A two-level structure for advanced space power system automation

The tasks to be carried out during the three-year project period are: (1) performing extensive simulation using existing mathematical models to build a specific knowledge base of the operating characteristics of space power systems; (2) carrying out the necessary basic research on hierarchical control structures, real-time quantitative algorithms, and decision-theoretic procedures; (3) developing a two-level automation scheme for fault detection and diagnosis, maintenance and restoration scheduling, and load management; and (4) testing and demonstration. The outlines of the proposed system structure that served as a master plan for this project, work accomplished, concluding remarks, and ideas for future work are also addressed

Innovative Techniques for Testing and Diagnosing SoCs

We rely upon the continued functioning of many electronic devices for our everyday welfare, usually embedding integrated circuits that are becoming even cheaper and smaller with improved features. Nowadays, microelectronics can integrate a working computer with CPU, memories, and even GPUs on a single die, namely System-On-Chip (SoC). SoCs are also employed on automotive safety-critical applications, but need to be tested thoroughly to comply with reliability standards, in particular the ISO26262 functional safety for road vehicles. The goal of this PhD. thesis is to improve SoC reliability by proposing innovative techniques for testing and diagnosing its internal modules: CPUs, memories, peripherals, and GPUs. The proposed approaches in the sequence appearing in this thesis are described as follows: 1. Embedded Memory Diagnosis: Memories are dense and complex circuits which are susceptible to design and manufacturing errors. Hence, it is important to understand the fault occurrence in the memory array. In practice, the logical and physical array representation differs due to an optimized design which adds enhancements to the device, namely scrambling. This part proposes an accurate memory diagnosis by showing the efforts of a software tool able to analyze test results, unscramble the memory array, map failing syndromes to cell locations, elaborate cumulative analysis, and elaborate a final fault model hypothesis. Several SRAM memory failing syndromes were analyzed as case studies gathered on an industrial automotive 32-bit SoC developed by STMicroelectronics. The tool displayed defects virtually, and results were confirmed by real photos taken from a microscope. 2. Functional Test Pattern Generation: The key for a successful test is the pattern applied to the device. They can be structural or functional; the former usually benefits from embedded test modules targeting manufacturing errors and is only effective before shipping the component to the client. The latter, on the other hand, can be applied during mission minimally impacting on performance but is penalized due to high generation time. However, functional test patterns may benefit for having different goals in functional mission mode. Part III of this PhD thesis proposes three different functional test pattern generation methods for CPU cores embedded in SoCs, targeting different test purposes, described as follows: a. Functional Stress Patterns: Are suitable for optimizing functional stress during I Operational-life Tests and Burn-in Screening for an optimal device reliability characterization b. Functional Power Hungry Patterns: Are suitable for determining functional peak power for strictly limiting the power of structural patterns during manufacturing tests, thus reducing premature device over-kill while delivering high test coverage c. Software-Based Self-Test Patterns: Combines the potentiality of structural patterns with functional ones, allowing its execution periodically during mission. In addition, an external hardware communicating with a devised SBST was proposed. It helps increasing in 3% the fault coverage by testing critical Hardly Functionally Testable Faults not covered by conventional SBST patterns. An automatic functional test pattern generation exploiting an evolutionary algorithm maximizing metrics related to stress, power, and fault coverage was employed in the above-mentioned approaches to quickly generate the desired patterns. The approaches were evaluated on two industrial cases developed by STMicroelectronics; 8051-based and a 32-bit Power Architecture SoCs. Results show that generation time was reduced upto 75% in comparison to older methodologies while increasing significantly the desired metrics. 3. Fault Injection in GPGPU: Fault injection mechanisms in semiconductor devices are suitable for generating structural patterns, testing and activating mitigation techniques, and validating robust hardware and software applications. GPGPUs are known for fast parallel computation used in high performance computing and advanced driver assistance where reliability is the key point. Moreover, GPGPU manufacturers do not provide design description code due to content secrecy. Therefore, commercial fault injectors using the GPGPU model is unfeasible, making radiation tests the only resource available, but are costly. In the last part of this thesis, we propose a software implemented fault injector able to inject bit-flip in memory elements of a real GPGPU. It exploits a software debugger tool and combines the C-CUDA grammar to wisely determine fault spots and apply bit-flip operations in program variables. The goal is to validate robust parallel algorithms by studying fault propagation or activating redundancy mechanisms they possibly embed. The effectiveness of the tool was evaluated on two robust applications: redundant parallel matrix multiplication and floating point Fast Fourier Transform

Fault-Independent Test-Generation for Software-Based Self-Testing

Software-based self-test (SBST) is being widely used in both manufacturing and in-the-field testing of processor-based devices and Systems-on-Chips. Unfortunately, the stuck-at fault model is increasingly inadequate to match the new and different types of defects in the most recent semiconductor technologies, while the explicit and separate targeting of every fault model in SBST is cumbersome due to the high complexity of the test-generation process, the lack of automation tools, and the high CPU-intensity of the fault-simulation process. Moreover, defects in advanced semiconductor technologies are not always covered by the most commonly used fault-models, and the probability of defect-escapes increases even more. To overcome these shortcomings we propose the first fault-independent SBST method. The proposed method is almost fully automated, it offers high coverage of non-modeled faults by means of a novel SBST-oriented probabilistic metric, and it is very fast as it omits the time-consuming test-generation/fault-simulation processes. Extensive experiments on the OpenRISC OR1200 processor show the advantages of the proposed method

Investigation into voltage and process variation-aware manufacturing test

Increasing integration and complexity in IC design provides challenges for manufacturing testing. This thesis studies how process and supply voltage variation influence defect behaviour to determine the impact on manufacturing test cost and quality. The focus is on logic testing of static CMOS designs with respect to two important defect types in deep submicron CMOS: resistive bridges and full opens. The first part of the thesis addresses testing for resistive bridge defects in designs with multiple supply voltage settings. To enable analysis, a fault simulator is developed using a supply voltage-aware model for bridge defect behaviour. The analysis shows that for high defect coverage it is necessary to perform test for more than one supply voltage setting, due to supply voltage-dependent behaviour. A low-cost and effective test method is presented consisting of multi-voltage test generation that achieves high defect coverage and test set size reduction without compromise to defect coverage. Experiments on synthesised benchmarks with realistic bridge locations validate the proposed method.The second part focuses on the behaviour of full open defects under supply voltage variation. The aim is to determine the appropriate value of supply voltage to use when testing. Two models are considered for the behaviour of full open defects with and without gate tunnelling leakage influence. Analysis of the supply voltage-dependent behaviour of full open defects is performed to determine if it is required to test using more than one supply voltage to detect all full open defects. Experiments on synthesised benchmarks using an extended version of the fault simulator tool mentioned above, measure the quantitative impact of supply voltage variation on defect coverage.The final part studies the impact of process variation on the behaviour of bridge defects. Detailed analysis using synthesised ISCAS benchmarks and realistic bridge model shows that process variation leads to additional faults. If process variation is not considered in test generation, the test will fail to detect some of these faults, which leads to test escapes. A novel metric to quantify the impact of process variation on test quality is employed in the development of a new test generation tool, which achieves high bridge defect coverage. The method achieves a user-specified test quality with test sets which are smaller than test sets generated without consideration of process variation

Fault-Independent Test-Generation for Software-Based Self-Testing

Software-based self-test (SBST) is being widely used in both manufacturing and in-the-field testing of processor-based devices and Systems-on-Chips. Unfortunately, the stuck-at fault model is increasingly inadequate to match the new and different types of defects in the most recent semiconductor technologies, while the explicit and separate targeting of every fault model in SBST is cumbersome due to the high complexity of the test-generation process, the lack of automation tools, and the high CPU-intensity of the fault-simulation process. Moreover, defects in advanced semiconductor technologies are not always covered by the most commonly used fault-models, and the probability of defect-escapes increases even more. To overcome these shortcomings we propose the first fault-independent method for generating software-based self-test procedures. The proposed method is almost fully automated, it offers high coverage of non- modeled faults by means of a novel SBST-oriented probabilistic metric, and it is very fast as it omits the time-consuming test- generation/fault-simulation processes. Extensive experiments on the OpenRISC OR1200 processor show the advantages of the proposed method

Fault-Independent Test-Generation for Software-Based Self-Testing

Software-based self-test (SBST) is being widely used in both manufacturing and in-the-field testing of processor-based devices and Systems-on-Chips. Unfortunately, the stuck-at fault model is increasingly inadequate to match the new and different types of defects in the most recent semiconductor technologies, while the explicit and separate targeting of every fault model in SBST is cumbersome due to the high complexity of the test-generation process, the lack of automation tools, and the high CPU-intensity of the fault-simulation process. Moreover, defects in advanced semiconductor technologies are not always covered by the most commonly used fault-models, and the probability of defect-escapes increases even more. To overcome these shortcomings we propose the first fault-independent SBST method. The proposed method is almost fully automated, it offers high coverage of non-modeled faults by means of a novel SBST-oriented probabilistic metric, and it is very fast as it omits the time-consuming test-generation/fault-simulation processes. Extensive experiments on the OpenRISC OR1200 processor show the advantages of the proposed method

Exploring the Mysteries of System-Level Test

System-level test, or SLT, is an increasingly important process step in today's integrated circuit testing flows. Broadly speaking, SLT aims at executing functional workloads in operational modes. In this paper, we consolidate available knowledge about what SLT is precisely and why it is used despite its considerable costs and complexities. We discuss the types or failures covered by SLT, and outline approaches to quality assessment, test generation and root-cause diagnosis in the context of SLT. Observing that the theoretical understanding for all these questions has not yet reached the level of maturity of the more conventional structural and functional test methods, we outline new and promising directions for methodical developments leveraging on recent findings from software engineering.Comment: 7 pages, 2 figure

Scan Test Coverage Improvement Via Automatic Test Pattern Generation (Atpg) Tool Configuration

The scan test coverage improvement by using automatic test pattern generation (ATPG) tool configuration was investigated. Improving the test coverage is essential in detecting manufacturing defects in semiconductor industry so that high quality products can be supplied to consumers. The ATPG tool used was Mentor Graphics Tessent TestKompress (version 2014.1). The study was done by setting up a few experiments of utilizing and modifying ATPG commands and switches, observing the test coverage improvement from the statistical reports provided during pattern generation process and providing relatable discussions. By modifying the ATPG commands, it can be expected to have some improvement in the test coverage. The scan test patterns generated were stuck-at test patterns. Based on the experiments done, comparison was made on the different coverage readings and the most optimized method and flow of ATPG were determined. The most optimized flow gave an improvement of 0.91% in test coverage which is acceptable since this method does not involve a change in design. The test patterns generated were converted and tested using automatic test equipment (ATE) to observe its performance on real silicon. The test coverage improvement using ATPG tool instead of the design-based method is important as a faster workaround for back-end engineers to provide high quality test contents in such a short product development duration

Scan-Chain Intra-Cell Aware Testing

This paper first presents an evaluation of the effectiveness of different test pattern sets in terms of ability to detect possible intra-cell defects affecting the scan flip-flops. The analysis is then used to develop an effective test solution to improve the overall test quality. As a major result, the paper demonstrates that by combining test vectors generated by a commercial ATPG to detect stuck-at and delay faults, plus a fragment of extra test patterns generated to specifically target the escaped defects, we can obtain a higher intra-cell defect coverage (i.e., 6.46% on average) and a shorter test time (i.e., 42.20% on average) than by straightforwardly using an ATPG which directly targets these defects