A fault-tolerant routing strategy for k-ary n-direct s-indirect topologies based on intermediate nodes

[EN] Exascale computing systems are being built with thousands of nodes. The high number of components of these systems significantly increases the probability of failure. A key component for them is the interconnection network. If failures occur in the interconnection network, they may isolate a large fraction of the machine. For this reason, an efficient fault-tolerant mechanism is needed to keep the system interconnected, even in the presence of faults. A recently proposed topology for these large systems is the hybrid k-ary n-direct s-indirect family that provides optimal performance and connectivity at a reduced hardware cost. This paper presents a fault-tolerant routing methodology for the k-ary n-direct s-indirect topology that degrades performance gracefully in presence of faults and tolerates a large number of faults without disabling any healthy computing node. In order to tolerate network failures, the methodology uses a simple mechanism. For any source-destination pair, if necessary, packets are forwarded to the destination node through a set of intermediate nodes (without being ejected from the network) with the aim of circumventing faults. The evaluation results shows that the proposed methodology tolerates a large number of faults. For instance, it is able to tolerate more than 99.5% of fault combinations when there are 10 faults in a 3-D network with 1000 nodes using only 1 intermediate node and more than 99.98% if 2 intermediate nodes are used. Furthermore, the methodology offers a gracious performance degradation. As an example, performance degrades only by 1% for a 2-D network with 1024 nodes and 1% faulty links.This work was supported by the Spanish Ministerio de Economía y Competitividad (MINECO), by FEDER funds under Grant TIN2015-66972-C5-1-R, by Programa de Ayudas de Investigación y Desarrollo (PAID) from Universitat Politècnica de alència and by the financial support of the FP7 HiPEAC Network of Excellence under grant agreement 287759Peñaranda Cebrián, R.; Gómez Requena, ME.; López Rodríguez, PJ.; Gran, EG.; Skeie, T. (2017). A fault-tolerant routing strategy for k-ary n-direct s-indirect topologies based on intermediate nodes. Concurrency and Computation Practice and Experience. 29(13):1-11. https://doi.org/10.1002/cpe.4065S111291

New Fault Tolerant Multicast Routing Techniques to Enhance Distributed-Memory Systems Performance

Distributed-memory systems are a key to achieve high performance computing and the most favorable architectures used in advanced research problems. Mesh connected multicomputer are one of the most popular architectures that have been implemented in many distributed-memory systems. These systems must support communication operations efficiently to achieve good performance. The wormhole switching technique has been widely used in design of distributed-memory systems in which the packet is divided into small flits. Also, the multicast communication has been widely used in distributed-memory systems which is one source node sends the same message to several destination nodes. Fault tolerance refers to the ability of the system to operate correctly in the presence of faults. Development of fault tolerant multicast routing algorithms in 2D mesh networks is an important issue. This dissertation presents, new fault tolerant multicast routing algorithms for distributed-memory systems performance using wormhole routed 2D mesh. These algorithms are described for fault tolerant routing in 2D mesh networks, but it can also be extended to other topologies. These algorithms are a combination of a unicast-based multicast algorithm and tree-based multicast algorithms. These algorithms works effectively for the most commonly encountered faults in mesh networks, f-rings, f-chains and concave fault regions. It is shown that the proposed routing algorithms are effective even in the presence of a large number of fault regions and large size of fault region. These algorithms are proved to be deadlock-free. Also, the problem of fault regions overlap is solved. Four essential performance metrics in mesh networks will be considered and calculated; also these algorithms are a limited-global-information-based multicasting which is a compromise of local-information-based approach and global-information-based approach. Data mining is used to validate the results and to enlarge the sample. The proposed new multicast routing techniques are used to enhance the performance of distributed-memory systems. Simulation results are presented to demonstrate the efficiency of the proposed algorithms

Efficient mechanisms to provide fault tolerance in interconnection networks for pc clusters

Actualmente, los clusters de PC son un alternativa rentable a los computadores paralelos. En estos sistemas, miles de componentes (procesadores y/o discos duros) se conectan a través de redes de interconexión de altas prestaciones. Entre las tecnologías de red actualmente disponibles para construir clusters, InfiniBand (IBA) ha emergido como un nuevo estándar de interconexión para clusters. De hecho, ha sido adoptado por muchos de los sistemas más potentes construidos actualmente (lista top500). A medida que el número de nodos aumenta en estos sistemas, la red de interconexión también crece. Junto con el aumento del número de componentes la probabilidad de averías aumenta dramáticamente, y así, la tolerancia a fallos en el sistema en general, y de la red de interconexión en particular, se convierte en una necesidad. Desafortunadamente, la mayor parte de las estrategias de encaminamiento tolerantes a fallos propuestas para los computadores masivamente paralelos no pueden ser aplicadas porque el encaminamiento y las transiciones de canal virtual son deterministas en IBA, lo que impide que los paquetes eviten los fallos. Por lo tanto, son necesarias nuevas estrategias para tolerar fallos. Por ello, esta tesis se centra en proporcionar los niveles adecuados de tolerancia a fallos a los clusters de PC, y en particular a las redes IBA. En esta tesis proponemos y evaluamos varios mecanismos adecuados para las redes de interconexión para clusters. El primer mecanismo para proporcionar tolerancia a fallos en IBA (al que nos referimos como encaminamiento tolerante a fallos basado en transiciones; TFTR) consiste en usar varias rutas disjuntas entre cada par de nodos origen-destino y seleccionar la ruta apropiada en el nodo fuente usando el mecanismo APM proporcionado por IBA. Consiste en migrar las rutas afectadas por el fallo a las rutas alternativas sin fallos. Sin embargo, con este fin, es necesario un algoritmo eficiente de encaminamiento capaz de proporcionar suficientesMontañana Aliaga, JM. (2008). Efficient mechanisms to provide fault tolerance in interconnection networks for pc clusters [Tesis doctoral no publicada]. Universitat Politècnica de València. https://doi.org/10.4995/Thesis/10251/2603Palanci

Développement d'architectures HW/SW tolérantes aux fautes et auto-calibrantes pour les technologies Intégrées 3D

Malgré les avantages de l'intégration 3D, le test, le rendement et la fiabilité des Through-Silicon-Vias (TSVs) restent parmi les plus grands défis pour les systèmes 3D à base de Réseaux-sur-Puce (Network-on-Chip - NoC). Dans cette thèse, une stratégie de test hors-ligne a été proposé pour les interconnections TSV des liens inter-die des NoCs 3D. Pour le TSV Interconnect Built-In Self-Test (TSV-IBIST) on propose une nouvelle stratégie pour générer des vecteurs de test qui permet la détection des fautes structuraux (open et short) et paramétriques (fautes de délaye). Des stratégies de correction des fautes transitoires et permanents sur les TSV sont aussi proposées aux plusieurs niveaux d'abstraction: data link et network. Au niveau data link, des techniques qui utilisent des codes de correction (ECC) et retransmission sont utilisées pour protégé les liens verticales. Des codes de correction sont aussi utilisés pour la protection au niveau network. Les défauts de fabrication ou vieillissement des TSVs sont réparé au niveau data link avec des stratégies à base de redondance et sérialisation. Dans le réseau, les liens inter-die défaillante ne sont pas utilisables et un algorithme de routage tolérant aux fautes est proposé. On peut implémenter des techniques de tolérance aux fautes sur plusieurs niveaux. Les résultats ont montré qu'une stratégie multi-level atteint des très hauts niveaux de fiabilité avec un cout plus bas. Malheureusement, il n'y as pas une solution unique et chaque stratégie a ses avantages et limitations. C'est très difficile d'évaluer tôt dans le design flow les couts et l'impact sur la performance. Donc, une méthodologie d'exploration de la résilience aux fautes est proposée pour les NoC 3D mesh.3D technology promises energy-efficient heterogeneous integrated systems, which may open the way to thousands cores chips. Silicon dies containing processing elements are stacked and connected by vertical wires called Through-Silicon-Vias. In 3D chips, interconnecting an increasing number of processing elements requires a scalable high-performance interconnect solution: the 3D Network-on-Chip. Despite the advantages of 3D integration, testing, reliability and yield remain the major challenges for 3D NoC-based systems. In this thesis, the TSV interconnect test issue is addressed by an off-line Interconnect Built-In Self-Test (IBIST) strategy that detects both structural (i.e. opens, shorts) and parametric faults (i.e. delays and delay due to crosstalk). The IBIST circuitry implements a novel algorithm based on the aggressor-victim scenario and alleviates limitations of existing strategies. The proposed Kth-aggressor fault (KAF) model assumes that the aggressors of a victim TSV are neighboring wires within a distance given by the aggressor order K. Using this model, TSV interconnect tests of inter-die 3D NoC links may be performed for different aggressor order, reducing test times and circuitry complexity. In 3D NoCs, TSV permanent and transient faults can be mitigated at different abstraction levels. In this thesis, several error resilience schemes are proposed at data link and network levels. For transient faults, 3D NoC links can be protected using error correction codes (ECC) and retransmission schemes using error detection (Automatic Retransmission Query) and correction codes (i.e. Hybrid error correction and retransmission).For transients along a source-destination path, ECC codes can be implemented at network level (i.e. Network-level Forward Error Correction). Data link solutions also include TSV repair schemes for faults due to fabrication processes (i.e. TSV-Spare-and-Replace and Configurable Serial Links) and aging (i.e. Interconnect Built-In Self-Repair and Adaptive Serialization) defects. At network-level, the faulty inter-die links of 3D mesh NoCs are repaired by implementing a TSV fault-tolerant routing algorithm. Although single-level solutions can achieve the desired yield / reliability targets, error mitigation can be realized by a combination of approaches at several abstraction levels. To this end, multi-level error resilience strategies have been proposed. Experimental results show that there are cases where this multi-layer strategy pays-off both in terms of cost and performance. Unfortunately, one-fits-all solution does not exist, as each strategy has its advantages and limitations. For system designers, it is very difficult to assess early in the design stages the costs and the impact on performance of error resilience. Therefore, an error resilience exploration (ERX) methodology is proposed for 3D NoCs.SAVOIE-SCD - Bib.électronique (730659901) / SudocGRENOBLE1/INP-Bib.électronique (384210012) / SudocGRENOBLE2/3-Bib.électronique (384219901) / SudocSudocFranceF