrodes (PME) and base metal electrodes (BME). The test results are found to be directly associated with the dielectric layer breakdown in Ta and PA capacitors and are independent of the capacitor values, the way the capacitors were built, and the capacitors manufacturers. The test results also show that MLC capacitors exhibit surge breakdown voltages much higher than the rated voltage and that the breakdown field is inversely proportional to the dielectric layer thickness. The SSST data can also be used to comparatively evaluate the voltage robustness of capacitors for decoupling applications