Performance enhancement in the desing of amplifier and amplifier-less circuits in modern CMOS technologies.

In the context of nowadays CMOS technology downscaling and the increasing demand of high performance electronics by industry and consumers, analog design has become a major challenge. On the one hand, beyond others, amplifiers have traditionally been a key cell for many analog systems whose overall performance strongly depends on those of the amplifier. Consequently, still today, achieving high performance amplifiers is essential. On the other hand, due to the increasing difficulty in achieving high performance amplifiers in downscaled modern technologies, a different research line that replaces the amplifier by other more easily achievable cells appears: the so called amplifier-less techniques. This thesis explores and contributes to both philosophies. Specifically, a lowvoltage differential input pair is proposed, with which three multistage amplifiers in the state of art are designed, analysed and tested. Moreover, a structure for the implementation of differential switched capacitor circuits, specially suitable for comparator-based circuits, that features lower distortion and less noise than the classical differential structures is proposed, an, as a proof of concept, implemented in a ΔΣ modulator

Design Techniques for High Speed Low Voltage and Low Power Non-Calibrated Pipeline Analog to Digital Converters

The profound digitization of modern microelectronic modules made Analog-to- Digital converters (ADC) key components in many systems. With resolutions up to 14bits and sampling rates in the 100s of MHz, the pipeline ADC is a prime candidate for a wide range of applications such as instrumentation, communications and consumer electronics. However, while past work focused on enhancing the performance of the pipeline ADC from an architectural standpoint, little has been done to individually address its fundamental building blocks. This work aims to achieve the latter by proposing design techniques to improve the performance of these blocks with minimal power consumption in low voltage environments, such that collectively high performance is achieved in the pipeline ADC. Towards this goal, a Recycling Folded Cascode (RFC) amplifier is proposed as an enhancement to the general performance of the conventional folded cascode. Tested in Taiwan Semiconductor Manufacturing Company (TSMC) 0.18?m Complementary Metal Oxide Semiconductor (CMOS) technology, the RFC provides twice the bandwidth, 8-10dB additional gain, more than twice the slew rate and improved noise performance over the conventional folded cascode-all at no additional power or silicon area. The direct auto-zeroing offset cancellation scheme is optimized for low voltage environments using a dual level common mode feedback (CMFB) circuit, and amplifier differential offsets up to 50mV are effectively cancelled. Together with the RFC, the dual level CMFB was used to implement a sample and hold amplifier driving a singleended load of 1.4pF and using only 2.6mA; at 200MS/s better than 9bit linearity is achieved. Finally a power conscious technique is proposed to reduce the kickback noise of dynamic comparators without resorting to the use of pre-amplifiers. When all techniques are collectively used to implement a 1Vpp 10bit 160MS/s pipeline ADC in Semiconductor Manufacturing International Corporation (SMIC) 0.18[mu]m CMOS, 9.2 effective number of bits (ENOB) is achieved with a near Nyquist-rate full scale signal. The ADC uses an area of 1.1mm2 and consumes 42mW in its analog core. Compared to recent state-of-the-art implementations in the 100-200MS/s range, the presented pipeline ADC uses the least power per conversion rated at 0.45pJ/conversion-step

Advanced Technology Large-Aperture Space Telescope (ATLAST): A Technology Roadmap for the Next Decade

The Advanced Technology Large-Aperture Space Telescope (ATLAST) is a set of mission concepts for the next generation of UVOIR space observatory with a primary aperture diameter in the 8-m to 16-m range that will allow us to perform some of the most challenging observations to answer some of our most compelling questions, including "Is there life elsewhere in the Galaxy?" We have identified two different telescope architectures, but with similar optical designs, that span the range in viable technologies. The architectures are a telescope with a monolithic primary mirror and two variations of a telescope with a large segmented primary mirror. This approach provides us with several pathways to realizing the mission, which will be narrowed to one as our technology development progresses. The concepts invoke heritage from HST and JWST design, but also take significant departures from these designs to minimize complexity, mass, or both. Our report provides details on the mission concepts, shows the extraordinary scientific progress they would enable, and describes the most important technology development items. These are the mirrors, the detectors, and the high-contrast imaging technologies, whether internal to the observatory, or using an external occulter. Experience with JWST has shown that determined competitors, motivated by the development contracts and flight opportunities of the new observatory, are capable of achieving huge advances in technical and operational performance while keeping construction costs on the same scale as prior great observatories.Comment: 22 pages, RFI submitted to Astro2010 Decadal Committe

Energy Efficient Pipeline ADCs Using Ring Amplifiers

Pipeline ADCs require accurate amplification. Traditionally, an operational transconductance amplifier (OTA) configured as a switched-capacitor (SC) amplifier performs such amplification. However, traditional OTAs limit the power efficiency of ADCs since they require high quiescent current for slewing and bandwidth. In addition, it is difficult to design low-voltage OTAs in modern, scaled CMOS. The ring amplifier is an energy efficient and high output swing alternative to an OTA for SC circuits which is basically a three-stage inverter amplifier stabilized in a feedback configuration. However, the conventional ring amplifier requires external biases, which makes the ring amplifier less practical when we consider process, supply voltage, and temperature (PVT) variation. In this dissertation, three types of innovative ring amplifiers are presented and verified with state-of-the-art energy efficient pipeline ADCs. These new ring amplifiers overcome the limitations of the conventional ring amplifier and further improve energy efficiency. The first topic of this dissertation is a self-biased ring amplifier that makes the ring amplifier more practical and power efficient, while maintaining the benefits of efficient slew-based charging and an almost rail-to-rail output swing. In addition, the ring amplifiers are also used as comparators in the 1.5b sub-ADCs by utilizing the unique characteristics of the ring amplifier. This removes the need for dedicated comparators in sub-ADCs, thus further reducing the power consumption of the ADC. The prototype 10.5b 100 MS/s comparator-less pipeline ADC with the self-biased ring amplifiers has measured SNDR, SNR and SFDR of 56.6 dB (9.11b), 57.5 dB and 64.7 dB, respectively, and consumes 2.46 mW, which results in Walden Figure-of-Merit (FoM) of 46.1 fJ/ conversion∙step. The second topic is a fully-differential ring amplifier, which solves the problems of single-ended ring amplifiers while maintaining the benefits of the single-ended ring amplifiers. This differential ring-amplifier is applied in a 13b 50 MS/s SAR-assisted pipeline ADC. Furthermore, an improved capacitive DAC switching method for the first stage SAR reduces the DAC linearity errors and switching energy. The prototype ADC achieves measured SNDR, SNR and SFDR of 70.9 dB (11.5b), 71.3 dB and 84.6 dB, respectively, and consumes 1 mW. This measured performance is equivalent to Walden and Schreier FoMs of 6.9 fJ/conversion∙step and 174.9 dB, respectively. Finally, a four-stage fully-differential ring amplifier improves the small-signal gain to over 90 dB without compromising speed. In addition, a new auto-zero noise filtering method reduces noise without consuming additional power. This is more area efficient than the conventional auto-zero noise folding reduction technique. A systematic mismatch free SAR CDAC layout method is also presented. The prototype 15b 100 MS/s calibration-free SAR-assisted pipeline ADC using the four-stage ring amplifier achieves 73.2 dB SNDR (11.9b) and 90.4 dB SFDR with a 1.1 V supply. It consumes 2.3 mW resulting in Schreier FoM of 176.6 dB.PHDElectrical EngineeringUniversity of Michigan, Horace H. Rackham School of Graduate Studieshttps://deepblue.lib.umich.edu/bitstream/2027.42/138759/1/yonglim_1.pd

Advanced CMOS Integrated Circuit Design and Application

The recent development of various application systems and platforms, such as 5G, B5G, 6G, and IoT, is based on the advancement of CMOS integrated circuit (IC) technology that enables them to implement high-performance chipsets. In addition to development in the traditional fields of analog and digital integrated circuits, the development of CMOS IC design and application in high-power and high-frequency operations, which was previously thought to be possible only with compound semiconductor technology, is a core technology that drives rapid industrial development. This book aims to highlight advances in all aspects of CMOS integrated circuit design and applications without discriminating between different operating frequencies, output powers, and the analog/digital domains. Specific topics in the book include: Next-generation CMOS circuit design and application; CMOS RF/microwave/millimeter-wave/terahertz-wave integrated circuits and systems; CMOS integrated circuits specially used for wireless or wired systems and applications such as converters, sensors, interfaces, frequency synthesizers/generators/rectifiers, and so on; Algorithm and signal-processing methods to improve the performance of CMOS circuits and systems

Ultra-low noise, high-frame rate readout design for a 3D-stacked CMOS image sensor

Due to the switch from CCD to CMOS technology, CMOS based image sensors have become smaller, cheaper, faster, and have recently outclassed CCDs in terms of image quality. Apart from the extensive set of applications requiring image sensors, the next technological breakthrough in imaging would be to consolidate and completely shift the conventional CMOS image sensor technology to the 3D-stacked technology. Stacking is recent and an innovative technology in the imaging field, allowing multiple silicon tiers with different functions to be stacked on top of each other. The technology allows for an extreme parallelism of the pixel readout circuitry. Furthermore, the readout is placed underneath the pixel array on a 3D-stacked image sensor, and the parallelism of the readout can remain constant at any spatial resolution of the sensors, allowing extreme low noise and a high-frame rate (design) at virtually any sensor array resolution. The objective of this work is the design of ultra-low noise readout circuits meant for 3D-stacked image sensors, structured with parallel readout circuitries. The readout circuit’s key requirements are low noise, speed, low-area (for higher parallelism), and low power. A CMOS imaging review is presented through a short historical background, followed by the description of the motivation, the research goals, and the work contributions. The fundamentals of CMOS image sensors are addressed, as a part of highlighting the typical image sensor features, the essential building blocks, types of operation, as well as their physical characteristics and their evaluation metrics. Following up on this, the document pays attention to the readout circuit’s noise theory and the column converters theory, to identify possible pitfalls to obtain sub-electron noise imagers. Lastly, the fabricated test CIS device performances are reported along with conjectures and conclusions, ending this thesis with the 3D-stacked subject issues and the future work. A part of the developed research work is located in the Appendices.Devido à mudança da tecnologia CCD para CMOS, os sensores de imagem em CMOS tornam se mais pequenos, mais baratos, mais rápidos, e mais recentemente, ultrapassaram os sensores CCD no que respeita à qualidade de imagem. Para além do vasto conjunto de aplicações que requerem sensores de imagem, o próximo salto tecnológico no ramo dos sensores de imagem é o de mudar completamente da tecnologia de sensores de imagem CMOS convencional para a tecnologia “3D-stacked”. O empilhamento de chips é relativamente recente e é uma tecnologia inovadora no campo dos sensores de imagem, permitindo vários planos de silício com diferentes funções poderem ser empilhados uns sobre os outros. Esta tecnologia permite portanto, um paralelismo extremo na leitura dos sinais vindos da matriz de píxeis. Além disso, num sensor de imagem de planos de silício empilhados, os circuitos de leitura estão posicionados debaixo da matriz de píxeis, sendo que dessa forma, o paralelismo pode manter-se constante para qualquer resolução espacial, permitindo assim atingir um extremo baixo ruído e um alto debito de imagens, virtualmente para qualquer resolução desejada. O objetivo deste trabalho é o de desenhar circuitos de leitura de coluna de muito baixo ruído, planeados para serem empregues em sensores de imagem “3D-stacked” com estruturas altamente paralelizadas. Os requisitos chave para os circuitos de leitura são de baixo ruído, rapidez e pouca área utilizada, de forma a obter-se o melhor rácio. Uma breve revisão histórica dos sensores de imagem CMOS é apresentada, seguida da motivação, dos objetivos e das contribuições feitas. Os fundamentos dos sensores de imagem CMOS são também abordados para expor as suas características, os blocos essenciais, os tipos de operação, assim como as suas características físicas e suas métricas de avaliação. No seguimento disto, especial atenção é dada à teoria subjacente ao ruído inerente dos circuitos de leitura e dos conversores de coluna, servindo para identificar os possíveis aspetos que dificultem atingir a tão desejada performance de muito baixo ruído. Por fim, os resultados experimentais do sensor desenvolvido são apresentados junto com possíveis conjeturas e respetivas conclusões, terminando o documento com o assunto de empilhamento vertical de camadas de silício, junto com o possível trabalho futuro

A high frame rate wearable EIT system using active electrode ASICs for lung respiration and heart rate monitoring

A high specification, wearable, electrical impedance tomography (EIT) system with 32 active electrodes is presented. Each electrode has an application specific integrated circuit (ASIC) mounted on a flexible printed circuit board, which is then wrapped inside a disposable fabric cover containing silver-coated electrodes to form the wearable belt. It is connected to a central hub that operates all the 32 ASICs. Each ASIC comprises a high- performance current driver capable of up to 6 mAp−p output, a voltage buffer for EIT and heart rate signal recording as well as contact impedance monitoring, and a sensor buffer that provides multi-parameter sensing. The ASIC was designed in a CMOS 0.35-μm high-voltage process technology. It operates from ±9-V power supplies and occupies a total die area of 3.9 mm2. The EIT system has a bandwidth of 500 kHz and employs two parallel data acquisition channels to achieve a frame rate of 107 frames/s, the fastest wearable EIT system reported to date. Measured results show that the system has a measurement accuracy of 98.88% and a minimum EIT detectability of 0.86 Q/frame. Its successful operation in capturing EIT lung respiration and heart rate biosignals from a volunteer is demonstrated

A high frame rate wearable EIT system using active electrode ASICs for lung respiration and heart rate monitoring

A high specification, wearable, electrical impedance tomography (EIT) system with 32 active electrodes is presented. Each electrode has an application specific integrated circuit (ASIC) mounted on a flexible printed circuit board, which is then wrapped inside a disposable fabric cover containing silver-coated electrodes to form the wearable belt. It is connected to a central hub that operates all the 32 ASICs. Each ASIC comprises a high- performance current driver capable of up to 6 mAp−p output, a voltage buffer for EIT and heart rate signal recording as well as contact impedance monitoring, and a sensor buffer that provides multi-parameter sensing. The ASIC was designed in a CMOS 0.35-μm high-voltage process technology. It operates from ±9-V power supplies and occupies a total die area of 3.9 mm2. The EIT system has a bandwidth of 500 kHz and employs two parallel data acquisition channels to achieve a frame rate of 107 frames/s, the fastest wearable EIT system reported to date. Measured results show that the system has a measurement accuracy of 98.88% and a minimum EIT detectability of 0.86 Q/frame. Its successful operation in capturing EIT lung respiration and heart rate biosignals from a volunteer is demonstrated

GRB Probes of the High-z Universe with EXIST

The Energetic X-ray Imaging Survey Telescope (EXIST) mission concept is optimized for study of high-z GRBs as probes of the early Universe. With a High Energy Telescope (HET) incorporating a 4.5m^2 5-600keV (CZT; 0.6mm pixels) detector plane for coded aperture imaging a 90deg x 70deg (>10% coding fraction) field of view with 2' resolution and <20" (90% conf.) positions for >5 sigma sources, EXIST will perform rapid (<200sec) slews onto GRBs. Prompt images and spectra are obtained with a co-aligned soft X-ray telescope (SXI; 0.1 - 10keV) and with a 1.1m optical-IR telescope (IRT) simultaneously in 4 bands (0.3 - 0.52micron, 0.52 - 0.9micron, 0.9 - 1.38micron, and 1.38 - 2.3micron). An initial image (100s) will yield prompt identification within the HET error circle from a <2" prompt SXI position; or from VIS vs. IR dropouts or variability. An autonomous spacecraft re-point (<30") will then put the GRB on a 0.3" x 4" slit for either R = 3000 (for AB <21) or R =30 (for AB ~21-25) prompt spectra over the 0.3 - 0.9 micron and 0.9 - 2.3 micron bands. This will provide onboard redshifts within ~500-2000sec for most GRBs, reaching z ~20 (for Lyman-alpha breaks) if such GRBs exist, and spectra for studies of the host galaxy and local re-ionization patchiness as well as intervening cosmic structure. With ~600 GRBs/yr expected, including ~7-10% expected at z >7, EXIST will open a new era in studies of the early Universe as well as carry out a rich program of AGN and transient-source science. An overview of the GRB science objectives and a brief discussion of the overall mission design and operations is given, and example high-z GRB IRT spectra are shown. EXIST is being proposed to the Astro2010 Decadal Survey as a 5 year Medium Class mission that could be launched as early as 2017.Comment: 7 pages, 5 figures, 1 table; to appear in Proc. Huntsville Gamma-ray Burst Symposium, AIPC (C. Meegan, N. Gehrels and C. Kouveliotou, eds.), in pres