2,349 research outputs found

    Investigation of FACTS devices to improve power quality in distribution networks

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    Flexible AC transmission system (FACTS) technologies are power electronic solutions that improve power transmission through enhanced power transfer volume and stability, and resolve quality and reliability issues in distribution networks carrying sensitive equipment and non-linear loads. The use of FACTS in distribution systems is still in its infancy. Voltages and power ratings in distribution networks are at a level where realistic FACTS devices can be deployed. Efficient power converters and therefore loss minimisation are crucial prerequisites for deployment of FACTS devices. This thesis investigates high power semiconductor device losses in detail. Analytical closed form equations are developed for conduction loss in power devices as a function of device ratings and operating conditions. These formulae have been shown to predict losses very accurately, in line with manufacturer data. The developed formulae enable circuit designers to quickly estimate circuit losses and determine the sensitivity of those losses to device voltage and current ratings, and thus select the optimal semiconductor device for a specific application. It is shown that in the case of majority carrier devices (such as power MOSFETs), the conduction power loss (at rated current) increases linearly in relation to the varying rated current (at constant blocking voltage), but is a square root of the variable blocking voltage when rated current is fixed. For minority carrier devices (such as a pin diode or IGBT), a similar relationship is observed for varying current, however where the blocking voltage is altered, power losses are derived as a square root with an offset (from the origin). Finally, this thesis conducts a power loss-oriented evaluation of cascade type multilevel converters suited to reactive power compensation in 11kV and 33kV systems. The cascade cell converter is constructed from a series arrangement of cell modules. Two prospective structures of cascade type converters were compared as a case study: the traditional type which uses equal-sized cells in its chain, and a second with a ternary relationship between its dc-link voltages. Modelling (at 81 and 27 levels) was carried out under steady state conditions, with simplified models based on the switching function and using standard circuit simulators. A detailed survey of non punch through (NPT) and punch through (PT) IGBTs was completed for the purpose of designing the two cascaded converters. Results show that conduction losses are dominant in both types of converters in NPT and PT IGBTs for 11kV and 33kV systems. The equal-sized converter is only likely to be useful in one case (27-levels in the 33kV system). The ternary-sequence converter produces lower losses in all other cases, and this is especially noticeable for the 81-level converter operating in an 11kV network

    Reduced junction temperature control during low-voltage ride-through for single-phase photovoltaic inverters

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    Evaluation of IGBT thermo-sensitive electrical parameters under different dissipation conditions – Comparison with infrared measurements

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    Junction temperature evaluation is a key parameter used to control a power module assembly. But measuring the junction temperature by thermo-sensitive electrical parameters (TSEPs) does not reveal the actual temperature of the semiconductor device. In this paper, a specific electronic board used to compare four common TSEPs of IGBT chips is presented. For this comparison, two dissipation modes are used: dissipation in active and saturation regions. In order to have referential measurements we carried out surface temperature measurements of IGBT chips with an infrared (IR) camera. A dedicated numerical tool is presented to estimate the mean surface temperature of active region. In the case of a single IGBT chip, the comparison between IR and TSEP measurements show that the best studied parameter (in terms of robustness and usability) is the gate emitter voltage

    Mjerenje radne temperature IGBT-a u stvarnom vremenu

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    Temperature management and control are among the most critical functions in power electronic devices. Knowledge of power semiconductor’s operating temperature is important for circuit design, as well as for converter control. Virtual junction temperature measurement or estimation is not an easy task, therefore designing the appropriate circuitry for virtual junction temperature in the real operating conditions not affecting regular circuit operation is a demanding task for engineers. The proposed method enables virtual junction temperature estimation based on the real-time measurement of semiconductor’s quasi-threshold voltage using dedicated modified gate driver circuit.Upravljanje temperaturom je jedna od najkritičnijih funkcija kod učinskih poluvodičkih komponenata. Poznavanje radne temperature učinske poluvodičke sklopke vrlo je važno pri projektiranju sklopa, kao i za upravljanje učinskim pretvaračem. Mjerenje ili estimacija nadomjesne temperature silicija nije lagan zadatak, stoga je projektiranje odgovarajućeg sklopovlja za određivanje nadomjesne temperature silicija u stvarnim radnim uvjetima, koje ne utječe na normalan rad sklopa, vrlo zahtjevan inženjerski zadatak. Predložena metoda omogućava određivanje nadomjesne temperature silicija utemeljeno na mjerenju kvazi-napona praga u stvarnom vremenu pomoću posebno prilagođenog pobudnog stupnja IGBT-a

    Lifetime-Oriented Droop Control Strategy for AC Islanded Microgrids

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    Application of Kalman filter to estimate junction temperature in IGBT power modules

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    Knowledge of instantaneous junction temperature is essential for effective health management of power converters, enabling safe operation of the power semiconductors under all operating conditions. Methods based on fixed thermal models are typically unable to compensate for degradation of the thermal path resulting from aging and the effect of variable cooling conditions. Thermosensitive electrical parameters (TSEPs), on the other hand, can give an estimate of junction temperature TJ, but measurement inaccuracies and the masking effect of varying operating conditions can corrupt the estimate. This paper presents a robust and noninvasive real-time estimate of junction temperature that can provide enhanced accuracy under all operating and cooling conditions when compared to model-based or TSEP-based methods alone. The proposed method uses a Kalman filter to fuse the advantages of model-based estimates and an online measurement of TSEPs. Junction temperature measurements are obtained from an online measurement of the on-state voltage, VCE(ON) , at high current and processed by a Kalman filter, which implements a predict-correct mechanism to generate an adaptive estimate of TJ. It is shown that the residual signal from the Kalman filter may be used to detect changes in thermal model parameters, thus allowing the assessment of thermal path degradation. The algorithm is implemented on a full-bridge inverter and the results verified with an IR camer

    Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

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    The measurement of the junction temperature with thermo-sensitive electrical parameters (TSEPs) is largely used by electrical engineers or researchers but the obtained temperature value is generally not verified by any referential information of the actual chip temperature distribution. In this paper, we propose to use infrared (IR) measurements in order to evaluate the relevance of three commonly used TSEPs with IGBT chips: the saturation voltage under a low current, the gate-emitter voltage and the saturation current. The IR measurements are presented in details with an estimation of the emissivity of the black paint deposited on the power module. The temperatures obtained with IR measurements and with the different TSEPs are then compared in two cases: the use of only one chip and the use of two paralleled chips

    Health Condition Monitoring and Fault-Tolerant Operation of Adjustable Speed Drives

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    Adjustable speed drives (ASDs) have been extensively used in industrial applications over the past few decades because of their benefits of energy saving and control flexibilities. However, the wider penetration of ASD systems into industrial applications is hindered by the lack of health monitoring and fault-tolerant operation techniques, especially in safety-critical applications. In this dissertation, a comprehensive portfolio of health condition monitoring and fault-tolerant operation strategies is developed and implemented for multilevel neutral-point-clamped (NPC) power converters in ASDs. Simulations and experiments show that these techniques can improve power cycling lifetime of power transistors, on-line diagnosis of switch faults, and fault-tolerant capabilities.The first contribution of this dissertation is the development of a lifetime improvement Pulse Width Modulation (PWM) method which can significantly extend the power cycling lifetime of Insulated Gate Bipolar Transistors (IGBTs) in NPC inverters operating at low frequencies. This PWM method is achieved by injecting a zero-sequence signal with a frequency higher than that of the IGBT junction-to-case thermal time constants. This, in turn, lowers IGBT junction temperatures at low output frequencies. Thermal models, simulation and experimental verifications are carried out to confirm the effectiveness of this PWM method. As a second contribution of this dissertation, a novel on-line diagnostic method is developed for electronic switch faults in power converters. Targeted at three-level NPC converters, this diagnostic method can diagnose any IGBT faults by utilizing the information on the dc-bus neutral-point current and switching states. This diagnostic method only requires one additional current sensor for sensing the neutral-point current. Simulation and experimental results verified the efficacy of this diagnostic method.The third contribution consists of the development and implementation of a fault-tolerant topology for T-Type NPC power converters. In this fault-tolerant topology, one additional phase leg is added to the original T-Type NPC converter. In addition to providing a fault-tolerant solution to certain switch faults in the converter, this fault-tolerant topology can share the overload current with the original phase legs, thus increasing the overload capabilities of the power converters. A lab-scale 30-kVA ASD based on this proposed topology is implemented and the experimental results verified its benefits

    Prognostics and health management of power electronics

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    Prognostics and health management (PHM) is a major tool enabling systems to evaluate their reliability in real-time operation. Despite ground-breaking advances in most engineering and scientific disciplines during the past decades, reliability engineering has not seen significant breakthroughs or noticeable advances. Therefore, self-awareness of the embedded system is also often required in the sense that the system should be able to assess its own health state and failure records, and those of its main components, and take action appropriately. This thesis presents a radically new prognostics approach to reliable system design that will revolutionise complex power electronic systems with robust prognostics capability enhanced Insulated Gate Bipolar Transistors (IGBT) in applications where reliability is significantly challenging and critical. The IGBT is considered as one of the components that is mainly damaged in converters and experiences a number of failure mechanisms, such as bond wire lift off, die attached solder crack, loose gate control voltage, etc. The resulting effects mentioned are complex. For instance, solder crack growth results in increasing the IGBT’s thermal junction which becomes a source of heat turns to wire bond lift off. As a result, the indication of this failure can be seen often in increasing on-state resistance relating to the voltage drop between on-state collector-emitter. On the other hand, hot carrier injection is increased due to electrical stress. Additionally, IGBTs are components that mainly work under high stress, temperature and power consumptions due to the higher range of load that these devices need to switch. This accelerates the degradation mechanism in the power switches in discrete fashion till reaches failure state which fail after several hundred cycles. To this end, exploiting failure mechanism knowledge of IGBTs and identifying failure parameter indication are background information of developing failure model and prognostics algorithm to calculate remaining useful life (RUL) along with ±10% confidence bounds. A number of various prognostics models have been developed for forecasting time to failure of IGBTs and the performance of the presented estimation models has been evaluated based on two different evaluation metrics. The results show significant improvement in health monitoring capability for power switches.Furthermore, the reliability of the power switch was calculated and conducted to fully describe health state of the converter and reconfigure the control parameter using adaptive algorithm under degradation and load mission limitation. As a result, the life expectancy of devices has been increased. These all allow condition-monitoring facilities to minimise stress levels and predict future failure which greatly reduces the likelihood of power switch failures in the first place
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