Geometrically-constrained, parasitic-aware synthesis of analog ICs

In order to speed up the design process of analog ICs, iterations between different design stages should be avoided as much as possible. More specifically, spins between electrical and physical synthesis should be reduced for this is a very time-consuming task: if circuit performance including layout-induced degradations proves unacceptable, a re-design cycle must be entered, and electrical, physical, or both synthesis processes, would have to be repeated. It is also worth noting that if geometric optimization (e.g., area minimization) is undertaken after electrical synthesis, it may add up as another source of unexpected degradation of the circuit performance due to the impact of the geometric variables (e.g., transistor folds) on the device and the routing parasitic values. This awkward scenario is caused by the complete separation of said electrical and physical synthesis, a design practice commonly followed so far. Parasitic-aware synthesis, consisting in including parasitic estimates to the circuit netlist directly during electrical synthesis, has been proposed as solution. While most of the reported contributions either tackle parasitic-aware synthesis without paying special attention to geometric optimization or approach both issues only partially, this paper addresses the problem in a unified way. In what has been called layout-aware electrical synthesis, a simulation-based optimization algorithm explores the design space with geometric variables constrained to meet certain user-defined goals, which provides reliable estimates of layout-induced parasitics at each iteration, and, thereby, accurate evaluation of the circuit ultimate performance. This technique, demonstrated here through several design examples, requires knowing layout details beforehand; to facilitate this, procedural layout generation is used as physical synthesis approach due to its rapidness and ability to capture analog layout know-how.Ministerio de Educación y Ciencia TEC2004-0175

An Elitist Non-Dominated Multi-Objective Genetic Algorithm Based Temperature Aware Circuit Synthesis

At sub-nanometre technology, temperature is one of the important design parameters to be taken care of during the target implementation for the circuit for its long term and reliable operation. High device package density leads to high power density that generates high temperatures. The temperature of a chip is directly proportional to the power density of the chip. So, the power density of a chip can be minimized to reduce the possibility of the high temperature generation. Temperature minimization approaches are generally addressed at the physical design level but it incurs high cooling cost. To reduce the cooling cost, the temperature minimization approaches can be addressed at the logic level. In this work, the Non-Dominated Sorting Genetic Algorithm-II (NSGA-II) based multi-objective heuristic approach is proposed to select the efficient input variable polarity of Mixed Polarity Reed-Muller (MPRM) expansion for simultaneous optimization of area, power, and temperature. A Pareto optimal solution set is obtained from the vast solution set of 3n (‘n’ is the number of input variables) different polarities of MPRM. Tabular technique is used for input polarity conversion from Sum-of-Product (SOP) form to MPRM form. Finally, using CADENCE and HotSpot tool absolute temperature, silicon area and power consumption of the synthesized circuits are calculated and are reported. The proposed algorithm saves around 76.20% silicon area, 29.09% power dissipation and reduces 17.06% peak temperature in comparison with the reported values in the literature

Constraint-Aware, Scalable, and Efficient Algorithms for Multi-Chip Power Module Layout Optimization

Moving towards an electrified world requires ultra high-density power converters. Electric vehicles, electrified aerospace, data centers, etc. are just a few fields among wide application areas of power electronic systems, where high-density power converters are essential. As a critical part of these power converters, power semiconductor modules and their layout optimization has been identified as a crucial step in achieving the maximum performance and density for wide bandgap technologies (i.e., GaN and SiC). New packaging technologies are also introduced to produce reliable and efficient multichip power module (MCPM) designs to push the current limits. The complexity of the emerging MCPM layouts is surpassing the capability of a manual, iterative design process to produce an optimum design with agile development requirements. An electronic design automation tool called PowerSynth has been introduced with ongoing research toward enhanced capabilities to speed up the optimized MCPM layout design process. This dissertation presents the PowerSynth progression timeline with the methodology updates and corresponding critical results compared to v1.1. The first released version (v1.1) of PowerSynth demonstrated the benefits of layout abstraction, and reduced-order modeling techniques to perform rapid optimization of the MCPM module compared to the traditional, manual, and iterative design approach. However, that version is limited by several key factors: layout representation technique, layout generation algorithms, iterative design-rule-checking (DRC), optimization algorithm candidates, etc. To address these limitations, and enhance PowerSynth’s capabilities, constraint-aware, scalable, and efficient algorithms have been developed and implemented. PowerSynth layout engine has evolved from v1.3 to v2.0 throughout the last five years to incorporate the algorithm updates and generate all 2D/2.5D/3D Manhattan layout solutions. These fundamental changes in the layout generation methodology have also called for updates in the performance modeling techniques and enabled exploring different optimization algorithms. The latest PowerSynth 2 architecture has been implemented to enable electro-thermo-mechanical and reliability optimization on 2D/2.5D/3D MCPM layouts, and set up a path toward cabinet-level optimization. PowerSynth v2.0 computer-aided design (CAD) flow has been hardware-validated through manufacturing and testing of an optimized novel 3D MCPM layout. The flow has shown significant speedup compared to the manual design flow with a comparable optimization result

Heurísticas bioinspiradas para el problema de Floorplanning 3D térmico de dispositivos MPSoCs

Tesis inédita de la Universidad Complutense de Madrid, Facultad de Informática, Departamento de Arquitectura de Computadores y Automática, leída el 20-06-2013Depto. de Arquitectura de Computadores y AutomáticaFac. de InformáticaTRUEunpu

A framework for fine-grain synthesis optimization of operational amplifiers

This thesis presents a cell-level framework for Operational Amplifiers Synthesis (OASYN) coupling both circuit design and layout. For circuit design, the tool applies a corner-driven optimization, accounting for on-chip performance variations. By exploring the process, voltage, and temperature variations space, the tool extracts design worst case solution. The tool undergoes sensitivity analysis along with Pareto-optimality to achieve required specifications. For layout phase, OASYN generates a DRC proved automated layout based on a sized circuit-level description. Morata et al. (1996) introduced an elegant representation of block placement called sequence pair for general floorplans (SP). Like TCG and BSG, but unlike O-tree, B*tree, and CBL, SP is P-admissible. Unlike SP, TCG supports incremental update during operation and keeps the information of the boundary modules as well as their relative positions in the representation. Block placement algorithms that are based on SP use heuristic optimization algorithms, e.g., simulated annealing where generation of large number of sequence pairs are required. Therefore a fast algorithm is needed to generate sequence pairs after each solution perturbation. The thesis presents a new simple and efficient O(n) runtime algorithm for fast realization of incremental update for cost evaluation. The algorithm integrates sequence pair and transitive closure graph advantages into TCG-S* a superior topology update scheme which facilitates the search for optimum desired floorplan. Experiments show that TCG-S* is better than existing works in terms of area utilization and convergence speed. Routing-aware placement is implemented in OASYN, handling symmetry constraints, e.g., interdigitization, common centroid, along with congestion elimination and the enhancement of placement routability

On three soft rectangle packing problems with guillotine constraints

We investigate how to partition a rectangular region of length $L_1$ and height $L_2$ into $n$ rectangles of given areas $(a_1, \dots, a_n)$ using two-stage guillotine cuts, so as to minimize either (i) the sum of the perimeters, (ii) the largest perimeter, or (iii) the maximum aspect ratio of the rectangles. These problems play an important role in the ongoing Vietnamese land-allocation reform, as well as in the optimization of matrix multiplication algorithms. We show that the first problem can be solved to optimality in $\mathcal{O}(n \log n)$, while the two others are NP-hard. We propose mixed integer programming (MIP) formulations and a binary search-based approach for solving the NP-hard problems. Experimental analyses are conducted to compare the solution approaches in terms of computational efficiency and solution quality, for different objectives