Design of a tunable multi-band differential LC VCO using 0.35 mu m SiGe BiCMOS technology for multi-standard wireless communication systems

In this paper, an integrated 2.2-5.7GHz multi-band differential LC VCO for multi-standard wireless communication systems was designed utilizing 0.35 mu m SiGe BiCMOS technology. The topology, which combines the switching inductors and capacitors together in the same circuit, is a novel approach for wideband VCOs. Based on the post-layout simulation results, the VCO can be tuned using a DC voltage of 0 to 3.3 V for 5 different frequency bands (2.27-2.51 GHz, 2.48-2.78 GHz, 3.22-3.53 GHz, 3.48-3.91 GHz and 4.528-5.7 GHz) with a maximum bandwidth of 1.36 GHz and a minimum bandwidth of 300 MHz. The designed and simulated VCO can generate a differential output power between 0.992 and -6.087 dBm with an average power consumption of 44.21 mW including the buffers. The average second and third harmonics level were obtained as -37.21 and -47.6 dBm, respectively. The phase noise between -110.45 and -122.5 dBc/Hz, that was simulated at 1 MHz offset, can be obtained through the frequency of interest. Additionally, the figure of merit (FOM), that includes all important parameters such as the phase noise, the power consumption and the ratio of the operating frequency to the offset frequency, is between -176.48 and -181.16 and comparable or better than the ones with the other current VCOs. The main advantage of this study in comparison with the other VCOs, is covering 5 frequency bands starting from 2.27 up to 5.76 GHz without FOM and area abandonment. Output power of the fundamental frequency changes between -6.087 and 0.992 dBm, depending on the bias conditions (operating bands). Based on the post-layout simulation results, the core VCO circuit draws a current between 2.4-6.3 mA and between 11.4 and 15.3 mA with the buffer circuit from 3.3 V supply. The circuit occupies an area of 1.477 mm(2) on Si substrate, including DC, digital and RF pads

Analysis of the high frequency substrate noise effects on LC-VCOs

La integració de transceptors per comunicacions de radiofreqüència en CMOS pot quedar seriosament limitada per la interacció entre els seus blocs, arribant a desaconsellar la utilització de un únic dau de silici. El soroll d’alta freqüència generat per certs blocs, com l’amplificador de potencia, pot viatjar pel substrat i amenaçar el correcte funcionament de l’oscil·lador local. Trobem tres raons importants que mostren aquest risc d’interacció entre blocs i que justifiquen la necessitat d’un estudi profund per minimitzar-lo. Les característiques del substrat fan que el soroll d’alta freqüència es propagui m’és fàcilment que el de baixa freqüència. Per altra banda, les estructures de protecció perden eficiència a mesura que la freqüència augmenta. Finalment, el soroll d’alta freqüència que arriba a l’oscil·lador degrada al seu correcte comportament. El propòsit d’aquesta tesis és analitzar en profunditat la interacció entre el soroll d’alta freqüència que es propaga pel substrat i l’oscil·lador amb l’objectiu de poder predir, mitjançant un model, l’efecte que aquest soroll pot tenir sobre el correcte funcionament de l’oscil·lador. Es volen proporcionar diverses guies i normes a seguir que permeti als dissenyadors augmentar la robustesa dels oscil·ladors al soroll d’alta freqüència que viatja pel substrat. La investigació de l’efecte del soroll de substrat en oscil·ladors s’ha iniciat des d’un punt de vista empíric, per una banda, analitzant la propagació de senyals a través del substrat i avaluant l’eficiència d’estructures per bloquejar aquesta propagació, i per altra, determinant l’efecte d’un to present en el substrat en un oscil·lador. Aquesta investigació ha mostrat que la injecció d’un to d’alta freqüència en el substrat es pot propagar fins arribar a l’oscil·lador i que, a causa del ’pulling’ de freqüència, pot modular en freqüència la sortida de l’oscil·lador. A partir dels resultats de l’anàlisi empíric s’ha aportat un model matemàtic que permet predir l’efecte del soroll en l’oscil·lador. Aquest model té el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem. el principal avantatge en el fet de que està basat en paràmetres físics de l’oscil·lador o del soroll, permetent determinar les mesures que un dissenyador pot prendre per augmentar la robustesa de l’oscil·lador així com les conseqüències que aquestes mesures tenen sobre el seu funcionament global (trade-offs). El model ha estat comparat tant amb simulacions com amb mesures reals demostrant ser molt precís a l’hora de predir l’efecte del soroll de substrat. La utilitat del model com a eina de disseny s’ha demostrat en dos estudis. Primerament, les conclusions del model han estat aplicades en el procés de disseny d’un oscil·lador d’ultra baix consum a 2.5GHz, aconseguint un oscil·lador robust al soroll de substrat d’alta freqüència i amb característiques totalment compatibles amb els principals estàndards de comunicació en aquesta banda. Finalment, el model s’ha utilitzat com a eina d’anàlisi per avaluar la causa de les diferències, en termes de robustesa a soroll de substrat, mesurades en dos oscil·ladors a 60GHz amb dues diferents estratègies d’apantallament de l’inductor del tanc de ressonant, flotant en un cas i connectat a terra en l’altre. El model ha mostrat que les diferències en robustesa són causades per la millora en el factor de qualitat i en l’amplitud d’oscil·lació i no per un augment en l’aïllament entre tanc i substrat. Per altra banda, el model ha demostrat ser vàlid i molt precís inclús en aquest rang de freqüència tan extrem.The integration of transceivers for RF communication in CMOS can be seriously limited by the interaction between their blocks, even advising against using a single silicon die. The high frequency noise generated by some of the blocks, like the power amplifier, can travel through the substrate, reaching the local oscillator and threatening its correct performance. Three important reasons can be stated that show the risk of the single die integration. Noise propagation is easier the higher the frequency. Moreover, the protection structures lose efficiency as the noise frequency increases. Finally, the high frequency noise that reaches the local oscillator degrades its performance. The purpose of this thesis is to deeply analyze the interaction between the high frequency substrate noise and the oscillator with the objective of being able to predict, thanks to a model, the effect that this noise may have over the correct behavior of the oscillator. We want to provide some guidelines to the designers to allow them to increase the robustness of the oscillator to high frequency substrate noise. The investigation of the effect of the high frequency substrate noise on oscillators has started from an empirical point of view, on one hand, analyzing the noise propagation through the substrate and evaluating the efficiency of some structures to block this propagation, and on the other hand, determining the effect on an oscillator of a high frequency noise tone present in the substrate. This investigation has shown that the injection of a high frequency tone in the substrate can reach the oscillator and, due to a frequency pulling effect, it can modulate in frequency the output of the oscillator. Based on the results obtained during the empirical analysis, a mathematical model to predict the effect of the substrate noise on the oscillator has been provided. The main advantage of this model is the fact that it is based on physical parameters of the oscillator and of the noise, allowing to determine the measures that a designer can take to increase the robustness of the oscillator as well as the consequences (trade-offs) that these measures have over its global performance. This model has been compared against both, simulations and real measurements, showing a very high accuracy to predict the effect of the high frequency substrate noise. The usefulness of the presented model as a design tool has been demonstrated in two case studies. Firstly, the conclusions obtained from the model have been applied in the design of an ultra low power consumption 2.5 GHz oscillator robust to the high frequency substrate noise with characteristics which make it compatible with the main communication standards in this frequency band. Finally, the model has been used as an analysis tool to evaluate the cause of the differences, in terms of performance degradation due to substrate noise, measured in two 60 GHz oscillators with two different tank inductor shielding strategies, floating and grounded. The model has determined that the robustness differences are caused by the improvement in the tank quality factor and in the oscillation amplitude and no by an increased isolation between the tank and the substrate. The model has shown to be valid and very accurate even in these extreme frequency range.Postprint (published version

Microwave CMOS VCOs and Front-Ends - using integrated passives on-chip and on-carrier

The increasing demand for high data rates in wireless communication systems is increasing the requirements on the transceiver front-ends, as they are pushed to utilize more and wider bands at higher frequencies. The work in this thesis is focused on receiver front-ends composed of Low Noise Amplifiers (LNAs), Mixers, and Voltage Controlled Oscillators (VCOs) operating at microwave frequencies. Traditionally, microwave electronics has used exclusive and more expensive semiconductor technologies (III-V materials). However, the rapid development of consumer electronics (e.g. video game consoles) the last decade has pushed the silicon CMOS IC technology towards even smaller feature sizes. This has resulted in high speed transistors (high fT and fmax) with low noise figures. However, as the breakdown voltages have decreased, a lower supply voltage must be used, which has had a negative impact on linearity and dynamic range. Nonetheless, todays downscaled CMOS technology is a feasible alternative for many microwave and even millimeter wave applications. The low quality factor (Q) of passive components on-chip usually limits the high frequency performance. For inductors realized in a standard CMOS process the substrate coupling results in a degraded Q. The quality factor can, however, be improved by moving the passive components off-chip and integrating them on a low loss carrier. This thesis therefore features microwave front-end and VCO designs in CMOS, where some designs have been flip-chip mounted on carriers featuring high Q inductors and low loss baluns. The thesis starts with an introduction to wireless communication, receiver architectures, front-end receiver blocks, and low loss carrier technology, followed by the included papers. The six included papers show the capability of CMOS and carrier technology at microwave frequencies: Papers II, III, and VI demonstrate fully integrated CMOS circuit designs. An LC-VCO using an accumulation mode varactor is presented in Paper II, a QVCO using 4-bit switched tuning is shown in Paper III, and a quadrature receiver front-end (including QVCO) is demonstrated in paper VI. Papers I and IV demonstrate receiver front-ends using low loss baluns on carrier for the LO and RF signals. Paper IV also includes a front-end using single-ended RF input which is converted to differential form in a novel merged LNA and balun. A VCO demonstrating the benefits of a high Q inductor on carrier is presented in Paper V

RF CMOS quadrature voltage-controlled oscillator design using superharmonic coupling method.

Chung, Wai Fung.Thesis (M.Phil.)--Chinese University of Hong Kong, 2007.Includes bibliographical references (leaves 98-100).Abstracts in English and Chinese.摘要 --- p.IIIACKNOWLEDGEMENT --- p.IVCONTENTS --- p.VLIST OF FIGURES --- p.VIIILIST OF TABLES --- p.XLIST OF TABLES --- p.XChapter CHAPTER 1 --- INTRODUCTION --- p.1Chapter 1.1 --- Motivation --- p.1Chapter 1.2 --- Receiver Architecture --- p.3Chapter 1.2.1 --- Zero-IF Receivers --- p.4Chapter 1.2.2 --- Low-IF Receivers --- p.6Chapter 1.2.2.1 --- Hartley Architecture --- p.7Chapter 1.2.2.2 --- Weaver Architecture --- p.9Chapter 1.3 --- Image-rejection ratio --- p.10Chapter 1.4 --- Thesis Organization --- p.12Chapter CHAPTER 2 --- FUNDAMENTALS OF OSCILLATOR --- p.13Chapter 2.1 --- Basic Oscillator Theory --- p.13Chapter 2.2 --- Varactor --- p.15Chapter 2.3 --- Inductor --- p.17Chapter 2.4 --- Phase noise --- p.22Chapter 2.4.1 --- The Leeson ´ةs phase noise expression --- p.24Chapter 2.4.2 --- Linear model --- p.25Chapter 2.4.3 --- Linear Time-Variant phase noise model --- p.28Chapter CHAPTER 3 --- FULLY-INTEGRATED CMOS OSCILLATOR DESIGN --- p.31Chapter 3.1 --- Ring oscillator --- p.31Chapter 3.2 --- LC oscillator --- p.33Chapter 3.2.1 --- LC-tank resonator --- p.34Chapter 3.2.2 --- Negative transconductance --- p.36Chapter 3.3 --- Generation of quadrature phase signals --- p.39Chapter 3.4 --- Quadrature VCO topologies --- p.41Chapter 3.4.1 --- Parallel-coupled QVCO --- p.41Chapter 3.4.2 --- Series-coupled QVCO --- p.46Chapter 3.4.3 --- QVCO with Back-gate Coupling --- p.47Chapter 3.4.4 --- QVCO using superharmonic coupling --- p.49Chapter 3.5 --- Novel QVCO using back-gate superharmonic coupling --- p.52Chapter 3.5.1 --- Tuning range --- p.54Chapter 3.5.2 --- Negative gm --- p.55Chapter 3.5.3 --- Phase noise calculation --- p.56Chapter 3.5.4 --- Coupling coefficient --- p.57Chapter 3.5.5 --- Low-voltage and low-power design --- p.59Chapter 3.5.6 --- Layout Consideration --- p.61Chapter 3.5.6.1 --- Symmetrical Layout and parasitics --- p.61Chapter 3.5.6.2 --- Metal width and number of vias --- p.63Chapter 3.5.6.3 --- Substrate contact and guard ring --- p.63Chapter 3.5.7 --- Simulation Results --- p.65Chapter 3.5.7.1 --- Frequency and output power --- p.65Chapter 3.5.7.2 --- Quadrature signal generation --- p.67Chapter 3.5.7.3 --- Tuning range --- p.67Chapter 3.5.7.4 --- Power consumption --- p.68Chapter 3.5.7.5 --- Phase noise --- p.69Chapter 3.6 --- Polyphase filter and Single-sideband mixer design --- p.70Chapter 3.6.1 --- Polyphase filter --- p.72Chapter 3.6.2 --- Layout Consideration --- p.74Chapter 3.6.3 --- Simulation results --- p.76Chapter 3.7 --- Comparison with parallel-coupled QVCO --- p.78Chapter CHAPTER 4 --- EXPERIMENTAL RESULTS --- p.80Chapter 4.1 --- Test Fixture --- p.82Chapter 4.2 --- Measurement set-up --- p.84Chapter 4.3 --- Measurement results --- p.86Chapter 4.3.1 --- Proposed QVCO using back-gate superharmonic coupling --- p.86Chapter 4.3.1.1 --- Output Spectrum --- p.86Chapter 4.3.1.2 --- Tuning range --- p.87Chapter 4.3.1.3 --- Phase noise --- p.88Chapter 4.3.1.4 --- Power consumption --- p.88Chapter 4.3.1.5 --- Image-rejection ratio --- p.89Chapter 4.3.2 --- Parallel-coupled QVCO --- p.90Chapter 4.3.2.1 --- Output spectrum --- p.90Chapter 4.3.2.2 --- Power consumption --- p.90Chapter 4.3.2.3 --- Tuning range --- p.91Chapter 4.3.2.4 --- Phase noise --- p.92Chapter 4.3.3 --- Comparison between proposed and parallel-coupled QVCO --- p.93Chapter CHAPTER 5 --- CONCLUSIONS --- p.95Chapter 5.1 --- Conclusions --- p.95Chapter 5.2 --- Future work --- p.97REFERENCES --- p.9