Millimeter-scale RF Integrated Circuits and Antennas for Energy-efficient Wireless Sensor Nodes

Recently there has been increased demand for a millimeter-scale wireless sensor node for applications such as biomedical devices, defense, and surveillance. This form-factor is driven by a desire to be vanishingly small, injectable through a needle, or implantable through a minimally-invasive surgical procedure. Wireless communication is a necessity, but there are several challenges at the millimeter-scale wireless sensor node. One of the main challenges is external components like crystal reference and antenna become the bottleneck of realizing the mm-scale wireless sensor node device. A second challenge is power consumption of the electronics. At mm-scale, the micro-battery has limited capacity and small peak current. Moreover, the RF front-end circuits that operates at the highest frequency in the system will consume most of the power from the battery. Finally, as node volume reduces, there is a challenge of integrating the entire system together, in particular for the RF performance, because all components, including the battery and ICs, need to be placed in close proximity of the antenna. This research explores ways to implement low-power integrated circuits in an energy-constrained and volume constrained application. Three different prototypes are mainly conducted in the proposal. The first is a fully-encapsulated, autonomous, complete wireless sensor node with UWB transmitter in 10.6mm3 volume. It is the first time to demonstrate a full and stand-alone wireless sensing functionality with such a tiny integrated system. The second prototype is a low power GPS front-end receiver that supports burst-mode. A double super-heterodyne topology enables the reception of the three public GPS bands, L1, L2 and L5 simultaneously. The third prototype is an integrated rectangular slot loop antenna in a standard 0.13-μm BiCMOS technology. The antenna is efficiently designed to cover the bandwidth at 60 GHz band and easily satisfy the metal density rules and can be integrated with other circuitry in a standard process.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/143972/1/hskims_1.pd

Robust Circuit Design for Low-Voltage VLSI.

Voltage scaling is an effective way to reduce the overall power consumption, but the major challenges in low voltage operations include performance degradation and reliability issues due to PVT variations. This dissertation discusses three key circuit components that are critical in low-voltage VLSI. Level converters must be a reliable interface between two voltage domains, but the reduced on/off-current ratio makes it extremely difficult to achieve robust conversions at low voltages. Two static designs are proposed: LC2 adopts a novel pulsed-operation and modulates its pull-up strength depending on its state. A 3-sigma robustness is guaranteed using a current margin plot; SLC inherently reduces the contention by diode-insertion. Improvements in performance, power, and robustness are measured from 130nm CMOS test chips. SRAM is a major bottleneck in voltage-scaling due to its inherent ratioed-bitcell design. The proposed 7T SRAM alleviates the area overhead incurred by 8T bitcells and provides robust operation down to 0.32V in 180nm CMOS test chips with 3.35fW/bit leakage. Auto-Shut-Off provides a 6.8x READ energy reduction, and its innate Quasi-Static READ has been demonstrated which shows a much improved READ error rate. A use of PMOS Pass-Gate improves the half-select robustness by directly modulating the device strength through bitline voltage. Clocked sequential elements, flip-flops in short, are ubiquitous in today’s digital systems. The proposed S2CFF is static, single-phase, contention-free, and has the same number of devices as in TGFF. It shows a 40% power reduction as well as robust low-voltage operations in fabricated 45nm SOI test chips. Its simple hold-time path and the 3.4x improvement in 3-sigma hold-time is presented. A new on-chip flip-flop testing harness is also proposed, and measured hold-time variations of flip-flops are presented.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/111525/1/yejoong_1.pd

A Construction Kit for Efficient Low Power Neural Network Accelerator Designs

Implementing embedded neural network processing at the edge requires efficient hardware acceleration that couples high computational performance with low power consumption. Driven by the rapid evolution of network architectures and their algorithmic features, accelerator designs are constantly updated and improved. To evaluate and compare hardware design choices, designers can refer to a myriad of accelerator implementations in the literature. Surveys provide an overview of these works but are often limited to system-level and benchmark-specific performance metrics, making it difficult to quantitatively compare the individual effect of each utilized optimization technique. This complicates the evaluation of optimizations for new accelerator designs, slowing-down the research progress. This work provides a survey of neural network accelerator optimization approaches that have been used in recent works and reports their individual effects on edge processing performance. It presents the list of optimizations and their quantitative effects as a construction kit, allowing to assess the design choices for each building block separately. Reported optimizations range from up to 10'000x memory savings to 33x energy reductions, providing chip designers an overview of design choices for implementing efficient low power neural network accelerators

Bioelectronic Sensor Nodes for Internet of Bodies

Energy-efficient sensing with Physically-secure communication for bio-sensors on, around and within the Human Body is a major area of research today for development of low-cost healthcare, enabling continuous monitoring and/or secure, perpetual operation. These devices, when used as a network of nodes form the Internet of Bodies (IoB), which poses certain challenges including stringent resource constraints (power/area/computation/memory), simultaneous sensing and communication, and security vulnerabilities as evidenced by the DHS and FDA advisories. One other major challenge is to find an efficient on-body energy harvesting method to support the sensing, communication, and security sub-modules. Due to the limitations in the harvested amount of energy, we require reduction of energy consumed per unit information, making the use of in-sensor analytics/processing imperative. In this paper, we review the challenges and opportunities in low-power sensing, processing and communication, with possible powering modalities for future bio-sensor nodes. Specifically, we analyze, compare and contrast (a) different sensing mechanisms such as voltage/current domain vs time-domain, (b) low-power, secure communication modalities including wireless techniques and human-body communication, and (c) different powering techniques for both wearable devices and implants.Comment: 30 pages, 5 Figures. This is a pre-print version of the article which has been accepted for Publication in Volume 25 of the Annual Review of Biomedical Engineering (2023). Only Personal Use is Permitte

Ultra-low Power Circuits for Internet of Things (IOT)

Miniaturized sensor nodes offer an unprecedented opportunity for the semiconductor industry which led to a rapid development of the application space: the Internet of Things (IoT). IoT is a global infrastructure that interconnects physical and virtual things which have the potential to dramatically improve people's daily lives. One of key aspect that makes IoT special is that the internet is expanding into places that has been ever reachable as device form factor continue to decreases. Extremely small sensors can be placed on plants, animals, humans, and geologic features, and connected to the Internet. Several challenges, however, exist that could possibly slow the development of IoT. In this thesis, several circuit techniques as well as system level optimizations to meet the challenging power/energy requirement for the IoT design space are described. First, a fully-integrated temperature sensor for battery-operated, ultra-low power microsystems is presented. Sensor operation is based on temperature independent/dependent current sources that are used with oscillators and counters to generate a digital temperature code. Second, an ultra-low power oscillator designed for wake-up timers in compact wireless sensors is presented. The proposed topology separates the continuous comparator from the oscillation path and activates it only for short period when it is required. As a result, both low power tracking and generation of precise wake-up signal is made possible. Third, an 8-bit sub-ranging SAR ADC for biomedical applications is discussed that takes an advantage of signal characteristics. ADC uses a moving window and stores the previous MSBs voltage value on a series capacitor to achieve energy saving compared to a conventional approach while maintaining its accuracy. Finally, an ultra-low power acoustic sensing and object recognition microsystem that uses frequency domain feature extraction and classification is presented. By introducing ultra-low 8-bit SAR-ADC with 50fF input capacitance, power consumption of the frontend amplifier has been reduced to single digit nW-level. Also, serialized discrete Fourier transform (DFT) feature extraction is proposed in a digital back-end, replacing a high-power/area-consuming conventional FFT.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/137157/1/seojeong_1.pd

RF Integrated Circuits for Energy Autonomous Sensor Nodes.

The exponential growth in the semiconductor industry has enabled computers to pervade our everyday lives, and as we move forward many of these computers will have form factors much smaller than a typical laptop or smartphone. Sensor nodes will soon be deployed ubiquitously, capable of capturing information of their surrounding environment. The next step is to connect all these different nodes together into an entire interconnected system. This “Internet of Things” (IoT) vision has incredible potential to change our lives commercially, societally, and personally. The backbone of IoT is the wireless sensor node, many of which will operate under very rigorous energy constraints with small batteries or no batteries at all. It has been shown that in sensor nodes, radio communication is one of the biggest bottlenecks to ultra-low power design. This research explores ways to reduce energy consumption in radios for wireless sensor networks, allowing them to run off harvested energy, while maintaining qualities that will allow them to function in a real world, multi-user environment. Three different prototypes have been designed demonstrating these techniques. The first is a sensitivity-reduced nanowatt wake-up radio which allows a sensor node to actively listen for packets even when the rest of the node is asleep. CDMA codes and interference rejection reduce the potential for energy-costly false wake-ups. The second prototype is a full transceiver for a body-worn EKG sensor node. This transceiver is designed to have low instantaneous power and is able to receive 802.15.6 Wireless Body Area Network compliant packets. It uses asymmetric communication including a wake-up receiver based on the previous design, UWB transmitter and a communication receiver. The communication receiver has 10 physical channels to avoid interference and demodulates coherent packets which is uncommon for low power radios, but dictated by the 802.15.6 standard. The third prototype is a long range transceiver capable of >1km communication range in the 433MHz band and able to interface with an existing commercial radio. A digitally assisted baseband demodulator was designed which enables the ability to perform bit-level as well as packet-level duty cycling which increases the radio's energy efficiency.PhDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/110432/1/nerobert_1.pd

Ultra-Low Power Circuit Design for Cubic-Millimeter Wireless Sensor Platform.

Modern daily life is surrounded by smaller and smaller computing devices. As Bell’s Law predicts, the research community is now looking at tiny computing platforms and mm3-scale sensor systems are drawing an increasing amount of attention since they can create a whole new computing environment. Designing mm3-scale sensor nodes raises various circuit and system level challenges and we have addressed and proposed novel solutions for many of these challenges to create the first complete 1.0mm3 sensor system including a commercial microprocessor. We demonstrate a 1.0mm3 form factor sensor whose modular die-stacked structure allows maximum volume utilization. Low power I2C communication enables inter-layer serial communication without losing compatibility to standard I2C communication protocol. A dual microprocessor enables concurrent computation for the sensor node control and measurement data processing. A multi-modal power management unit allowed energy harvesting from various harvesting sources. An optical communication scheme is provided for initial programming, synchronization and re-programming after recovery from battery discharge. Standby power reduction techniques are investigated and a super cut-off power gating scheme with an ultra-low power charge pump reduces the standby power of logic circuits by 2-19× and memory by 30%. Different approaches for designing low-power memory for mm3-scale sensor nodes are also presented in this work. A dual threshold voltage gain cell eDRAM design achieves the lowest eDRAM retention power and a 7T SRAM design based on hetero-junction tunneling transistors reduces the standby power of SRAM by 9-19× with only 15% area overhead. We have paid special attention to the timer for the mm3-scale sensor systems and propose a multi-stage gate-leakage-based timer to limit the standard deviation of the error in hourly measurement to 196ms and a temperature compensation scheme reduces temperature dependency to 31ppm/°C. These techniques for designing ultra-low power circuits for a mm3-scale sensor enable implementation of a 1.0mm3 sensor node, which can be used as a skeleton for future micro-sensor systems in variety of applications. These microsystems imply the continuation of the Bell’s Law, which also predicts the massive deployment of mm3-scale computing systems and emergence of even smaller and more powerful computing systems in the near future.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/91438/1/sori_1.pd

Low-Power Reconfigurable Sensing Circuitry for the Internet-of-Things Paradigm

With ubiquitous wireless communication via Wi-Fi and nascent 5th Generation mobile communications, more devices -- both smart and traditionally dumb -- will be interconnected than ever before. This burgeoning trend is referred to as the Internet-of-Things. These new sensing opportunities place a larger burden on the underlying circuitry that must operate on finite battery power and/or within energy-constrained environments. New developments of low-power reconfigurable analog sensing platforms like field-programmable analog arrays (FPAAs) present an attractive sensing solution by processing data in the analog domain while staying flexible in design. This work addresses some of the contemporary challenges of low-power wireless sensing via traditional application-specific sensing and with FPAAs. A large emphasis is placed on furthering the development of FPAAs by making them more accessible to designers without a strong integrated-circuit background -- much like FPGAs have done for digital designers

Low Voltage Circuit Design Techniques for Cubic-Millimeter Computing.

Cubic-millimeter computers complete with microprocessors, memories, sensors, radios and power sources are becomingly increasingly viable. Power consumption is one of the last remaining barriers to cubic-millimeter computing and is the subject of this work. In particular, this work focuses on minimizing power consumption in digital circuits using low voltage operation. Chapter 2 includes a general discussion of low voltage circuit behavior, specifically that at subthreshold voltages. In Chapter 3, the implications of transistor scaling on subthreshold circuits are considered. It is shown that the slow scaling of gate oxide relative to the device channel length leads to a 60% reduction in Ion/Ioff between the 90nm and 32nm nodes, which results in sub-optimal static noise margins, delay, and power consumption. It is also shown that simple modifications to gate length and doping can alleviate some of these problems. Three low voltage test-chips are discussed for the remainder of this work. The first test-chip implements the Subliminal Processor (Chapter 4), a sub-200mV 8-bit microprocessor fabricated in a 0.13µm technology. Measurements first show that the Subliminal Processor consumes only 3.5pJ/instruction at Vdd=350mV. Measurements of 20 dies then reveal that proper body biasing can eliminate performance variations and reduce mean energy substantially at low voltage. Finally, measurements are used to explore the effectiveness of body biasing, voltage scaling, and various gate sizing techniques for improving speed. The second test-chip implements the Phoenix Processor (Chapter 5), a low voltage 8-bit microprocessor optimized for minimum power operation in standby mode. The Phoenix Processor was fabricated in a 0.18µm technology in an area of only 915x915µm2. The aggressive standby mode strategy used in the Phoenix Processor is discussed thoroughly. Measurements at Vdd=0.5V show that the test-chip consumes 226nW in active mode and only 35.4pW in standby mode, making an on-chip battery a viable option. Finally, the third test-chip implements a low voltage image sensor (Chapter 6). A 128x128 image sensor array was fabricated in a 0.13µm technology. Test-chip measurements reveal that operation below 0.6V is possible with power consumption of only 1.9µW at 0.6V. Extensive characterization is presented with specific emphasis on noise characteristics and power consumption.Ph.D.Electrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttp://deepblue.lib.umich.edu/bitstream/2027.42/62233/1/hansons_1.pd

Ultra-Low-Power Embedded SRAM Design for Battery- Operated and Energy-Harvested IoT Applications

Internet of Things (IoT) devices such as wearable health monitors, augmented reality goggles, home automation, smart appliances, etc. are a trending topic of research. Various IoT products are thriving in the current electronics market. The IoT application needs such as portability, form factor, weight, etc. dictate the features of such devices. Small, portable, and lightweight IoT devices limit the usage of the primary energy source to a smaller rechargeable or non-rechargeable battery. As battery life and replacement time are critical issues in battery-operated or partially energy-harvested IoT devices, ultra-low-power (ULP) system on chips (SoC) are becoming a widespread solution of chip makers’ choice. Such ULP SoC requires both logic and the embedded static random access memory (SRAM) in the processor to operate at very low supply voltages. With technology scaling for bulk and FinFET devices, logic has demonstrated to operate at low minimum operating voltages (VMIN). However, due to process and temperature variation, SRAMs have higher VMIN in scaled processes that become a huge problem in designing ULP SoC cores. This chapter discusses the latest published circuits and architecture techniques to minimize the SRAM VMIN for scaled bulk and FinFET technologies and improve battery life for ULP IoT applications