136 research outputs found

    Current reuse topology in UWB CMOS LNA

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    Microwave class-E power amplifiers: a brief review of essential concepts in high-frequency class-E PAs and related circuits

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    Since Nathan Sokal's invention of the class-E power amplifier (PA), the vast majority of class-E results have been reported at kilohertz and millihertz frequencies, but the concept is increasingly applied in the ultrahigh-frequency (UHF) [1]-[13], microwave [14]-[20], and even millimeter-wave range [21]. The goal of this article is to briefly review some interesting concepts concerning high-frequency class-E PAs and related circuits. (The article on page 26 of this issue, "A History of Switching-Mode Class-E Techniques" by Andrei Grebennikov and Frederick H. Raab, provides a historical overview of class-E amplifier development.)We acknowledge support, in part, by a Lockheed Martin Endowed Chair at the University of Colorado and in part by the Spanish Ministry of Economy, Industry, and Competitiveness (MINECO) through TEC2014-58341-C4-1-R and TEC2017-83343-C4-1-R projects, cofunded with FEDER

    RF to Millimeter-wave Linear Power Amplifiers in Nanoscale CMOS SOI Technology

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    The low manufacturing cost, integration capability with baseband and digital circuits, and high operating frequency of nanoscale CMOS technologies have propelled their applications into RF and microwave systems. Implementing fully-integrated RF to millimeter-wave (mm-wave) CMOS power amplifiers (PAs), nevertheless, remains challenging due to the low breakdown voltages of CMOS transistors and the loss from on-chip matching networks. These limitations have reduced the design space of CMOS power amplifiers to narrow-band, low linearity metrics often with insufficient gain, output power, and efficiency. A new topology for implementing power amplifiers based on stacking of CMOS SOI transistors is proposed. The input RF power is coupled to the transistors using on-chip transformers, while the gate terminal of teach transistor is dynamically biased from the output node. The output voltages of the stacked transistors are added constructively to increase the total output voltage swing and output power. Moreover, the stack configuration increases the optimum load impedance of the PA to values close to 50 ohm, leading to power, efficiency and bandwidth enhancements. Practical design issues such as limitation in the number of stacked transistors, gate oxide breakdown, stability, effect of parasitic capacitances on the performance of the PA and large chip areas have also been addressed. Fully-integrated RF to mm-wave frequency CMOS SOI PAs are successfully implemented and measured using the proposed topology

    KEY FRONT-END CIRCUITS IN MILLIMETER-WAVE SILICON-BASED WIRELESS TRANSMITTERS FOR PHASED-ARRAY APPLICATIONS

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    Millimeter-wave (mm-Wave) phased arrays have been widely used in numerous wireless systems to perform beam forming and spatial filtering that can enhance the equivalent isotropically radiated power (EIRP) for the transmitter (TX). Regarding the existing phased-array architectures, an mm-Wave transmitter includes several building blocks to perform the desired delivered power and phases for wireless communication. Power amplifier (PA) is the most important building block. It needs to offer several advantages, e.g., high efficiency, broadband operation and high linearity. With the recent escalation of interest in 5G wireless communication technologies, mm-Wave transceivers at the 5G frequency bands (e.g., 28 GHz, 37 GHz, 39 GHz, and 60 GHz) have become an important topic in both academia and industry. Thus, PA design is a critical obstacle due to the challenges associated with implementing wideband, highly efficient and highly linear PAs at mm-Wave frequencies. In this dissertation, we present several PA design innovations to address the aforementioned challenges. Additionally, phase shifter (PS) also plays a key role in a phased-array system, since it governs the beam forming quality and steering capabilities. A high-performance phase shifter should achieve a low insertion loss, a wide phase shifting range, dense phase shift angles, and good input/output matching.Ph.D

    Complementary High-Speed SiGe and CMOS Buffers

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    GigaHertz Symposium 2010

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    Receiver Front-Ends in CMOS with Ultra-Low Power Consumption

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    Historically, research on radio communication has focused on improving range and data rate. In the last decade, however, there has been an increasing demand for low power and low cost radios that can provide connectivity with small devices around us. They should be able to offer basic connectivity with a power consumption low enough to function extended periods of time on a single battery charge, or even energy scavenged from the surroundings. This work is focused on the design of ultra-low power receiver front-ends intended for a receiver operating in the 2.4GHz ISM band, having an active power consumption of 1mW and chip area of 1mm². Low power consumption and small size make it hard to achieve good sensitivity and tolerance to interference. This thesis starts with an introduction to the overall receiver specifications, low power radio and radio standards, front-end and LO generation architectures and building blocks, followed by the four included papers. Paper I demonstrates an inductorless front-end operating at 915MHz, including a frequency divider for quadrature LO generation. An LO generator operating at 2.4GHz is shown in Paper II, enabling a front-end operating above 2GHz. Papers III and IV contain circuits with combined front-end and LO generator operating at or above the full 2.45GHz target frequency. They use VCO and frequency divider topologies that offer efficient operation and low quadrature error. An efficient passive-mixer design with improved suppression of interference, enables an LNA-less design in Paper IV capable of operating without a SAW-filter
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