A Logic Simplification Approach for Very Large Scale Crosstalk Circuit Designs

Crosstalk computing, involving engineered interference between nanoscale metal lines, offers a fresh perspective to scaling through co-existence with CMOS. Through capacitive manipulations and innovative circuit style, not only primitive gates can be implemented, but custom logic cells such as an Adder, Subtractor can be implemented with huge gains. Our simulations show over 5x density and 2x power benefits over CMOS custom designs at 16nm [1]. This paper introduces the Crosstalk circuit style and a key method for large-scale circuit synthesis utilizing existing EDA tool flow. We propose to manipulate the CMOS synthesis flow by adding two extra steps: conversion of the gate-level netlist to Crosstalk implementation friendly netlist through logic simplification and Crosstalk gate mapping, and the inclusion of custom cell libraries for automated placement and layout. Our logic simplification approach first converts Cadence generated structured netlist to Boolean expressions and then uses the majority synthesis tool to obtain majority functions, which is further used to simplify functions for Crosstalk friendly implementations. We compare our approach of logic simplification to that of CMOS and majority logic-based approaches. Crosstalk circuits share some similarities to majority synthesis that are typically applied to Quantum Cellular Automata technology. However, our investigation shows that by closely following Crosstalk's core circuit styles, most benefits can be achieved. In the best case, our approach shows 36% density improvements over majority synthesis for MCNC benchmark

Challenges and solutions for large-scale integration of emerging technologies

Title from PDF of title page viewed June 15, 2021Dissertation advisor: Mostafizur RahmanVitaIncludes bibliographical references (pages 67-88)Thesis (Ph.D.)--School of Computing and Engineering and Department of Physics and Astronomy. University of Missouri--Kansas City, 2021The semiconductor revolution so far has been primarily driven by the ability to shrink devices and interconnects proportionally (Moore's law) while achieving incremental benefits. In sub-10nm nodes, device scaling reaches its fundamental limits, and the interconnect bottleneck is dominating power and performance. As the traditional way of CMOS scaling comes to an end, it is essential to find an alternative to continue this progress. However, an alternative technology for general-purpose computing remains elusive; currently pursued research directions face adoption challenges in all aspects from materials, devices to architecture, thermal management, integration, and manufacturing. Crosstalk Computing, a novel emerging computing technique, addresses some of the challenges and proposes a new paradigm for circuit design, scaling, and security. However, like other emerging technologies, Crosstalk Computing also faces challenges like designing large-scale circuits using existing CAD tools, scalability, evaluation and benchmarking of large-scale designs, experimentation through commercial foundry processes to compete/co-exist with CMOS for digital logic implementations. This dissertation addresses these issues by providing a methodology for circuit synthesis customizing the existing EDA tool flow, evaluating and benchmarking against state-of-the-art CMOS for large-scale circuits designed at 7nm from MCNC benchmark suits. This research also presents a study on Crosstalk technology's scalability aspects and shows how the circuits' properties evolve from 180nm to 7nm technology nodes. Some significant results are for primitive Crosstalk gate, designed in 180nm, 65nm, 32nm, and 7nm technology nodes, the average reduction in power is 42.5%, and an average improvement in performance is 34.5% comparing to CMOS for all mentioned nodes. For benchmarking large-scale circuits designed at 7nm, there are 48%, 57%, and 10% improvements against CMOS designs in terms of density, power, and performance, respectively. An experimental demonstration of a proof-of-concept prototype chip for Crosstalk Computing at TSMC 65nm technology is also presented in this dissertation, showing the Crosstalk gates can be realized using the existing manufacturing process. Additionally, the dissertation also provides a fine-grained thermal management approach for emerging technologies like transistor-level 3-D integration (Monolithic 3-D, Skybridge, SN3D), which holds the most promise beyond 2-D CMOS technology. However, such 3-D architectures within small form factors increase hotspots and demand careful consideration of thermal management at all integration levels. This research proposes a new direction for fine-grained thermal management approach for transistor-level 3-D integrated circuits through the insertion of architected heat extraction features that can be part of circuit design, and an integrated methodology for thermal evaluation of 3-D circuits combining different simulation outcomes at advanced nodes, which can be integrated to traditional CAD flow. The results show that the proposed heat extraction features effectively reduce the temperature from a heated location. Thus, the dissertation provides a new perspective to overcome the challenges faced by emerging technologies where the device, circuit, connectivity, heat management, and manufacturing are addressed in an integrated manner.Introduction and motivation -- Cross talk computing overview -- Logic simplification approach for Crosstalk circuit design -- Crostalk computing scalability study: from 180 nm to 7 nm -- Designing large*scale circuits in Crosstalk at 7 nm -- Comparison and benchmarking -- Experimental demonstration of Crosstalk computing -- Thermal management challenges and mitigation techniques for transistor-level- 3D integratio

Design and practical realization of polymorphic crosstalk circuits using 65nm TSMC PDK

Title from PDF of title page viewed January 14, 2020Thesis advisor: Mostafizur RahmanVitaIncludes bibliographical references (page 54-56)Thesis (M.S.)--School of Computing and Engineering. University of Missouri--Kansas City. 2019As the technology node scales down, the coupling capacitance between the adjacent metal lines increases. With an increase in this electrostatic coupling, the unwanted signal interference also increases, which is popularly called as Crosstalk. In conventional circuits, the Crosstalk affects either functionality or performance or both. Therefore the Crosstalk is always considered as detrimental to the circuits, and we always try to filter out the Crosstalk noise from signals. Crosstalk Computing Technology tries to astutely turn this unwanted coupling capacitance into computing principle for digital logic gates[1, 2]. The special feature of the crosstalk circuits is its inherent circuit mechanism to build polymorphic logic gates[3]. Our team has previously demonstrated various fundamental polymorphic logic circuits [1-6,16-18]. This thesis shows the design of the large-scale polymorphic crosstalk circuits such as Multiplier–Sorter, Multiplier–Sorter–Adder using the fundamental polymorphic gates, and also analyzes the Power, Performance, and Area (PPA) for these large-scale designs. Similar to the basic and complex polymorphic gates, the functionality of the large-scale polymorphic circuits can also be altered using the control signals. Owing to their multi-functional embodiment in a single circuit, polymorphic circuits find a myriad of useful applications such as reconfigurable system design, resource sharing, hardware security, and fault-tolerant circuit design, etc. [3]. Also, in this thesis, a lot of studies have been done on the variability (PVT analysis) of Crosstalk Circuits. This PVT variation analysis establishes the circuit design requirements in terms of coupling capacitances and fan-in limitation that allows reliable operation of the Crosstalk gates under Process, Voltage and Temperature variations. As an example, I also elaborate on the reason for which the full adder can’t be implemented as a single gate in the crosstalk circuit-style at lower technology nodes. Though we designed a variety of basic and complex logic gates and crosstalk polymorphic gates, the biggest question is “Will these crosstalk gates work reliably on silicon owing to their new circuit requirements and technological challenges?”. Trying to answer the above question, the whole thesis is mainly focused on the physical implementation of the crosstalk gates at 65nm. I will detail the steps that we have performed while designing the crosstalk circuits and their layouts, the challenges we faced while implementing the new circuit techniques using conventional design approaches and PDK, and their solutions, specifically during layout design and verification. The other potential application of crosstalk circuits is in non-linear analog circuits: Analog-to-Digital Converter (ADC) [4], Digital-to-Analog Converter (DAC), and Comparator. In this thesis, I have shown how the deterministic charge summation principle that is used in digital crosstalk gates can also be used to implement the non-linear analog circuits.Introduction -- Polymorphic Crosstalk circuit design -- Practical realization of Crosstalk circuits -- PVT variation analysis -- Difficulties or errors in layout design and full chip details -- Potential miscellaneous applications -- Conclusion and future wor

Synthesis for circuit reliability

textElectrical and Computer Engineerin

Control Paradigms for Quantum Engineering

We give an overview of different paradigms for control of quantum systems and their applications, illustrated with specific examples. We further discuss the implications of fault-tolerance requirements for quantum process engineering using optimal control, and explore the possibilities for architecture simplification and effective control using a minimum number of simple switch actuators.Comment: 6 pages, presented at ISCCP08 in Malta, to appear in IEEE Proceeding

A direct-sequence spread-spectrum communication system for integrated sensor microsystems

Some of the most important challenges in health-care technologies have been identified to be development of noninvasive systems and miniaturization. In developing the core technologies, progress is required in pushing the limits of miniaturization, minimizing the costs and power consumption of microsystems components, developing mobile/wireless communication infrastructures and computing technologies that are reliable. The implementation of such miniaturized systems has become feasible by the advent of system-on-chip technology, which enables us to integrate most of the components of a system on to a single chip. One of the most important tasks in such a system is to convey information reliably on a multiple-access-based environment. When considering the design of telecommunication system for such a network, the receiver is the key performance critical block. The paper describes the application environment, the choice of the communication protocol, the implementation of the transmitter and receiver circuitry, and research work carried out on studying the impact of input data characteristics and internal data path complexity on area and power performance of the receiver. We provide results using a test data recorded from a pH sensor. The results demonstrate satisfying functionality, area, and power constraints even when a degree of programmability is incorporated in the system

ENHANCEMENT OF MARKOV RANDOM FIELD MECHANISM TO ACHIEVE FAULT-TOLERANCE IN NANOSCALE CIRCUIT DESIGN

As the MOSFET dimensions scale down towards nanoscale level, the reliability of circuits based on these devices decreases. Hence, designing reliable systems using these nano-devices is becoming challenging. Therefore, a mechanism has to be devised that can make the nanoscale systems perform reliably using unreliable circuit components. The solution is fault-tolerant circuit design. Markov Random Field (MRF) is an effective approach that achieves fault-tolerance in integrated circuit design. The previous research on this technique suffers from limitations at the design, simulation and implementation levels. As improvements, the MRF fault-tolerance rules have been validated for a practical circuit example. The simulation framework is extended from thermal to a combination of thermal and random telegraph signal (RTS) noise sources to provide a more rigorous noise environment for the simulation of circuits build on nanoscale technologies. Moreover, an architecture-level improvement has been proposed in the design of previous MRF gates. The redesigned MRF is termed as Improved-MRF. The CMOS, MRF and Improved-MRF designs were simulated under application of highly noisy inputs. On the basis of simulations conducted for several test circuits, it is found that Improved-MRF circuits are 400 whereas MRF circuits are only 10 times more noise-tolerant than the CMOS alternatives. The number of transistors, on the other hand increased from a factor of 9 to 15 from MRF to Improved-MRF respectively (as compared to the CMOS). Therefore, in order to provide a trade-off between reliability and the area overhead required for obtaining a fault-tolerant circuit, a novel parameter called as ‘Reliable Area Index’ (RAI) is introduced in this research work. The value of RAI exceeds around 1.3 and 40 times for MRF and Improved-MRF respectively as compared to CMOS design which makes Improved- MRF to be still 30 times more efficient circuit design than MRF in terms of maintaining a suitable trade-off between reliability and area-consumption of the circuit

On Timing Model Extraction and Hierarchical Statistical Timing Analysis

In this paper, we investigate the challenges to apply Statistical Static Timing Analysis (SSTA) in hierarchical design flow, where modules supplied by IP vendors are used to hide design details for IP protection and to reduce the complexity of design and verification. For the three basic circuit types, combinational, flip-flop-based and latch-controlled, we propose methods to extract timing models which contain interfacing as well as compressed internal constraints. Using these compact timing models the runtime of full-chip timing analysis can be reduced, while circuit details from IP vendors are not exposed. We also propose a method to reconstruct the correlation between modules during full-chip timing analysis. This correlation can not be incorporated into timing models because it depends on the layout of the corresponding modules in the chip. In addition, we investigate how to apply the extracted timing models with the reconstructed correlation to evaluate the performance of the complete design. Experiments demonstrate that using the extracted timing models and reconstructed correlation full-chip timing analysis can be several times faster than applying the flattened circuit directly, while the accuracy of statistical timing analysis is still well maintained

An Electromigration and Thermal Model of Power Wires for a Priori High-Level Reliability Prediction

In this paper, a simple power-distribution electrothermal model including the interconnect self-heating is used together with a statistical model of average and rms currents of functional blocks and a high-level model of fanout distribution and interconnect wirelength. Following the 2001 SIA roadmap projections, we are able to predict a priori that the minimum width that satisfies the electromigration constraints does not scale like the minimum metal pitch in future technology nodes. As a consequence, the percentage of chip area covered by power lines is expected to increase at the expense of wiring resources unless proper countermeasures are taken. Some possible solutions are proposed in the paper