Compact Millimeter-Wave Bandpass Filters Using Quasi-Lumped Elements in 0.13-um (Bi)-CMOS Technology for 5G Wireless Systems

© 2019 IEEE.A design methodology for a compact millimeter-wave on-chip bandpass filter (BPF) is presented in this paper. Unlike the previously published works in the literature, the presented method is based on quasi-lumped elements, which consists of a resonator with enhanced self-coupling and metal-insulator-metal capacitors. Thus, this approach provides inherently compact designs comparing with the conventional distributed elements-based ones. To fully understand the insight of the approach, simplified LC-equivalent circuit models are developed. To further demonstrate the feasibility of using this approach in practice, the resonator and two compact BPFs are designed using the presented models. All three designs are fabricated in a standard 0.13- \mu \text{m} (Bi)-CMOS technology. The measured results show that the resonator can generate a notch at 47 GHz with the attenuation better than 28 dB due to the enhanced self-coupling. The chip size, excluding the pads, is only 0.096 \times 0.294 mm 2. In addition, using the resonator for BPF designs, the first BPF has one transmission zero at 58 GHz with a peak attenuation of 23 dB. The center frequency of this filter is 27 GHz with an insertion loss of 2.5 dB, while the return loss is better than 10 dB from 26 to 31 GHz. The second BPF has two transmission zeros, and a minimum insertion loss of 3.5 dB is found at 29 GHz, while the return loss is better than 10 dB from 26 GHz to 34 GHz. Also, more than 20-dB stopband attenuation is achieved from dc to 20.5 GHz and from 48 to 67 GHz. The chip sizes of these two BPFs, excluding the pads, are only 0.076\times 0.296 mm 2 and 0.096\times 0.296 mm 2, respectively.Peer reviewe

Backscatter Transponder Based on Frequency Selective Surface for FMCW Radar Applications

This paper describes an actively-controlled frequency selective surface (FSS) to implement a backscatter transponder. The FSS is composed by dipoles loaded with switching PIN diodes. The transponder exploits the change in the radar cross section (RCS) of the FSS with the bias of the diodes to modulate the backscattered response of the tag to the FMCW radar. The basic operation theory of the system is explained here. An experimental setup based on a commercial X-band FMCW radar working as a reader is proposed to measure the transponders. The transponder response can be distinguished from the interference of non-modulated clutter, modulating the transponder’s RCS. Some FSS with different number of dipoles are studied, as a proof of concept. Experimental results at several distances are provided

Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Low Power Analog Processing for Ultra-High-Speed Receivers with RF Correlation

Ultra-high-speed data communication receivers (Rxs) conventionally require analog digital converters (ADC)s with high sampling rates which have design challenges in terms of adequate resolution and power. This leads to ultra-high-speed Rxs utilising expensive and bulky high-speed oscilloscopes which are extremely inefficient for demodulation, in terms of power and size. Designing energy-efficient mixed-signal and baseband units for ultra-high-speed Rxs requires a paradigm approach detailed in this paper that circumvents the use of power-hungry ADCs by employing low-power analog processing. The low-power analog Rx employs direct-demodulation with RF correlation using low-power comparators. The Rx is able to support multiple modulations with highest modulation of 16-QAM reported so far for direct-demodulation with RF correlation. Simulations using Matlab, Simulink R2020a® indicate sufficient symbol-error rate (SER) performance at a symbol rate of 8 GS/s for the 71 GHz Urban Micro Cell and 140 GHz indoor channels. Power analysis undertaken with current analog, hybrid and digital beamforming approaches requiring ADCs indicates considerable power savings. This novel approach can be adopted for ultra-high-speed Rxs envisaged for beyond fifth generation (B5G)/sixth generation (6G)/ terahertz (THz) communication without the power-hungry ADCs, leading to low-power integrated design solutions

SiGe-based broadband and high suppression frequency doubler ICs for wireless communications

制度:新 ; 報告番号:甲3419号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

Millimeter-Wave Multi-Port Front-End Receivers: Design Considerations and Implementation

This chapter covers recent achievements on the integrated 60 GHz millimeter-wave front-end receiver based on the multi-port (six-port) concept. For this purpose, the design procedure of a fully integrated 60 GHz multi-port (six-port) front-end receiver implemented on a thin ceramic substrate (εr = 9.9, h = 127 μm) using an miniature hybrid microwave integrated circuit (MHMIC) fabrication process is presented in detail. All components constituting the proposed front-end receiver including an 8 × 2 antenna array, a low-noise amplifier (LNA), a six-port circuit, and the RF power detectors are presented and characterized separately before they are integrated into the final front-end receiver prototype. The performance of the latter has been experimentally evaluated in terms of various M-PSK/M-QAM demodulations. The obtained demodulation results are very satisfactory (the constellation points for all considered M-PSK/M-QAM schemes are very close to the ideal locations), demonstrating and confirming the high ability of the proposed 60 GHz millimeter-wave six-port front-end receiver to operate as a high-performance quadrature demodulator, without any calibration, for modulation schemes up to 32 symbols

A 216–256 GHz fully differential frequency multiplier-by-8 chain with 0 dBm output power

Dieser Beitrag ist mit Zustimmung des Rechteinhabers aufgrund einer (DFG geförderten) Allianz- bzw. Nationallizenz frei zugänglich.This publication is with permission of the rights owner freely accessible due to an Alliance licence and a national licence (funded by the DFG, German Research Foundation) respectively.This work presents a fully differential wideband and low power 240 GHz multiplier-by-8 chain, manufactured in IHP's 130 nm SiGe:C BiCMOS technology with fT/fmax = 300/500 GHz. A single ended 30 GHz input signal is multiplied by 8 using Gilbert cell-based quadrupler and doubler, and then amplified with a wideband differential 3-stage cascode amplifier. To achieve wide bandwidth and optimize for power consumption, the power budget has been designed in order to operate the frequency multipliers and the output amplifier in saturation. With this architecture the presented circuit achieves a 3 dB bandwidth of 40 GHz, meaning a relative 3 dB bandwidth of 17%, and a peak saturated output power of 0 dBm. Harmonic rejections better than 25 dB were measured for the 5th, 6th, and 7th harmonics. It dissipates 255 mW from 3 V supply which results in drain efficiency of 0.4%, while occupying 1.2 mm2. With these characteristics the presented circuit suits very well as a frequency multiplier chain for driving balanced mixers in 240 GHz transceivers for radar, communication, and sensing applications.DFG, 255715243, SPP 1857: Elektromagnetische Sensoren für Life Sciences (ESSENCE

A 5G mm-wave compact voltage-controlled oscillator in 0.25 µm pHEMT technology

A 5G mm-wave monolithic microwave integrated circuit (MMIC) voltage-controlled oscillator (VCO) is presented in this paper. It is designed on GaAs substrate and with 0.25 µm-pHEMT technology from UMS foundry and it is based on pHEMT varactors in order to achieve a very small chip size. A 0dBm-output power over the entire tuning range from 27.67 GHz to 28.91 GHz, a phase noise of -96.274 dBc/Hz and -116.24 dBc/Hz at 1 and 10 MHz offset frequency from the carrier respectively are obtained on simulation. A power consumption of 111 mW is obtained for a chip size of 0.268 mm2. According to our knowledge, this circuit occupies the smallest surface area compared to pHEMTs oscillators published in the literature