An electrocardiogram readout circuit based on CMOS operational floating current conveyor

Electrocardiogram (ECG) is used in diagnosing heart diseases. It is designed as integration between current-mode instrumentation amplifiers (CMIA) and low pass filter (LPF). Normal heart behavior can be identified simply by normal ECG that consists of signal while heart disorder can be recognized by having differences in the features of their corresponding ECG waveform. A novel integrated CMOS-based operational floating current conveyor (OFCC) circuit is proposed. OFCC is a five port general purpose analog building block which combines all the features of different current mode devices such as the second generation current conveyor (CCII), the current feedback operational amplifier (CFA), and the operational floating conveyor (OFC). The OFFC is modeled and simulated using UMC 130nm CMOS technology kit in Cadence with a supply voltage 1.2V. The ECG readout circuit has been designed using the proposed OFCC as a building block. The advantages of this: it is integrated, noise factor is small as the proposed OFCC has the lowest input noise voltage and the layout is simple as it is a single block that can be repeated several times

Transimpedance amplifier for early detection of breast cancer

Breast cancer is the most common type of cancer worldwide. The effectiveness of its treatment depends on early stage detection, as well as on the accuracy of its diagnosis. Recently, diagnosis techniques have been submitted to relevant breakthroughs with the upcoming of Magnetic Resonance Imaging, Ultrasound Sonograms and Positron Emission Tomography (PET) scans, among others. The work presented here is focused on studying the application of a PET system to a Positron Emission Mammography (PEM) system. A PET/PEM system works under the principle that a scintillating crystal will detect a gamma-ray pulse, originated at the cancerous cells, converting it into a correspondent visible light pulse. The latter must then be converted into an electrical current pulse by means of a Photo- -Sensitive Device (PSD). After the PSD there must be a Transimpedance Amplifier (TIA) in order to convert the current pulse into a suitable output voltage, in a time period lower than 40 ns. In this Thesis, the PSD considered is a Silicon Photo-Multiplier (SiPM). The usage of this recently developed type of PSD is impracticable with the conventional TIA topologies, as it will be proven. Therefore, the usage of the Regulated Common-Gate (RCG) topology will be studied in the design of the amplifier. There will be also presented two RCG variations, comprising a noise response improvement and differential operation of the circuit. The mentioned topology will also be tested in a Radio-Frequency front-end, showing the versatility of the RCG. A study comprising a low-voltage self-biasing feedback TIA will also be shown. The proposed circuits will be simulated with standard CMOS technology (UMC 130 nm), using a 1.2 V power supply. A power consumption of 0.34 mW with a signal-to-noise ratio of 43 dB was achieved

A New Proposal for OFCC-based Instrumentation Amplifier

This contribution puts forward a new voltage mode instrumentation amplifier (VMIA) based on operational floating current conveyor (OFCC). It presents high impedance at input terminals and provides output at low impedance making the proposal ideal for voltage mode operation. The proposed VMIA architecture has two stages - the first stage comprises of two OFCCs to sense input voltages and coverts the voltage difference to current while the second stage has single OFCC that converts the current to voltage. In addition it employs two resistors to provide gain and imposes no condition on the values of resistors.  The behavior of the proposed structure is also analyzed for OFCC non idealities namely finite transimpedance and tracking error. The proposal is verified through SPICE simulations using CMOS based schematic of OFCC. Experimental results, by bread boarding it using commercially available IC AD844, are also included

Bandwidth Enhancement Techniques For Cmos Transimpedance Amplifier

Tez (Doktora) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 2016Thesis (PhD) -- İstanbul Technical University, Institute of Science and Technology, 2016CMOS Transferempedans Kuvvetlendiricinin bandgenis¸lig˘ i bas¸arımını gelis¸tirmeye yönelik teknikler haberles¸me teknolojisinde ve uygulamalarında ortaya çıkan hızlı gelis¸meler ve uygulamalar verilere hızlı eris¸im avantajı yanında hızlı hesaplama ve haberles¸me tekniklerine imkan veren bir bilgi çag˘ ını ortaya çıkarmıs¸tır. Sürekli artan hızlı bilgi transferi ihtiyacı, hızlı elemanların ve tümdevrelerin tasarımına yönelik aras¸tırmalara liderlik eden optik haberles¸me teknig˘ ini dog˘ urmus¸tur. Veri iletimi için mevcut ortamlar arasında optik fiber yapıları en iyi bas¸arımı sunmaktadır. Günümüzde optik fiberler çok yog˘ un sayısal veri transferinde genis¸ kullanım alanı bulmaktadır. Yog˘ un veri aktarımı kilometrelerce uzunlukta optik fiberler üzerinde önemli bir kayıp olmaksızın yapılabilmektedir. Normal s¸artlarda, is¸aret aktarımının ıs¸ık ile yapılması durumunda ortaya çıkan kayıp elektriksel yolla yapılan aktarıma gore daha düs¸üktür. Optik fiberler genel bas¸arımı iyiles¸tirmenin yanında düs¸ük maliyet avantajını da sunmaktadır. En yüksek teknolojilerde, optik fiber elemanları ve sistemleri çok yog˘ un veri aktarımı amacıyla kullanılmaktadır. Sonuç olarak optik fiber teknolojisi düs¸ük kayıpla çok yog˘ un veri aktarımını az maliyetle sunabilen bir teknoloji olarak günümüzde çok önemli bir konuma sahiptir. Genel olarak, optik haberles¸me sistemlerinde kullanılan analog devreler Galyum Arsenik (GaAs) veya Indiyum Fosfid (InP) teknolojileri ile üretilmektedir. Bu prosesler yüksek hızlı devreler için olus¸turulmakta olup optik haberles¸me sistemlerinin ihtiyaç duydug˘ u yüksek band genis¸lig˘ ine sahip devreleri üretmek için genellikle tek alternatif olarak kars¸ımıza çıkmaktadırlar. Bununla birlikte, CMOS proseslerinde ortaya çıkan hızlı gelis¸meler sayesinde daha yüksek bas¸arımlara sahip analog devreleri CMOS proses kullanarak tasarlama ve gerçekles¸tirme imkanları gittikçe artmaktadır. CMOS prosesin tercih edilmesine sebep olan en önemli avantaj maliyetlerde ortaya çıkan büyük düs¸üs¸tür. CMOS proseslerin maliyetinin düs¸ük olmasının sebebi, büyük alan kullanımı gerektiren sayısal devre gerçekles¸tirmelerinde çok genis¸ bir kullanıma sahip olmasıdır. CMOS prosesin dig˘ er bir avantajı sayısal ve analog devrelerin aynı taban üzerinde gerçekles¸tirilmesine imkan vermesidir. Transferempedans kuvvetlendirici (TIA) optik haberles¸me alıcılarındaki ilk blok olup giris¸indeki akımı çıkıs¸ında gerilime dönüs¸türmektedir. Tipik bir TIA’nın önemli bas¸arım ihtiyaçları genis¸ bandgenis¸lig˘ i, yüksek transferempedans kazancı, düs¸ük gürültü, düs¸ük güç tüketimi ve küçük grup geçikme deg˘ is¸im aralıg˘ ıdır. Nano teknolojilerdeki güncel gelis¸meler, optik alıcıların giris¸ katı uygulamalarında gerekli kolay bir s¸ekilde elde edilemeyen bas¸arımları sag˘ layabilen CMOS Transfer- empedans Kuvvetlendiricinin (TIA) tasarımını ekonomik hale getirmis¸tir. TIA tasarımında dikkat edilmesi gereken iki önemli mesele bandgenis¸lig˘ i ve giris¸ hassasiyetidir. TIA’nın bandgenis¸lig˘ i genellikle giris¸teki parasitic kapasite tarafından sınırlanmaktadır. TIA’nın bandgenis¸lig˘ i fotodiyot kapasitesi, transistor giris¸ kapasitesi ve transistor giris¸ direncinin belirledig˘ i RC zaman sabiti ile bulunabilir. Giris¸ hassasiyeti ise TIA’nın giris¸ gürültü akımından etkilenmektedir. Bundan dolayı TIA’nın bandgenis¸lig˘ i ve giris¸ is¸areti hassasiyeti bas¸arımlarını optimum bir s¸ekilde temin eden uygun devre topolojisinin belirlenmesi önemli bir meseledir. Bu tez, CMOS teknolojisi kullanan Transferempedans Kuvvetlendiricinin band- genis¸lig˘ i bas¸arımını gelis¸tirmeye yönelik yeni teknikler sunan bir çalıs¸madır. CMOS TIA’nın bandgenis¸lig˘ i bas¸arımını iyiles¸tirmeye yönelik farklı yaklas¸ımlar tez içerisinde gösterilmektedir. Bundan bas¸ka, bu çalıs¸ma transferempedansı kuvvetlendiricinin analizini ve tasarımını tam olarak anlamak için gerekli altyapı bilgisini de sunmaktadır. Bu tezde, sistemle devre tasarımı arasındaki bos¸lug˘ u doldurmak için s¸unlar yapılmıs¸tır: - Band genis¸lig˘ i bas¸arımının arttırılmasının matematiksel analizlerle anlas¸ılması. - Gerçekles¸tirilebilir yeni devre yapılarının tanıtılması. - Teklif edilen tasarımların CMOS teknolojisiyle gerçekles¸tirilebilirlig˘ inin kapsamlı ve detaylı simülasyonlar kullanılarak gösterilmesi. Sunulan yeni devre yapılarının ilki olarak, negatif empedans devresinin bandgenis¸lig˘ i artıs¸ı için kullanılabileceg˘ i bu tezde gösterilmis¸ olup bu teknik bu tezde TIA’nın çıkıs¸ kutpu için uygulanmaktadır. Bandgenis¸lig˘ i, kazancı (gmRout) arttırarak ve çıkıs¸ta aynı zaman sabiti korunarak arttırılabilir. Çıkıs¸ direnci arttırılarak kazanç (A) yükseltilebilir. Çıkıs¸ direnci çıkıs¸a uygulanacak bir negative direnç devresi ile arttırılabilir. Çıkıs¸ta aynı zaman sabitini korumak için ise negatif kapasite devresi kullanılabilir. Daha yüksek kazanç deg˘ eri (A) rezistif geribesleme sayesinde giris¸ direncini azaltarak giris¸ kutbunun yükselmesini sag˘ lamaktadır. Sonuç olarak, bandgenis¸lig˘ i bas¸arımında bir iyiles¸tirme elde edilebilmektedir. Teklif edilen topoloji ile 7GHz bandgenis¸lig˘ ine ve 54.3dB’lik kazanca sahip bir TIA tasarlanmıs¸tır. Teklif edilen TIA’nın 1.8V’luk besleme kaynag˘ ından çektig˘ i toplam güç 29mW’tır. Teklif edilen TIA’nın 0.18um CMOS proses ile post-serimi yapılmıs¸tır. Benzetimle elde edilmis¸ giris¸ gürültü akım yog˘ unlug˘ u 5.9pA/ Hz olup kapladıg˘ ı alan 230umX45um olmus¸tur. Tezde bir sonraki çalıs¸mada es¸les¸tirme teknig˘ i kullanılarak genis¸ bantlı bs¸r TIA tasarlanmıs¸tır. Giris¸te seri empedans es¸les¸tirme teknig˘ i ve çıkıs¸ta T tipi es¸les¸tirme yapısı birlikte kullanılarak TIA’nın bandgenis¸lig˘ i bas¸arımının iyi bir düzeyde iyiles¸tirilebileceg˘ i gösterilmis¸tir. Bu yaklas¸ım 0.18um CMOS teknolojisi ile yapılmıs¸ bir tasarım örneg˘ i ile desteklenmis¸tir. Post serim sonuçları 50fF’lık bir fotodiyot kapasitesi için 20GHz’lik bandgenis¸lig˘ i, 52.6dB’lik transferdirenci kazancı, 8.7pA/ Hz ‘lik giris¸ gürültü akımı ve 3pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 1.3mW güç çekmis¸tir. Tezin üçüncü as¸amasında TIA band genis¸lig˘ i bas¸arımını arttırmaya yönelik bas¸ka bir yapı sunulmaktadır. Bu yapı, literatürde bilinen regule edilmis¸ ortak geçitli mimari ile birlikte farklı rezonans frekanslarına sahip iki rezonans devresinin paralel kullanımını içermektedir. Teklif edilen TIA devresinde, kapasite dejenarasyon ve seri endüktif tepe teknikleri kutup-sıfır kompanzasyonu için kullanılmıs¸tır. 100fF’lık fotodiyot kapasitesine sahip bir TIA 0.18um CMOS prosesi ili tasarlanmıs¸tır. Post-serim sonuçları 13GHz’lik bandgenis¸lig˘ i, 53dB’lik transferdirenci kazancı, 24pA/ Hz ‘lik xxvi giris¸ gürültü akımı ve 5pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 11mW güç çekmis¸tir. Tezin dördüncü as¸amasında, regule edilmis¸ ortak geçitli mimari kullanan TIA’nın bandgenis¸lig˘ i bas¸arımını arttırmaya yönelik bir teknik tanıtılmıs¸tır. Bu teknik, resistif kompanzasyon teknig˘ ini ve merdiven es¸les¸tirme yapısını bir kaskod akım kaynag˘ ı ile birlikte kullanmaya dayanmaktadır. Bu yapının bas¸arımını göstermek amacıyla, 0.18um CMOS prosesi ile bir tasarım yapılmıs¸tır. Post-serim sonuçları 8.4GHz’lik bandgenis¸lig˘ i, 51.3dB’lik transferdirenci kazancı, 20pA/ Hz ‘lik giris¸ gürültü akımı ve 4pS’den daha az grup geçikmesi bas¸arımılarını vermis¸tir. Bu TIA uygulaması 1.8V’luk besleme kaynag˘ ından 17.8mW güç çekmis¸tir. Tezin son as¸amasında, tezde sunulan teknikler ve yapıların kendi aralarında kars¸ılas¸tırılması verilmektedir. Kars¸ılas¸tırma öncelikli olarak band genis¸lig˘ i, transferempedansı kazancı, gürültü, güç tüketimi, grup geçikme deg˘ is¸im aralıg˘ ı ve kapladıg˘ ı alan için yapılmaktadır. Bunlara ek olarak, sunulan yapıların kullandıg˘ ı tekniklerin avantajlı yanları ile birlikte (kararlılık üzerinde olus¸abilecek negatif etkiler gibi) dezavantajlı tarafları da tezin son as¸amasında verilmektedir. Tezin son as¸amasında yapılan kars¸ılas¸tırmalar, en iyi bant genis¸lig˘ i bas¸arımının es¸les¸tirme teknig˘ ini kullanan yapıdan elde edildig˘ ini göstermektedir. Bununla birlikte dig˘ er yapıların da band genis¸lig˘ i bas¸arımı üzerinde önemli iyiles¸tirmeler yaptıg˘ ı ortaya konulmaktadır. Gürültü açısından ise en yüksek bas¸arımın negatif empedans teknig˘ ini kullanan yapıda elde edildig˘ i görülmektedir. Bu yapı aynı zamanda düs¸ük alan kullanımı imkanı da sunmaktadır. Tezde sunulan dig˘ er iki yapı ise özellikle yüksek deg˘ erli fotodiyot kapasiteleri için incelenmis¸ olup band genis¸lig˘ i bas¸arımı üzerinde önemli iyiles¸tirmeler yaptıkları gösterilmektedir. Sonuç olarak, bu tezde transferempedans kuvvetlendiricinin bandgenis¸lig˘ i bas¸arımını iyiles¸tiren farklı teknikler sunulmakta olup bu teknikler ayrıntılı ve kars¸ılas¸tırmalı olarak incelenmektedir. Tezde verilen sonuçlar sunulan yeni tekniklerin bas¸arımlarının yüksek oldug˘ unu ve literature yeni ve güçlü alternatfiler sunuldug˘ unu göstermektedir. Tezde sunulan yaklas¸ımların ve tekniklerin gelecekte yapılacak benzer aras¸tırmalara hem yardımcı olacak hem de referans olacak nitelikte oldug˘ u düs¸ünülmektedir.The accelerated development of integrated systems in the communication technology and their application are among the significant technologies that have developed the information era by empowering high-speed computation and communication technique besides high-speed access to stored data. The continuous growth demand for high-speed transport of information has rekindled optical communications, leading to derived research on high-speed device and integrated circuit design. Among the available medium to transfer the data, optical fibers have the best performance. Optical fibers are very common these days to transport very high rate digital data. Such high speed data rates can be transported over kilometers of optical fiber and without significant loss. Normally loss is very low when the signal is transmitted using light rather than electrical signal. These fibers also have the advantage of being low cost in addition to improvement of performance. In state-of-the-art technology, fiber optic devices and systems are evidently employed to realize very high data rates. Fiber optic communication is a solution because high data rates can be transmitted through this high capacity cable with high performance. Traditionally, analog circuits used in optical communication systems are implemented using Gallium Arsenide (GaAs) or Indium Phosphide (InP) technologies. These processes are designed for high speed circuits, and have been traditionally the only technologies able to produce the high bandwidth circuits required in optical communication systems. However, due to the aggressive scaling of the CMOS process, it is now becoming possible to design high performance analog circuits in CMOS. The primary advantage of moving to a CMOS process is a dramatic reduction in cost due to its widespread use in high volume digital circuits. Another advantage of using CMOS is its ability to integrate digital and analog circuits onto the same substrate. Transimpedance amplifier (TIAs) is the first building block in the optical communication receiver that converts the small signal current to a corresponding output voltage signal. The important requirements of a typical TIA are large bandwidth, high transimpedance gain, low noise, low power consumption, and small group delay variation. Current developments in nanoscale technologies made it economically feasible to design CMOS transimpedance amplifier (TIA) that satisfies the stringent performances necessary for the front-end optical transceivers applications such as low power, low cost and high integration which offers the most economical solution in the consumer application market. In designing of TIA, the two major factors that must be considered are the bandwidth and the input sensitivity. The bandwidth of TIA is usually limited by the parasitic capacitance at the input stage, and it can be calculated by its RC time constant contributed by photodiode capacitance, parasitic capacitance and input resistance of the amplifier. The sensitivity is affected by the input current noise of the TIA. Therefore it is challenge to choose the suitable circuit topology that provides an optimal trade-off between bandwidth and input signal sensitivity for TIA. This thesis is an attempt toward providing novel techniques to extend the bandwidth of the transimpedance amplifier using CMOS technology. Different approaches used to improve the bandwidth of CMOS TIAs are covered. Moreover, this research provides the necessary background knowledge to fully understand the analysis and design of the transimpedance amplifier (TIA). Bridging the gap between system and circuit design is done by: Understanding the bandwidth expansion by mathematical analysis. Introducing new circuit architectures that can be realized. Demonstrating implementation of the proposed designs using extensive simulations in CMOS technology. It is shown in this thesis that, using a negative impedance NI circuit can be used for bandwidth extension. In our application, the negative impedance is incorporated into the output pole of TIA. The bandwidth can be improved by increasing the gain (A = gmRout ) and by maintaining the same time constant at the output pole. A better gain A can be obtained if the output resistance Rout is increased. Increasing Rout can be done by placing a negative resistance RIN in parallel with the output resistance Rout . In order to maintain the same time constant at the output node, a negative capacitance can be used. It have been reported that, the shunt feedback architecture is used to improve the bandwidth of TIA. Increasing the gain A effectively decreases the input resistance and hence increase the frequency of the input pole due to feedback. As a result, an improvement of the bandwidth can be obtained. Using the proposed topology, a wide band transimpedance amplifier with a bandwidth of 7 GH z and transimpedance gain of 54.3 dBΩ is achieved. The total power consumption of the proposed TIA from the 1.8 V power supply is 29 mW . The TIA is designed in 0.18 µ m CMOS technology. The simulated input referred noise current spectral density is 5.9 pA/√H z and the TIA occupies 230µ m × 45µ m of area. Furthermore, a wide band TIA is designed using the matching technique. It is shown that by simultaneously using of series input matching topology and T-output matching network, the bandwidth of the TIA can be obviously improved. This methodology is supported by a design example in a 0.18 µ m CMOS technology. The post layout simulation results show a bandwidth of 20 GH z with 50 f F photodiode capacitance, a transimpedance gain of 52.6 dBΩ, 11 pA/√H z input referred noise and group delay less than 8.3 ps. The TIA dissipates 1.3 mW from a 1.8 V supply voltage. In addition, a new design possessing to extend the bandwidth of the TIA is presented. This TIA employs a parallel combination of two series resonate circuits with different resonate frequencies on the conventional regulated common gate (RGC) architecture. In the proposed TIA, a capacitance degeneration and series inductive peaking technique are used for pole-zero elimination. The TIA is implemented in a 0.18 µ m CMOS process, where a 100 f F photodiode is considered. The post layout simulation results show a transimpedance gain of 53 dBΩ transimpedance gain along with a 13 GH z bandwidth. The designed TIA consumes 11 mW from a 1.8 V supply, and its group-delay variation is 5 ps with 24 pA/√H z input referred noise. xxii In the last phase of the work, a technique to enhance the bandwidth of the regulated common gate (RCG) transimpedance amplifier is described. The technique is based on using a cascode current mirror with resistive compensation technique and a ladder matching network. In order to verify the operation and the performance of the proposed technique, a CMOS design example is designed using the 0.18µ m CMOS process technology. The post layout simulation results show that, the proposed TIA achieved a bandwidth of 8.4 GH z, a transimpedance gain of 51.3 dBΩ and input referred noise current spectral density of 20 pA/√H z. The average group-delay variation is 4 ps over the bandwidth and the TIA consumes 17.8 mW from a 1.8 V supply. To sum up, this thesis focuses on various design techniques of transimpedance amplifier (TIA) that improves the bandwidth performance. We believe that, our approaches and techniques exhibit a path which other future researchers can follow and as well refer to as their researching domain and also could be used in their research applications.DoktoraPh

Design and Implementation of an Integrated Biosensor Platform for Lab-on-a-Chip Diabetic Care Systems

Recent advances in semiconductor processing and microfabrication techniques allow the implementation of complex microstructures in a single platform or lab on chip. These devices require fewer samples, allow lightweight implementation, and offer high sensitivities. However, the use of these microstructures place stringent performance constraints on sensor readout architecture. In glucose sensing for diabetic patients, portable handheld devices are common, and have demonstrated significant performance improvement over the last decade. Fluctuations in glucose levels with patient physiological conditions are highly unpredictable and glucose monitors often require complex control algorithms along with dynamic physiological data. Recent research has focused on long term implantation of the sensor system. Glucose sensors combined with sensor readout, insulin bolus control algorithm, and insulin infusion devices can function as an artificial pancreas. However, challenges remain in integrated glucose sensing which include degradation of electrode sensitivity at the microscale, integration of the electrodes with low power low noise readout electronics, and correlation of fluctuations in glucose levels with other physiological data. This work develops 1) a low power and compact glucose monitoring system and 2) a low power single chip solution for real time physiological feedback in an artificial pancreas system. First, glucose sensor sensitivity and robustness is improved using robust vertically aligned carbon nanofiber (VACNF) microelectrodes. Electrode architectures have been optimized, modeled and verified with physiologically relevant glucose levels. Second, novel potentiostat topologies based on a difference-differential common gate input pair transimpedance amplifier and low-power voltage controlled oscillators have been proposed, mathematically modeled and implemented in a 0.18μm [micrometer] complementary metal oxide semiconductor (CMOS) process. Potentiostat circuits are widely used as the readout electronics in enzymatic electrochemical sensors. The integrated potentiostat with VACNF microelectrodes achieves competitive performance at low power and requires reduced chip space. Third, a low power instrumentation solution consisting of a programmable charge amplifier, an analog feature extractor and a control algorithm has been proposed and implemented to enable continuous physiological data extraction of bowel sounds using a single chip. Abdominal sounds can aid correlation of meal events to glucose levels. The developed integrated sensing systems represent a significant advancement in artificial pancreas systems

Analog IC Design at the University of Twente

This article describes some recent research results from the IC Design group of the University of Twente, located in Enschede, The Netherlands.\ud \ud Our research focuses on analog CMOS circuit design with emphasis on high frequency and broadband circuits. With the trend of system integration in mind, we try to develop new circuit techniques that enable the next steps in system integration in nanometer CMOS technology. Our research funding comes from industry, as well as from governmental organizations. We aim to find fundamental solutions for practical problems of integrated circuits realized in industrial Silicon technologies.\ud \ud CMOS IC technology is dictated by optimal cost and performance of digital circuits and is certainly not optimized for nice analog behavior. As analog designers, we do not have the illusion to be able to change the CMOS technology, so we have to "live with it" and solve the problems by design. In this article several examples will be shown, where problematic analog behavior, such as noise and distortion, can be tackled with new circuit design techniques. These circuit techniques are developed in such a way that they do benefit from the modern technology and thus enable further integration. This way we can improve various analog building blocks for wireless, wire-line and optical communication. Below some examples are given.\ud \u

New Electronically Tunable Third Order Filters and Dual Mode Sinusoidal Oscillator Using VDTAs and Grounded Capacitors

This study introduces a third order filter and a third order oscillator configuration. Both the circuits use two voltage difference transconductance amplifiers (VDTAs) and three grounded capacitors. By selecting the input and output terminals properly, current mode and transimpedance mode low-pass and band-pass filters can be obtained without component matching conditions. The natural frequency (ω0) can be tuned electronically. The oscillator circuit provides voltage and current outputs explicitly. The condition of oscillation (CO) and the frequency of oscillation (FO) can be adjusted orthogonally and electronically. The workability of the configurations is judged using TSMC CMOS 0.18 μm technology parameter as well as commercially available LM13700 integrated circuits (ICs). The simulation results show that: for ±0.9V power supply, the power consumption is 1.08 mW for both the configurations, while total harmonic distortions (THDs) are less than 2.06% and 2.17% for the filter and oscillator configurations, respectively

HIGH PERFORMANCE CMOS WIDE-BAND RF FRONT-END WITH SUBTHRESHOLD OUT OF BAND SENSING

In future, the radar/satellite wireless communication devices must support multiple standards and should be designed in the form of system-on-chip (SoC) so that a significant reduction happen on cost, area, pins, and power etc. However, in such device, the design of a fully on-chip CMOS wideband receiver front-end that can process several radar/satellite signal simultaneously becomes a multifold complex problem. Further, the inherent high-power out-of-band (OB) blockers in radio spectrum will make the receiver more non-linear, even sometimes saturate the receiver. Therefore, the proper blocker rejection techniques need to be incorporated. The primary focus of this research work is the development of a CMOS high-performance low noise wideband receiver architecture with a subthreshold out of band sensing receiver. Further, the various reconfigurable mixer architectures are proposed for performance adaptability of a wideband receiver for incoming standards. Firstly, a high-performance low- noise bandwidthenhanced fully differential receiver is proposed. The receiver composed of a composite transistor pair noise canceled low noise amplifier (LNA), multi-gate-transistor (MGTR) trans-conductor amplifier, and passive switching quad followed by Tow Thomas bi-quad second order filter based tarns-impedance amplifier. An inductive degenerative technique with low-VT CMOS architecture in LNA helps to improve the bandwidth and noise figure of the receiver. The full receiver system is designed in UMC 65nm CMOS technology and measured. The packaged LNA provides a power gain 12dB (including buffer) with a 3dB bandwidth of 0.3G – 3G, noise figure of 1.8 dB having a power consumption of 18.75mW with an active area of 1.2mm*1mm. The measured receiver shows 37dB gain at 5MHz IF frequency with 1.85dB noise figure and IIP3 of +6dBm, occupies 2mm*1.2mm area with 44.5mW of power consumption. Secondly, a 3GHz-5GHz auxiliary subthreshold receiver is proposed to estimate the out of blocker power. As a redundant block in the system, the cost and power minimization of the auxiliary receiver are achieved via subthreshold circuit design techniques and implementing the design in higher technology node (180nm CMOS). The packaged auxiliary receiver gives a voltage gain of 20dB gain, the noise figure of 8.9dB noise figure, IIP3 of -10dBm and 2G-5GHz bandwidth with 3.02mW power consumption. As per the knowledge, the measured results of proposed main-high-performancereceiver and auxiliary-subthreshold-receiver are best in state of art design. Finally, the various viii reconfigurable mixers architectures are proposed to reconfigure the main-receiver performance according to the requirement of the selected communication standard. The down conversion mixers configurability are in the form of active/passive and Input (RF) and output (IF) bandwidth reconfigurability. All designs are simulated in 65nm CMOS technology. To validate the concept, the active/ passive reconfigurable mixer configuration is fabricated and measured. Measured result shows a conversion gain of 29.2 dB and 25.5 dB, noise figure of 7.7 dB and 10.2 dB, IIP3 of -11.9 dBm and 6.5 dBm in active and passive mode respectively. It consumes a power 9.24mW and 9.36mW in passive and active case with a bandwidth of 1 to 5.5 GHz and 0.5 to 5.1 GHz for active/passive case respectively