A Power-Efficient 3-D On-Chip Interconnect for Multi-Core Accelerators with Stacked L2 Cache

The use of multi-core clusters is a promising option for data-intensive embedded applications such as multi-modal sensor fusion, image understanding, mobile augmented reality. In this paper, we propose a power-efficient 3-D on-chip interconnect for multi-core clusters with stacked L2 cache memory. A new switch design makes a circuit-switched Mesh-of-Tree (MoT) interconnect reconfigurable to support power-gating of processing cores, memory blocks, and unnecessary interconnect resources (routing switch, arbitration switch, inverters placed along the on-chip wires). The proposed 3-D MoT improves the power efficiency up to 77% in terms of energy-delay product (EDP)

Cost-Effective Design of Mesh-of-Tree Interconnect for Multi-Core Clusters with 3-D Stacked L2 Scratchpad Memory

3-D integrated circuits (3-D ICs) offer a promising solution to overcome the scaling limitations of 2-D ICs. However, using too many through-silicon-vias (TSVs) pose a negative impact on 3-D ICs due to the large overhead of TSV (e.g., large footprint and low yield). In this paper, we propose a new TSV sharing method for a circuit-switched 3-D mesh-of-tree (MoT) interconnect, which supports high-throughput and low-latency communication between processing cores and 3-D stacked multibanked L2 scratchpad memory. The proposed method supports traffic balancing and TSV-failure tolerant routing. The proposed method advocates a modular design strategy to allow stacking multiple identical memory dies without the need for different masks for dies at different levels in the memory stack. We also investigate various parameters of 3-D memory stacking (e.g., fabrication technology, TSV bonding technique, number of memory tiers, and TSV sharing scheme) that affect interconnect latency, system performance, and fabrication cost. Compared to conventional MoT interconnect that is straightforwardly adapted to 3-D integration, the proposed method yields up to (times 2.11) and (times 1.11) improvements in terms of cost efficiency (i.e., performance/cost) for microbump TSV bonding and direct Cu–Cu TSV bonding techniques, respectively

Piattaforme multicore e integrazione tri-dimensionale: analisi architetturale e ottimizzazione

Modern embedded systems embrace many-core shared-memory designs. Due to constrained power and area budgets, most of them feature software-managed scratchpad memories instead of data caches to increase the data locality. It is therefore programmers’ responsibility to explicitly manage the memory transfers, and this make programming these platform cumbersome. Moreover, complex modern applications must be adequately parallelized before they can the parallel potential of the platform into actual performance. To support this, programming languages were proposed, which work at a high level of abstraction, and rely on a runtime whose cost hinders performance, especially in embedded systems, where resources and power budget are constrained. This dissertation explores the applicability of the shared-memory paradigm on modern many-core systems, focusing on the ease-of-programming. It focuses on OpenMP, the de-facto standard for shared memory programming. In a first part, the cost of algorithms for synchronization and data partitioning are analyzed, and they are adapted to modern embedded many-cores. Then, the original design of an OpenMP runtime library is presented, which supports complex forms of parallelism such as multi-level and irregular parallelism. In the second part of the thesis, the focus is on heterogeneous systems, where hardware accelerators are coupled to (many-)cores to implement key functional kernels with orders-of-magnitude of speedup and energy efficiency compared to the “pure software” version. However, three main issues rise, namely i) platform design complexity, ii) architectural scalability and iii) programmability. To tackle them, a template for a generic hardware processing unit (HWPU) is proposed, which share the memory banks with cores, and the template for a scalable architecture is shown, which integrates them through the shared-memory system. Then, a full software stack and toolchain are developed to support platform design and to let programmers exploiting the accelerators of the platform. The OpenMP frontend is extended to interact with it.I sistemi integrati moderni sono architetture many-core, in cui spesso lo spazio di memoria è condiviso fra i processori. Per ridurre i consumi, molte di queste architetture sostituiscono le cache dati con memorie scratchpad gestite in software, per massimizzarne la località alle CPU e aumentare le performance. Questo significa che i dati devono essere spostati manualmente da parte del programmatore. Inoltre, tradurre in perfomance l’enorme parallelismo potenziale delle piattaforme many-core non è semplice. Per supportare la programmazione, diversi programming model sono stati proposti, e siccome lavorano ad un alto livello di astrazione, sfruttano delle librerie di runtime che forniscono servizi di base quali sincronizzazione, allocazione della memoria, threading. Queste librerie hanno un costo, che nei sistemi integrati è troppo elevato e ostacola il raggiungimento delle piene performance. Questa tesi analizza come un programming model ad alto livello di astrazione – OpenMP – possa essere efficientemente supportato, se il suo stack software viene adattato per sfruttare al meglio la piattaforma sottostante. In una prima parte, studio diversi meccanismi di sincronizzazione e comunicazione fra thread paralleli, portati sulle piattaforme many-core. In seguito, li utilizzo per scrivere un runtime di supporto a OpenMP che sia il più possibile efficente e “leggero” e che supporti paradigmi di parallelismo multi-livello e irregolare, spesso presenti nelle applicazioni moderne. Una seconda parte della tesi esplora le architetture eterogenee, ossia con acceleratori hardware. Queste architetture soffrono di problematiche sia i) per il processo di design della piattaforma, che ii) di scalabilità della piattaforma stessa (aumento del numero degli acceleratori e dei processori), che iii) di programmabilità. La tesi propone delle soluzioni a tutti e tre i problemi. Il linguaggio di programmazione usato è OpenMP, sia per la sua grande espressività a livello semantico, sia perché è lo standard de-facto per programmare sistemi a memoria condivisa

Memory Hierarchy Design for Next Generation Scalable Many-core Platforms

Performance and energy consumption in modern computing platforms is largely dominated by the memory hierarchy. The increasing computational power in the multiprocessors and accelerators, and the emergence of the data-intensive workloads (e.g. large-scale graph traversal and scientific algorithms) requiring fast transfer of large volumes of data, are two main trends which intensify this problem by putting even higher pressure on the memory hierarchy. This increasing gap between computation speed and data transfer speed is commonly referred as the “memory wall” problem. With the emergence of heterogeneous Three Dimensional (3D) Integration based on through-silicon-vias (TSV), this situation has started to recover in the past years. On one hand, it is now possible to improve memory access bandwidth and/or latency by either stacking memories directly on top of processors or through abstracted memory interfaces such as Micron’s Hybrid Memory Cube (HMC). On the other hand, near memory computation has become worthy of revisiting due to the cost-effective integration of logic and memory in 3D stacks. These two directions bring about several interesting opportunities including performance improvement, energy and cost reduction, product miniaturization, and modular design for improved time to market. In this research, we study the effectiveness of the 3D integration technology and the optimization opportunities which it can provide in the different layers of the memory hierarchy in cluster-based many-core platforms ranging from intra-cluster L1 to inter-cluster L2 scratchpad memories (SPMs), as well as the main memory. In addition, by moving a part of the computation to where data resides, in the 3D-stacked memory context, we demonstrate further energy and performance improvement opportunities

Automated Hardware Prototyping for 3D Network on Chips

Vor mehr als 50 Jahren stellte Intel® Mitbegründer Gordon Moore eine Prognose zum Entwicklungsprozess der Transistortechnologie auf. Er prognostizierte, dass sich die Zahl der Transistoren in integrierten Schaltungen alle zwei Jahre verdoppeln wird. Seine Aussage ist immer noch gültig, aber ein Ende von Moores Gesetz ist in Sicht. Mit dem Ende von Moore’s Gesetz müssen neue Aspekte untersucht werden, um weiterhin die Leistung von integrierten Schaltungen zu steigern. Zwei mögliche Ansätze für "More than Moore” sind 3D-Integrationsverfahren und heterogene Systeme. Gleichzeitig entwickelt sich ein Trend hin zu Multi-Core Prozessoren, basierend auf Networks on chips (NoCs). Neben dem Ende des Mooreschen Gesetzes ergeben sich bei immer kleiner werdenden Technologiegrößen, vor allem jenseits der 60 nm, neue Herausforderungen. Eine Schwierigkeit ist die Wärmeableitung in großskalierten integrierten Schaltkreisen und die daraus resultierende Überhitzung des Chips. Um diesem Problem in modernen Multi-Core Architekturen zu begegnen, muss auch die Verlustleistung der Netzwerkressourcen stark reduziert werden. Diese Arbeit umfasst eine durch Hardware gesteuerte Kombination aus Frequenzskalierung und Power Gating für 3D On-Chip Netzwerke, einschließlich eines FPGA Prototypen. Dafür wurde ein Takt-synchrones 2D Netzwerk auf ein dreidimensionales asynchrones Netzwerk mit mehreren Frequenzbereichen erweitert. Zusätzlich wurde ein skalierbares Online-Power-Management System mit geringem Ressourcenaufwand entwickelt. Die Verifikation neuer Hardwarekomponenten ist einer der zeitaufwendigsten Schritte im Entwicklungsprozess hochintegrierter digitaler Schaltkreise. Um diese Aufgabe zu beschleunigen und um eine parallele Softwareentwicklung zu ermöglichen, wurde im Rahmen dieser Arbeit ein automatisiertes und benutzerfreundliches Tool für den Entwurf neuer Hardware Projekte entwickelt. Eine grafische Benutzeroberfläche zum Erstellen des gesamten Designablaufs, vom Erstellen der Architektur, Parameter Deklaration, Simulation, Synthese und Test ist Teil dieses Werkzeugs. Zudem stellt die Größe der Architektur für die Erstellung eines Prototypen eine besondere Herausforderung dar. Frühere Arbeiten haben es versäumt, eine schnelles und unkompliziertes Prototyping, insbesondere von Architekturen mit mehr als 50 Prozessorkernen, zu realisieren. Diese Arbeit umfasst eine Design Space Exploration und FPGA-basierte Prototypen von verschiedenen 3D-NoC Implementierungen mit mehr als 80 Prozessoren

Parallel Architectures for Many-Core Systems-On-Chip in Deep Sub-Micron Technology

Despite the several issues faced in the past, the evolutionary trend of silicon has kept its constant pace. Today an ever increasing number of cores is integrated onto the same die. Unfortunately, the extraordinary performance achievable by the many-core paradigm is limited by several factors. Memory bandwidth limitation, combined with inefficient synchronization mechanisms, can severely overcome the potential computation capabilities. Moreover, the huge HW/SW design space requires accurate and flexible tools to perform architectural explorations and validation of design choices. In this thesis we focus on the aforementioned aspects: a flexible and accurate Virtual Platform has been developed, targeting a reference many-core architecture. Such tool has been used to perform architectural explorations, focusing on instruction caching architecture and hybrid HW/SW synchronization mechanism. Beside architectural implications, another issue of embedded systems is considered: energy efficiency. Near Threshold Computing is a key research area in the Ultra-Low-Power domain, as it promises a tenfold improvement in energy efficiency compared to super-threshold operation and it mitigates thermal bottlenecks. The physical implications of modern deep sub-micron technology are severely limiting performance and reliability of modern designs. Reliability becomes a major obstacle when operating in NTC, especially memory operation becomes unreliable and can compromise system correctness. In the present work a novel hybrid memory architecture is devised to overcome reliability issues and at the same time improve energy efficiency by means of aggressive voltage scaling when allowed by workload requirements. Variability is another great drawback of near-threshold operation. The greatly increased sensitivity to threshold voltage variations in today a major concern for electronic devices. We introduce a variation-tolerant extension of the baseline many-core architecture. By means of micro-architectural knobs and a lightweight runtime control unit, the baseline architecture becomes dynamically tolerant to variations

Multicore architecture optimizations for HPC applications

From single-core CPUs to detachable compute accelerators, supercomputers made a tremendous progress by using available transistors on chip and specializing hardware for a given type of computation. Today, compute nodes used in HPC employ multi-core CPUs tailored for serial execution and multiple accelerators (many-core devices or GPUs) for throughput computing. However, designing next-generation HPC system requires not only the performance improvement but also better energy efficiency. Current trend of reaching exascale level of computation asks for at least an order of magnitude increase in both of these metrics. This thesis explores HPC-specific optimizations in order to make better utilization of the available transistors and to improve performance by transparently executing parallel code across multiple GPU accelerators. First, we analyze several HPC benchmark suites, compare them against typical desktop applications, and identify the differences which advocate for proper core tailoring. Moreover, within the HPC applications, we evaluate serial and parallel code sections separately, resulting in an Asymmetric Chip Multiprocessor (ACMP) design with one core optimized for single-thread performance and many lean cores for parallel execution. Our results presented here suggests downsizing of core front-end structures providing an HPC-tailored lean core which saves 16% of the core area and 7% of power, without performance loss. Further improving an ACMP design, we identify that multiple lean cores run the same code during parallel regions. This motivated us to evaluate the idea where lean cores share the I-cache with the intent of benefiting from mutual prefetching, without increasing the average access latency. Our exploration of the multiple parameters finds the sweet spot on a wide interconnect to access the shared I-cache and the inclusion of a few line buffers to provide the required bandwidth and latency to sustain performance. The projections presented in this thesis show additional 11% area savings with a 5% energy reduction at no performance cost. These area and power savings might be attractive for many-core accelerators either for increasing the performance per area and power unit, or adding additional cores and thus improving the performance for the same hardware budget. Finally, in this thesis we study the effects of future NUMA accelerators comprised of multiple GPU devices. Reaching the limits of a single-GPU die size, next-generation GPU compute accelerators will likely embrace multi-socket designs increasing the core count and memory bandwidth. However, maintaining the UMA behavior of a single-GPU in multi-GPU systems without code rewriting stands as a challenge. We investigate multi-socket NUMA GPU designs and show that significant changes are needed to both the GPU interconnect and cache architectures to achieve performance scalability. We show that application phase effects can be exploited allowing GPU sockets to dynamically optimize their individual interconnect and cache policies, minimizing the impact of NUMA effects. Our NUMA-aware GPU outperforms a single GPU by 1.5×, 2.3×, and 3.2× while achieving 89%, 84%, and 76% of theoretical application scalability in 2, 4, and 8 sockets designs respectively. Implementable today, NUMA-aware multi-socket GPUs may be a promising candidate for performance scaling of future compute nodes used in HPC.Empezando por CPUs de un solo procesador, y pasando por aceleradores discretos, los supercomputadores han avanzado enormemente utilizando todos los transistores disponibles en el chip, y especializando los diseños para cada tipo de cálculo. Actualmente, los nodos de cálculo de un sistema de Computación de Altas Prestaciones (CAP) utilizan CPUs de múltiples procesadores, optimizados para el cálculo serial de instrucciones, y múltiples aceleradores (aceleradores gráficos, o many-core), optimizados para el cálculo paralelo. El diseño de un sistema CAP de nueva generación requiere no solo mejorar el rendimiento de cálculo, sino también mejorar la eficiencia energética. La siguiente generación de sistemas requiere mejorar un orden de magnitud en ambas métricas simultáneamente. Esta tesis doctoral explora optimizaciones específicas para sistemas CAP para hacer un mejor uso de los transistores, y para mejorar las prestaciones de forma transparente ejecutando las aplicaciones en múltiples aceleradores en paralelo. Primero, analizamos varios conjuntos de aplicaciones CAP, y las comparamos con aplicaciones para servidores y escritorio, identificando las principales diferencias que nos indican cómo ajustar la arquitectura para CAP. En las aplicaciones CAP, también analizamos la parte secuencial del código y la parte paralela de forma separada, . El resultado de este análisis nos lleva a proponer una arquitectura multiprocesador asimétrica (ACMP) , con un procesador optimizado para el código secuencial, y múltiples procesadores, más pequeños, optimizados para el procesamiento paralelo. Nuestros resultados muestran que reducir el tamaño de las estructuras del front-end (fetch, y predicción de saltos) en los procesadores paralelos nos proporciona un 16% extra de área en el chip, y una reducción de consumo del 7%. Como mejora a nuestra arquitectura ACMP, proponemos explotar el hecho de que todos los procesadores paralelos ejecutan el mismo código al mismo tiempo. Evaluamos una propuesta en que los procesadores paralelos comparten la caché de instrucciones, con la intención de que uno de ellos precargue las instrucciones para los demás procesadores (prefetching), sin aumentar la latencia media de acceso. Nuestra exploración de los distintos parámetros determina que el punto óptimo requiere una interconexión de alto ancho de banda para acceder a la caché compartida, y el uso de unos pocos line buffers para mantener el ancho de banda y la latencia necesarios. Nuestras proyecciones muestran un ahorro adicional del 11% en área y el 5% en energía, sin impacto en el rendimiento. Estos ahorros de área y energía permiten a un multiprocesador incrementar la eficiencia energética, o aumentar el rendimiento añadiendo procesador adicionales. Por último, estudiamos el efecto de usar múltiples aceleradores (GPU) en una arquitectura con tiempo de acceso a memoria no uniforme (NUMA). Una vez alcanzado el límite de número de transistores y tamaño máximo por chip, la siguiente generación de aceleradores deberá utilizar múltiples chips para aumentar el número de procesadores y el ancho de banda de acceso a memoria. Sin embargo, es muy difícil mantener la ilusión de un tiempo de acceso a memoria uniforme en un sistema multi-GPU sin reescribir el código de la aplicación. Nuestra investigación sobre sistemas multi-GPU muestra retos significativos en el diseño de la interconexión entre las GPU y la jerarquía de memorias cache. Nuestros resultados muestran que se puede explotar el comportamiento en fases de las aplicaciones para optimizar la configuración de la interconexión y las cachés de forma dinámica, minimizando el impacto de la arquitectura NUMA. Nuestro diseño mejora el rendimiento de un sistema con una única GPU en 1.5x, 2.3x y 3.2x (el 89%, 84%, y 76% del máximo teórico) usando 2, 4, y 8 GPUs en paralelo. Siendo su implementación posible hoy en dia, los nodos de cálculo con múltiples aceleradores son una alternativa atractiva para futuros sistemas CAP

Multicore architecture optimizations for HPC applications

From single-core CPUs to detachable compute accelerators, supercomputers made a tremendous progress by using available transistors on chip and specializing hardware for a given type of computation. Today, compute nodes used in HPC employ multi-core CPUs tailored for serial execution and multiple accelerators (many-core devices or GPUs) for throughput computing. However, designing next-generation HPC system requires not only the performance improvement but also better energy efficiency. Current trend of reaching exascale level of computation asks for at least an order of magnitude increase in both of these metrics. This thesis explores HPC-specific optimizations in order to make better utilization of the available transistors and to improve performance by transparently executing parallel code across multiple GPU accelerators. First, we analyze several HPC benchmark suites, compare them against typical desktop applications, and identify the differences which advocate for proper core tailoring. Moreover, within the HPC applications, we evaluate serial and parallel code sections separately, resulting in an Asymmetric Chip Multiprocessor (ACMP) design with one core optimized for single-thread performance and many lean cores for parallel execution. Our results presented here suggests downsizing of core front-end structures providing an HPC-tailored lean core which saves 16% of the core area and 7% of power, without performance loss. Further improving an ACMP design, we identify that multiple lean cores run the same code during parallel regions. This motivated us to evaluate the idea where lean cores share the I-cache with the intent of benefiting from mutual prefetching, without increasing the average access latency. Our exploration of the multiple parameters finds the sweet spot on a wide interconnect to access the shared I-cache and the inclusion of a few line buffers to provide the required bandwidth and latency to sustain performance. The projections presented in this thesis show additional 11% area savings with a 5% energy reduction at no performance cost. These area and power savings might be attractive for many-core accelerators either for increasing the performance per area and power unit, or adding additional cores and thus improving the performance for the same hardware budget. Finally, in this thesis we study the effects of future NUMA accelerators comprised of multiple GPU devices. Reaching the limits of a single-GPU die size, next-generation GPU compute accelerators will likely embrace multi-socket designs increasing the core count and memory bandwidth. However, maintaining the UMA behavior of a single-GPU in multi-GPU systems without code rewriting stands as a challenge. We investigate multi-socket NUMA GPU designs and show that significant changes are needed to both the GPU interconnect and cache architectures to achieve performance scalability. We show that application phase effects can be exploited allowing GPU sockets to dynamically optimize their individual interconnect and cache policies, minimizing the impact of NUMA effects. Our NUMA-aware GPU outperforms a single GPU by 1.5×, 2.3×, and 3.2× while achieving 89%, 84%, and 76% of theoretical application scalability in 2, 4, and 8 sockets designs respectively. Implementable today, NUMA-aware multi-socket GPUs may be a promising candidate for performance scaling of future compute nodes used in HPC.Empezando por CPUs de un solo procesador, y pasando por aceleradores discretos, los supercomputadores han avanzado enormemente utilizando todos los transistores disponibles en el chip, y especializando los diseños para cada tipo de cálculo. Actualmente, los nodos de cálculo de un sistema de Computación de Altas Prestaciones (CAP) utilizan CPUs de múltiples procesadores, optimizados para el cálculo serial de instrucciones, y múltiples aceleradores (aceleradores gráficos, o many-core), optimizados para el cálculo paralelo. El diseño de un sistema CAP de nueva generación requiere no solo mejorar el rendimiento de cálculo, sino también mejorar la eficiencia energética. La siguiente generación de sistemas requiere mejorar un orden de magnitud en ambas métricas simultáneamente. Esta tesis doctoral explora optimizaciones específicas para sistemas CAP para hacer un mejor uso de los transistores, y para mejorar las prestaciones de forma transparente ejecutando las aplicaciones en múltiples aceleradores en paralelo. Primero, analizamos varios conjuntos de aplicaciones CAP, y las comparamos con aplicaciones para servidores y escritorio, identificando las principales diferencias que nos indican cómo ajustar la arquitectura para CAP. En las aplicaciones CAP, también analizamos la parte secuencial del código y la parte paralela de forma separada, . El resultado de este análisis nos lleva a proponer una arquitectura multiprocesador asimétrica (ACMP) , con un procesador optimizado para el código secuencial, y múltiples procesadores, más pequeños, optimizados para el procesamiento paralelo. Nuestros resultados muestran que reducir el tamaño de las estructuras del front-end (fetch, y predicción de saltos) en los procesadores paralelos nos proporciona un 16% extra de área en el chip, y una reducción de consumo del 7%. Como mejora a nuestra arquitectura ACMP, proponemos explotar el hecho de que todos los procesadores paralelos ejecutan el mismo código al mismo tiempo. Evaluamos una propuesta en que los procesadores paralelos comparten la caché de instrucciones, con la intención de que uno de ellos precargue las instrucciones para los demás procesadores (prefetching), sin aumentar la latencia media de acceso. Nuestra exploración de los distintos parámetros determina que el punto óptimo requiere una interconexión de alto ancho de banda para acceder a la caché compartida, y el uso de unos pocos line buffers para mantener el ancho de banda y la latencia necesarios. Nuestras proyecciones muestran un ahorro adicional del 11% en área y el 5% en energía, sin impacto en el rendimiento. Estos ahorros de área y energía permiten a un multiprocesador incrementar la eficiencia energética, o aumentar el rendimiento añadiendo procesador adicionales. Por último, estudiamos el efecto de usar múltiples aceleradores (GPU) en una arquitectura con tiempo de acceso a memoria no uniforme (NUMA). Una vez alcanzado el límite de número de transistores y tamaño máximo por chip, la siguiente generación de aceleradores deberá utilizar múltiples chips para aumentar el número de procesadores y el ancho de banda de acceso a memoria. Sin embargo, es muy difícil mantener la ilusión de un tiempo de acceso a memoria uniforme en un sistema multi-GPU sin reescribir el código de la aplicación. Nuestra investigación sobre sistemas multi-GPU muestra retos significativos en el diseño de la interconexión entre las GPU y la jerarquía de memorias cache. Nuestros resultados muestran que se puede explotar el comportamiento en fases de las aplicaciones para optimizar la configuración de la interconexión y las cachés de forma dinámica, minimizando el impacto de la arquitectura NUMA. Nuestro diseño mejora el rendimiento de un sistema con una única GPU en 1.5x, 2.3x y 3.2x (el 89%, 84%, y 76% del máximo teórico) usando 2, 4, y 8 GPUs en paralelo. Siendo su implementación posible hoy en dia, los nodos de cálculo con múltiples aceleradores son una alternativa atractiva para futuros sistemas CAP.Postprint (published version

Towards Compelling Cases for the Viability of Silicon-Nanophotonic Technology in Future Many-core Systems

Many crossbenchmarking results reported in the open literature raise optimistic expectations on the use of optical networks-on-chip (ONoCs) for high-performance and low-power on-chip communications in future Manycore Systems. However, these works ultimately fail to make a compelling case for the viability of silicon-nanophotonic technology for two fundamental reasons: (1)Lack of aggressive electrical baselines (ENoCs). (2) Inaccuracy in physical- and architecture-layer analysis of the ONoC. This thesis aims at providing the guidelines and minimum requirements so that nanophotonic emerging technology may become of practical relevance. The key enabler for this study is a cross-layer design methodology of the optical transport medium, ranging from the consideration of the predictability gap between ONoC logic schemes and their physical implementations, up to architecture-level design issues such as the network interface and its co-design requirements with the memory hierarchy. In order to increase the practical relevance of the study, we consider a consolidated electrical NoC counterpart with an optimized architecture from a performance and power viewpoint. The quality metrics of this latter are derived from synthesis and place&route on an industrial 40nm low-power technology library. Building on this methodology, we are able to provide a realistic energy efficiency comparison between ONoC and ENoC both at the level of the system interconnect and of the system as a whole, pointing out the sensitivity of the results to the maturity of the underlying silicon nanophotonic technology, and at the same time paving the way towards compelling cases for the viability of such technology in next generation many-cores systems

Automatic synthesis and optimization of chip multiprocessors

The microprocessor technology has experienced an enormous growth during the last decades. Rapid downscale of the CMOS technology has led to higher operating frequencies and performance densities, facing the fundamental issue of power dissipation. Chip Multiprocessors (CMPs) have become the latest paradigm to improve the power-performance efficiency of computing systems by exploiting the parallelism inherent in applications. Industrial and prototype implementations have already demonstrated the benefits achieved by CMPs with hundreds of cores.CMP architects are challenged to take many complex design decisions. Only a few of them are:- What should be the ratio between the core and cache areas on a chip?- Which core architectures to select?- How many cache levels should the memory subsystem have?- Which interconnect topologies provide efficient on-chip communication?These and many other aspects create a complex multidimensional space for architectural exploration. Design Automation tools become essential to make the architectural exploration feasible under the hard time-to-market constraints. The exploration methods have to be efficient and scalable to handle future generation on-chip architectures with hundreds or thousands of cores.Furthermore, once a CMP has been fabricated, the need for efficient deployment of the many-core processor arises. Intelligent techniques for task mapping and scheduling onto CMPs are necessary to guarantee the full usage of the benefits brought by the many-core technology. These techniques have to consider the peculiarities of the modern architectures, such as availability of enhanced power saving techniques and presence of complex memory hierarchies.This thesis has several objectives. The first objective is to elaborate the methods for efficient analytical modeling and architectural design space exploration of CMPs. The efficiency is achieved by using analytical models instead of simulation, and replacing the exhaustive exploration with an intelligent search strategy. Additionally, these methods incorporate high-level models for physical planning. The related contributions are described in Chapters 3, 4 and 5 of the document.The second objective of this work is to propose a scalable task mapping algorithm onto general-purpose CMPs with power management techniques, for efficient deployment of many-core systems. This contribution is explained in Chapter 6 of this document.Finally, the third objective of this thesis is to address the issues of the on-chip interconnect design and exploration, by developing a model for simultaneous topology customization and deadlock-free routing in Networks-on-Chip. The developed methodology can be applied to various classes of the on-chip systems, ranging from general-purpose chip multiprocessors to application-specific solutions. Chapter 7 describes the proposed model.The presented methods have been thoroughly tested experimentally and the results are described in this dissertation. At the end of the document several possible directions for the future research are proposed