92 research outputs found

    Fully digital-compatible built-in self-test solutions to linearity testing of embedded mixed-signal functions

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    Mixed-signal circuits, especially analog-to-digital and digital-to-analog converters, are the most widely used circuitry in electronic systems. In the most of the cases, mixed-signal circuits form the interface between the analog and digital worlds and enable the processing and recovering of the real-world information. Performance of mixed-signal circuits, such as linearity and noise, are then critical to any applications. Conventionally, mixed-signal circuits are tested by mixed-signal automatic test equipment (ATE). However, along with the continuous performance improvement, using conventionally methods increases test costs significantly since it takes much more time to test high-performance parts than low-performance ones and mixed-signal ATE testers could be extremely expensive depending on the test precision they provide. Another factor that makes mixed-signal testing more and more challenging is the advance of the integration level. In the popular system-on-chip applications, mixed-signal circuits are deeply embedded in the systems. With less observability and accessibility, conventionally external test methods can not guarantee the precision of the source signals and evaluations. Test performance is then degraded. This work investigates new methods using digital testers incorporated with on-chip, built-in self-test circuits to test the linearity performance of data converters with less test cost and better test performance. Digital testers are cheap to use since they only offer logic signals with direct connections. The analog sourcing and evaluation capabilities have to be absorbed by the on-chip BIST circuits, which, meanwhile, could benefit the test performance with access to the internal circuit nodes. The main challenge of the digital-compatible BIST methods is to implement the BIST circuits with enough high test performance but with low design complexity and cost. High-resolution data converter testing needs much higher-precision analog source signals and evaluation circuits. However, high-precision analog circuits are conventionally hard to design and costly, and their performance is subject to mismatch errors and process variations and cannot be guaranteed without careful testing. On the digital side, BIST circuits usually conduct procedure control and data processing. To make the BIST solution more universal, the control and processing performed by the digital BIST circuits should be simple and not rely on any complex microcontroller and DSP block. Therefore, the major tasks of this dissertation are 1) performance-robust analog BIST circuit design and 2) test procedure development. Analog BIST circuits in this work consist of only low-accuracy analog components, which are usually easy to design and cost effective. The precision is then obtained by applying the so-called deterministic dynamic element matching technique to the low-accuracy analog cells. The test procedure and data processing designed for the BIST system are simple and can be implemented by small logic circuits. In this dissertation, we discuss the proposed BIST solutions to ADC and DAC linearity testing in chapter 3 and chapter 5, respectively. In each case, the structure of the test system, the test procedure, and the theoretical analysis of the test performance are presented. Simulation results are shown to verify the efficacy of the methods. The ADC BIST system is also verified experimentally. In addition, chapter 4 introduces a system-identification based reduced-code testing method for pipeline ADCs. This method is able to reduce test time by more than 95%. And it is compatible with the proposed BIST method discussed in chapter 3

    Built-in self-test and self-calibration for analog and mixed signal circuits

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    Analog-to-digital converters (ADC) are one of the most important components in modern electronic systems. In the mission-critical applications such as automotive, the reliability of the ADC is critical as the ADC impacts the system level performance. Due to the aging effect and environmental changes, the performance of the ADC may degrade and even fail to meet the accuracy requirement over time. Built-in self-test (BIST) and self-calibration are becoming the ultimate solution to achieve lifetime reliability. This dissertation introduces two ADC testing algorithms and two ADC built-in self-test circuit implementations to test the ADC integral nonlinearity (INL) and differential nonlinearity (DNL) on-chip. In the first testing algorithm, the ultrafast stimulus error removal and segmented model identification of linearity errors (USER-SMILE) is developed for ADC built-in self-test, which eliminates the need for precision stimulus and reduces the overall test time. In this algorithm, the ADC is tested twice with a nonlinear ramp, instead of using a linear ramp signal. Therefore, the stimulus can be easily generated on-chip in a low-cost way. For the two ramps, there is a constant voltage shift in between. As the input stimulus linearity is completely relaxed, there is no requirement on the waveform of the input stimulus as long as it covers the ADC input range. In the meantime, the high-resolution ADC linearity is modeled with segmented parameters, which reduces the number of samples required for achieving high-precision test, thus saving the test time. As a result, the USER-SMILE algorithm is able to use less than 1 sample/code nonlinear stimulus to test high resolution ADCs with less than 0.5 least significant bit (LSB) INL estimation error, achieving more than 10-time test time reduction. This algorithm is validated with both board-level implementation and on-chip silicon implementation. The second testing algorithm is proposed to test the INL/DNL for multi-bit-per-stages pipelined ADCs with reduced test time and better test coverage. Due to the redundancy characteristics of multi-bit-per-stages pipelined ADC, the conventional histogram test cannot estimate and calibrate the static linearity accurately. The proposed method models the pipelined ADC nonlinearity as segmented parameters with inter-stage gain errors using the raw codes instead of the final output codes. During the test phase, a pure sine wave is sent to the ADC as the input and the model parameters are estimated from the output data with the system identification method. The modeled errors are then removed from the digital output codes during the calibration phase. A high-speed 12-bit pipelined ADC is tested and calibrated with the proposed method. With only 4000 samples, the 12-bit ADC is accurately tested and calibrated to achieve less than 1 LSB INL. The ADC effective number of bits (ENOB) is improved from 9.7 bits to 10.84 bits and the spurious-free dynamic range (SFDR) is improved by more than 20dB after calibration. In the first circuit implementation, a low-cost on-chip built-in self-test solution is developed using an R2R digital-to-analog converter (DAC) structure as the signal generator and the voltage shift generator for ADC linearity test. The proposed DAC is a subradix-2 R2R DAC with a constant voltage shift generation capability. The subradix-2 architecture avoids positive voltage gaps caused by mismatches, which relaxes the DAC matching requirements and reduces the design area. The R2R DAC based BIST circuit is fabricated in TSMC 40nm technology with a small area of 0.02mm^2. Measurement results show that the BIST circuit is capable of testing a 15-bit ADC INL accurately with less than 0.5 LSB INL estimation error. In the second circuit implementation, a complete SAR ADC built-in self-test solution using the USER-SMILE is developed and implemented in a 28nm automotive microcontroller. A low-cost 12-bit resistive DAC with less than 12-bit linearity is used as the signal generator to test and calibrate a SAR ADC with a target linearity of 12 bits. The voltage shift generation is created inside the ADC with capacitor switching. The entire algorithm processing unit for USER-SMILE algorithm is also implemented on chip. The final testing results are saved in the memory for further digital calibration. Both the total harmonic distortion (THD) and the SFDR are improved by 20dB after calibration, achieving -84.5dB and 86.5dB respectively. More than 700 parts are tested to verify the robustness of the BIST solution

    Programmable CMOS Analog-to-Digital Converter Design and Testability

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    In this work, a programmable second order oversampling CMOS delta-sigma analog-to-digital converter (ADC) design in 0.5µm n-well CMOS processes is presented for integration in sensor nodes for wireless sensor networks. The digital cascaded integrator comb (CIC) decimation filter is designed to operate at three different oversampling ratios of 16, 32 and 64 to give three different resolutions of 9, 12 and 14 bits, respectively which impact the power consumption of the sensor nodes. Since the major part of power consumed in the CIC decimator is by the integrators, an alternate design is introduced by inserting coder circuits and reusing the same integrators for different resolutions and oversampling ratios to reduce power consumption. The measured peak signal-to-noise ratio (SNR) for the designed second order delta-sigma modulator is 75.6dB at an oversampling ratio of 64, 62.3dB at an oversampling ratio of 32 and 45.3dB at an oversampling ratio of 16. The implementation of a built-in current sensor (BICS) which takes into account the increased background current of defect-free circuits and the effects of process variation on ΔIDDQ testing of CMOS data converters is also presented. The BICS uses frequency as the output for fault detection in CUT. A fault is detected when the output frequency deviates more than ±10% from the reference frequency. The output frequencies of the BICS for various model parameters are simulated to check for the effect of process variation on the frequency deviation. A design for on-chip testability of CMOS ADC by linear ramp histogram technique using synchronous counter as register in code detection unit (CDU) is also presented. A brief overview of the histogram technique, the formulae used to calculate the ADC parameters, the design implemented in 0.5µm n-well CMOS process, the results and effectiveness of the design are described. Registers in this design are replaced by 6T-SRAM cells and a hardware optimized on-chip testability of CMOS ADC by linear ramp histogram technique using 6T-SRAM as register in CDU is presented. The on-chip linear ramp histogram technique can be seamlessly combined with ΔIDDQ technique for improved testability, increased fault coverage and reliable operation

    Precise linear signal generation with nonideal components and deterministic dynamic element matching

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    A dynamic element matching (DEM) approach to ADC testing is introduced. Two variants of this method are introduced and compared; a deterministic DEM method and a random DEM method. With both variants, a highly non-ideal DAC is used to generate an excitation for a DUT that has effective linearity that far exceeds that of the DAC. Simulation results show that both methods can be used for testing of ADCs. The deterministic DEM (DDEM) offers potential for a substantial reduction in the number of samples when compared with a random DEM approach with the same measurement accuracy. It is shown that the concept of usinf DEM for signal generation in a test environment finds applications well-beyond ADC testing. The DDEM approach offers potential for use in both production test and BIST environments

    SymBIST: Symmetry-based Analog/Mixed-Signal BIST

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    International audienc

    System Identification, Diagnosis, and Built-In Self-Test of High Switching Frequency DC-DC Converters

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    abstract: Complex electronic systems include multiple power domains and drastically varying dynamic power consumption patterns, requiring the use of multiple power conversion and regulation units. High frequency switching converters have been gaining prominence in the DC-DC converter market due to smaller solution size (higher power density) and higher efficiency. As the filter components become smaller in value and size, they are unfortunately also subject to higher process variations and worse degradation profiles jeopardizing stable operation of the power supply. This dissertation presents techniques to track changes in the dynamic loop characteristics of the DC-DC converters without disturbing the normal mode of operation. A digital pseudo-noise (PN) based stimulus is used to excite the DC-DC system at various circuit nodes to calculate the corresponding closed-loop impulse response. The test signal energy is spread over a wide bandwidth and the signal analysis is achieved by correlating the PN input sequence with the disturbed output generated, thereby accumulating the desired behavior over time. A mixed-signal cross-correlation circuit is used to derive on-chip impulse responses, with smaller memory and lower computational requirement in comparison to a digital correlator approach. Model reference based parametric and non-parametric techniques are discussed to analyze the impulse response results in both time and frequency domain. The proposed techniques can extract open-loop phase margin and closed-loop unity-gain frequency within 5.2% and 4.1% error, respectively, for the load current range of 30-200mA. Converter parameters such as natural frequency (ω_n ), quality factor (Q), and center frequency (ω_c ) can be estimated within 3.6%, 4.7%, and 3.8% error respectively, over load inductance of 4.7-10.3µH, and filter capacitance of 200-400nF. A 5-MHz switching frequency, 5-8.125V input voltage range, voltage-mode controlled DC-DC buck converter is designed for the proposed built-in self-test (BIST) analysis. The converter output voltage range is 3.3-5V and the supported maximum load current is 450mA. The peak efficiency of the converter is 87.93%. The proposed converter is fabricated on a 0.6µm 6-layer-metal Silicon-On-Insulator (SOI) technology with a die area of 9mm^2 . The area impact due to the system identification blocks including related I/O structures is 3.8% and they consume 530µA quiescent current during operation.Dissertation/ThesisDoctoral Dissertation Electrical Engineering 201

    Symmetry-based A/M-S BIST (SymBIST): Demonstration on a SAR ADC IP

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    International audienceIn this paper, we propose a defect-oriented Built-In Self-Test (BIST) paradigm for analog and mixed-signal (A/M-S) Integrated Circuits (ICs), called symmetry-based BIST (Sym-BIST). SymBIST exploits inherent symmetries into the design to generate invariances that should hold true only in defect-free operation. Violation of any of these invariances points to defect detection. We demonstrate SymBIST on a 65nm 10-bit Successive Approximation Register (SAR) Analog-to-Digital Converter (ADC) IP by ST Microelectronics

    Design and debugging of multi-step analog to digital converters

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    With the fast advancement of CMOS fabrication technology, more and more signal-processing functions are implemented in the digital domain for a lower cost, lower power consumption, higher yield, and higher re-configurability. The trend of increasing integration level for integrated circuits has forced the A/D converter interface to reside on the same silicon in complex mixed-signal ICs containing mostly digital blocks for DSP and control. However, specifications of the converters in various applications emphasize high dynamic range and low spurious spectral performance. It is nontrivial to achieve this level of linearity in a monolithic environment where post-fabrication component trimming or calibration is cumbersome to implement for certain applications or/and for cost and manufacturability reasons. Additionally, as CMOS integrated circuits are accomplishing unprecedented integration levels, potential problems associated with device scaling – the short-channel effects – are also looming large as technology strides into the deep-submicron regime. The A/D conversion process involves sampling the applied analog input signal and quantizing it to its digital representation by comparing it to reference voltages before further signal processing in subsequent digital systems. Depending on how these functions are combined, different A/D converter architectures can be implemented with different requirements on each function. Practical realizations show the trend that to a first order, converter power is directly proportional to sampling rate. However, power dissipation required becomes nonlinear as the speed capabilities of a process technology are pushed to the limit. Pipeline and two-step/multi-step converters tend to be the most efficient at achieving a given resolution and sampling rate specification. This thesis is in a sense unique work as it covers the whole spectrum of design, test, debugging and calibration of multi-step A/D converters; it incorporates development of circuit techniques and algorithms to enhance the resolution and attainable sample rate of an A/D converter and to enhance testing and debugging potential to detect errors dynamically, to isolate and confine faults, and to recover and compensate for the errors continuously. The power proficiency for high resolution of multi-step converter by combining parallelism and calibration and exploiting low-voltage circuit techniques is demonstrated with a 1.8 V, 12-bit, 80 MS/s, 100 mW analog to-digital converter fabricated in five-metal layers 0.18-µm CMOS process. Lower power supply voltages significantly reduce noise margins and increase variations in process, device and design parameters. Consequently, it is steadily more difficult to control the fabrication process precisely enough to maintain uniformity. Microscopic particles present in the manufacturing environment and slight variations in the parameters of manufacturing steps can all lead to the geometrical and electrical properties of an IC to deviate from those generated at the end of the design process. Those defects can cause various types of malfunctioning, depending on the IC topology and the nature of the defect. To relive the burden placed on IC design and manufacturing originated with ever-increasing costs associated with testing and debugging of complex mixed-signal electronic systems, several circuit techniques and algorithms are developed and incorporated in proposed ATPG, DfT and BIST methodologies. Process variation cannot be solved by improving manufacturing tolerances; variability must be reduced by new device technology or managed by design in order for scaling to continue. Similarly, within-die performance variation also imposes new challenges for test methods. With the use of dedicated sensors, which exploit knowledge of the circuit structure and the specific defect mechanisms, the method described in this thesis facilitates early and fast identification of excessive process parameter variation effects. The expectation-maximization algorithm makes the estimation problem more tractable and also yields good estimates of the parameters for small sample sizes. To allow the test guidance with the information obtained through monitoring process variations implemented adjusted support vector machine classifier simultaneously minimize the empirical classification error and maximize the geometric margin. On a positive note, the use of digital enhancing calibration techniques reduces the need for expensive technologies with special fabrication steps. Indeed, the extra cost of digital processing is normally affordable as the use of submicron mixed signal technologies allows for efficient usage of silicon area even for relatively complex algorithms. Employed adaptive filtering algorithm for error estimation offers the small number of operations per iteration and does not require correlation function calculation nor matrix inversions. The presented foreground calibration algorithm does not need any dedicated test signal and does not require a part of the conversion time. It works continuously and with every signal applied to the A/D converter. The feasibility of the method for on-line and off-line debugging and calibration has been verified by experimental measurements from the silicon prototype fabricated in standard single poly, six metal 0.09-µm CMOS process

    A built-in self-test technique for high speed analog-to-digital converters

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    Fundação para a Ciência e a Tecnologia (FCT) - PhD grant (SFRH/BD/62568/2009
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