Low-Power, Low-Cost, & High-Performance Digital Designs : Multi-bit Signed Multiplier design using 32nm CMOS Technology

Binary multipliers are ubiquitous in digital hardware. Digital multipliers along with the adders play a major role in computing, communicating, and controlling devices. Multipliers are used majorly in the areas of digital signal and image processing, central processing unit (CPU) of the computers, high-performance and parallel scientific computing, machine learning, physical layer design of the communication equipment, etc. The predominant presence and increasing demand for low-power, low-cost, and high-performance digital hardware led to this work of developing optimized multiplier designs. Two optimized designs are proposed in this work. One is an optimized 8 x 8 Booth multiplier architecture which is implemented using 32nm CMOS technology. Synthesis (pre-layout) and post-layout results show that the delay is reduced by 24.7% and 25.6% respectively, the area is reduced by 5.5% and 15% respectively, the power consumption is reduced by 21.5% and 26.6% respectively, and the area-delay-product is reduced by 28.8% and 36.8% respectively when compared to the performance results obtained for the state-of-the-art 8 x 8 Booth multiplier designed using 32nm CMOS technology with 1.05 V supply voltage at 500 MHz input frequency. Another is a novel radix-8 structure with 3-bit grouping to reduce the number of partial products along with the effective partial product reduction schemes for 8 x 8, 16 x 16, 32 x 32, and 64 x 64 signed multipliers. Comparing the performance results of the (synthesized, post-layout) designs of sizes 32 x 32, and 64 x 64 based on the simple novel radix-8 structure with the estimated performance measurements for the optimized Booth multiplier design presented in this work, reduction in delay by (2.64%, 0.47%) and (2.74%, 18.04%) respectively, and reduction in area-delay-product by (12.12%, -5.17%) and (17.82%, 12.91%) respectively can be observed. With the use of the higher radix structure, delay, area, and power consumption can be further reduced. Appropriate adder deployment, further exploring the optimized grouping or compression strategies, and applying more low-power design techniques such as power-gating, multi-Vt MOS transistor utilization, multi-VDD domain creation, etc., help, along with the higher radix structures, realizing the more efficient multiplier designs

Implementation of arithmetic primitives using truly deep submicron technology (TDST)

The invention of the transistor in 1947 at Bell Laboratories revolutionised the electronics industry and created a powerful platform for emergence of new industries. The quest to increase the number of devices per chip over the last four decades has resulted in rapid transition from Small-Scale-Integration (SSI) and Large-Scale-lntegration (LSI), through to the Very-Large-Scale-Integration (VLSI) technologies, incorporating approximately 10 to 100 million devices per chip. The next phase in this evolution is the Ultra-Large-Scale-Integration (ULSI) aiming to realise new application domains currently not accessible to CMOS technology. Although technology is continuously evolving to produce smaller systems with minimised power dissipation, the IC industry is facing major challenges due to constraints on power density (W/cm2) and high dynamic (operating) and static (standby) power dissipation. Mobile multimedia communication and optical based technologies have rapidly become a significant area of research and development challenging a variety of technological fronts. The future emergence or 4G (4th Generation) wireless communications networks is further driving this development, requiring increasing levels of media rich content. The processing requirements for capture, conversion, compression, decompression, enhancement and display of higher quality multimedia, place heavy demands on current ULSI systems. This is also apparent for mobile applications and intelligent optical networks where silicon chip area and power dissipation become primary considerations. In addition to the requirements for very low power, compact size and real-time processing, the rapidly evolving nature of telecommunication networks means that flexible soft programmable systems capable of adaptation to support a number of different standards and/or roles become highly desirable. In order to fully realise the capabilities promised by the 4G and supporting intelligent networks, new enabling technologies arc needed to facilitate the next generation of personal communications devices. Most of the current solutions to meet these challenges are based on various implementations of conventional architectures. For decades, silicon has been the main platform of computing, however it is slow, bulky, runs too hot, and is too expensive. Thus, new approaches to architectures, driving multimedia and future telecommunications systems, are needed in order to extend the life cycle of silicon technology. The emergence of Truly Deep Submicron Technology (TDST) and related 3-D interconnection technologies have provided potential alternatives from conventional architectures to 3-D system solutions, through integration of IDST, Vertical Software Mapping and Intelligent Interconnect Technology (IIT). The concept of Soft-Chip Technology (SCT) entails integration of Soft• Processing Circuits with Soft-Configurable Circuits . This concept can effectively manipulate hardware primitives through vertical integration of control and data. Thus the notion of 3-D Soft-Chip emerges as a new design algorithm for content-rich multimedia, telecommunication and intelligent networking system applications. 3•D architectures (design algorithms used suitable for 3-D soft-chip technology), are driven by three factors. The first is development of new device technology (TDST) that can support new architectures with complexities of 100M to 1000M devices. The second is development of advanced wafer bonding techniques such as Indium bump and the more futuristic optical interconnects for 3-D soft-chip mapping. The third is related to improving the performance of silicon CMOS systems as devices continue to scale down in dimensions. One of the fundamental building blocks of any computer system is the arithmetic component. Optimum performance of the system is determined by the efficiency of each individual component, as well as the network as a whole entity. Development of configurable arithmetic primitives is the fundamental focus in 3-D architecture design where functionality can be implemented through soft configurable hardware elements. Therefore the ability to improve the performance capability of a system is of crucial importance for a successful design. Important factors that predict the efficiency of such arithmetic components are: • The propagation delay of the circuit, caused by the gate, diffusion and wire capacitances within !he circuit, minimised through transistor sizing. and • Power dissipation, which is generally based on node transition activity. [2] Although optimum performance of 3-D soft-chip systems is primarily established by the choice of basic primitives such as adders and multipliers, the interconnecting network also has significant degree of influence on !he efficiency of the system. 3-D superposition of devices can decrease interconnect delays by up to 60% compared to a similar planar architecture. This research is based on development and implementation of configurable arithmetic primitives, suitable to the 3-D architecture, and has these foci: • To develop a variety of arithmetic components such as adders and multipliers with particular emphasis on minimum area and compatible with 3-D soft-chip design paradigm. • To explore implementation of configurable distributed primitives for arithmetic processing. This entails optimisation of basic primitives, and using them as part of array processing. In this research the detailed designs of configurable arithmetic primitives are implemented using TDST O.l3µm (130nm) technology, utilising CAD software such as Mentor Graphics and Cadence in Custom design mode, carrying through design, simulation and verification steps

Design of ALU and Cache Memory for an 8 bit ALU

The design of an ALU and a Cache memory for use in a high performance processor was examined in this thesis. Advanced architectures employing increased parallelism were analyzed to minimize the number of execution cycles needed for 8 bit integer arithmetic operations. In addition to the arithmetic unit, an optimized SRAM memory cell was designed to be used as cache memory and as fast Look Up Table. The ALU consists of stand alone units for bit parallel computation of basic integer arithmetic operations. Addition and subtraction were performed using Kogge Stone parallel prefix hardware operating at 330MHz. A high performance multiplier was built using Radix 4 Modified Booth Encoder (MBE) and a Wallace Tree summation array. The multiplier requires single clock cycle for 8 bit integer multiplication and operates at a maximum frequency of 100MHz. Multiplicative division hardware was built for executing both integer division and square root. The division hardware computes 8-bit division and square root in 4 clock cycles. Multiplier forms the basic building block of all these functional units, making high level of resource sharing feasible with this architecture. The optimal operating frequency for the arithmetic unit is 70MHz. A 6T CMOS SRAM cell measuring 90 µm2 was designed using minimum size transistors. The layout allows for horizontal overlap resulting in effective area of 76 µm2 for an 8x8 array. By substituting equivalent bit line capacitance of P4 L1 Cache, the memory was simulated to have a read time of 3.27ns. An optimized set of test vectors were identified to enable high fault coverage without the need for any additional test circuitry. Sixteen test cases were identified that would toggle all the nodes and provide all possible inputs to the sub units of the multiplier. A correlation based semi automatic method was investigated to facilitate test case identification for large multipliers. This method of testability eliminates performance and area overhead associated with conventional testability hardware. Bottom up design methodology was employed for the design. The performance and area metrics are presented along with estimated power consumption. A set of Monte Carlo analysis was carried out to ensure the dependability of the design under process variations as well as fluctuations in operating conditions. The arithmetic unit was found to require a total die area of 2mm2 (approx.) in 0.35 micron process

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority

A standard-cell self-timed multiplier for energy and area critical synchronous systems

Journal ArticleThis paper describes the design of a standard-cell self-timed multiplier for use in energy and area critical synchronous systems. The area of this multiplier is bounded by N rather than N2 as seen in more traditional combinational parallel array designs, where N is the word size. Energy has a polynomial growth with word size, but has a coefficient that is much smaller than that seen in a combinational array design. Although the multiplier is self-tamed, it can be embedded in a synchronous system appearing as a combinational element. This paper presents latency, area, and energy estimates for the multiplier implemented at various word sizes, and compares these numbers with a traditional combinational array multiplier. The self-timed multiplier uses 1/3 the energy and 1/7 the area of the combinational design fora 24-bit word size

Design of a novel X-section architecture for FX-correlator in large interferometers : a thesis presented in partial fulfilment of the requirements for the degree of Doctor of Philosophy in Engineering at Massey University, Auckland, New Zealand

Figures 2-12 and 2-17 are re-used under CC BY-NC 4.0 International & CC 3.0 Unported Licences respectively.Published journal papers I-III in the Appendices were removed because they are subject to copyright restrictions.In large radio-interferometers it is considerably challenging to perform signal correlations at input data-rates of over 11 Tbps, which involves vast amount of storage, memory bandwidth and computational hardware. The primary objective of this research work is to focus on reducing the memory-access and design complexity in matrix architectural Big Data processing of the complex X-section of an FX-correlator employed in large array radio-telescopes. This thesis presents a dedicated correlator-system-multiplier-and -accumulator (CoSMAC) cell architecture based on the real input samples from antenna arrays which produces two 16-bit complex multiplications in the same clock cycle. The novel correlator cell optimization is achieved by utilizing the flipped mirror relationship between Discrete Fourier transform (DFT) samples owing to the symmetry and periodicity of the DFT coefficient vectors. The proposed CoSMAC structure is extended to build a new processing element (PE) which calculates both cross- correlation visibilities and auto-correlation functions simultaneously. Further, a novel mathematical model and a hardware design is derived to calculate two visibilities per baseline for the Quadrature signals (IQ sampled signals, where I is In-phase signal and Q is the 90 degrees phase shifted signal) named as Processing Element for IQ sampled signals (PE_IQ). These three proposed dedicated correlator cells minimise the number of visibility calculations in a baseline. The design methodology also targets the optimisation of the multiplier size in order to reduce the power and area further in the CoSMAC, PE and PE_IQ. Various fast and efficient multiplier algorithms are compared and combined to achieve a novel multiplier named Modified-Booth-Wallace-Multiplier and implemented in the CoSMAC and PE cells. The dedicated multiplier is designed to mostly target the area and power optimisations without degrading the performance. The conventional complex-multiplier-and-accumulators (CMACs) employed to perform the complex multiplications are replaced with these dedicated ASIC correlator cells along with the optimized multipliers to reduce the overall power and area requirements in a matrix correlator architecture. The proposed architecture lowers the number of ASIC processor cells required to calculate the overall baselines in an interferometer by eliminating the redundant cells. Hence the new matrix architectural minimization is very effective in reducing the hardware complexity by nearly 50% without affecting the overall speed and performance of very large interferometers like the Square Kilometre Array (SKA)

Practical Techniques for Improving Performance and Evaluating Security on Circuit Designs

As the modern semiconductor technology approaches to nanometer era, integrated circuits (ICs) are facing more and more challenges in meeting performance demand and security. With the expansion of markets in mobile and consumer electronics, the increasing demands require much faster delivery of reliable and secure IC products. In order to improve the performance and evaluate the security of emerging circuits, we present three practical techniques on approximate computing, split manufacturing and analog layout automation. Approximate computing is a promising approach for low-power IC design. Although a few accuracy-configurable adder (ACA) designs have been developed in the past, these designs tend to incur large area overheads as they rely on either redundant computing or complicated carry prediction. We investigate a simple ACA design that contains no redundancy or error detection/correction circuitry and uses very simple carry prediction. The simulation results show that our design dominates the latest previous work on accuracy-delay-power tradeoff while using 39% less area. One variant of this design provides finer-grained and larger tunability than that of the previous works. Moreover, we propose a delay-adaptive self-configuration technique to further improve the accuracy-delay-power tradeoff. Split manufacturing prevents attacks from an untrusted foundry. The untrusted foundry has front-end-of-line (FEOL) layout and the original circuit netlist and attempts to identify critical components on the layout for Trojan insertion. Although defense methods for this scenario have been developed, the corresponding attack technique is not well explored. Hence, the defense methods are mostly evaluated with the k-security metric without actual attacks. We develop a new attack technique based on structural pattern matching. Experimental comparison with existing attack shows that the new attack technique achieves about the same success rate with much faster speed for cases without the k-security defense, and has a much better success rate at the same runtime for cases with the k-security defense. The results offer an alternative and practical interpretation for k-security in split manufacturing. Analog layout automation is still far behind its digital counterpart. We develop the layout automation framework for analog/mixed-signal ICs. A hierarchical layout synthesis flow which works in bottom-up manner is presented. To ensure the qualified layouts for better circuit performance, we use the constraint-driven placement and routing methodology which employs the expert knowledge via design constraints. The constraint-driven placement uses simulated annealing process to find the optimal solution. The packing represented by sequence pairs and constraint graphs can simultaneously handle different kinds of placement constraints. The constraint-driven routing consists of two stages, integer linear programming (ILP) based global routing and sequential detailed routing. The experiment results demonstrate that our flow can handle complicated hierarchical designs with multiple design constraints. Furthermore, the placement performance can be further improved by using mixed-size block placement which works on large blocks in priority