57 research outputs found

    Ultra high data rate CMOS front ends

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    The availability of numerous mm-wave frequency bands for wireless communication has motivated the exploration of multi-band and multi-mode integrated components and systems in the main stream CMOS technology. This opportunity has faced the RF designer with the transition between schematic and layout. Modeling the performance of circuits after layout and taking into account the parasitic effects resulting from the layout are two issues that are more important and influential at high frequency design. Performing measurements using on-wafer probing at 60 GHz has its own complexities. The very short wave-length of the signals at mm-wave frequencies makes the measurements very sensitive to the effective length and bending of the interfaces. This paper presents different 60 GHz corner blocks, e.g. Low Noise Amplifier, Zero IF mixer, Phase-Locked Loop, a Dual-Mode Mm-Wave Injection-Locked Frequency Divider and an active transformed power amplifiers implemented in CMOS technologies. These results emphasize the feasibility of the realization 60 GHZ integrated components and systems in the main stream CMOS technology

    Ultra high data rate CMOS FEs

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    The availability of numerous mm-wave frequency bands for wireless communication has motived the exploration of multi-band and multi-mode integrated components and systems in the main stream CMOS technology. This opportunity has faced the RF designer with the transition between schematic and layout. Modeling the performance of circuits after layout and taking into account the parasitic effects resulting from the layout are two issues that are more important and influential at high frequency design. Performaning measurements using on-wafer probing at 60GHz has its own complexities. The very short wave-length of the signals at mm-wave frequencies makes the measurements very sensitiv to the effective length and bending of the interfaces. This paper presents different 60GHz corner blocks, e.g. Low Noise Amplifier, Zero IF mixer, Phase-Locked Loop, A Dual-Mode Mm-Wave Injection-Locked Frequency Divider and an active transformed power amplifiers implemented in CMOS technologies. These results emphasize the feasibility of the realization 60GHZ integrated components and systems in the main stream CMOS technology

    A linear high-efficiency millimeter-wave CMOS Doherty radiator leveraging on-antenna active load-modulation

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    This thesis presents a Doherty Radiator architecture that explores multi-feed antennas to achieve an on-antenna Doherty load modulation network and demonstrate high-speed high-efficiency transmission of wideband modulated signals. On the passive circuits, we exploit the multi-feed antenna concept to realize compact and high-efficiency on-antenna active load modulation for close-to-ideal Doherty operation, on-antenna power combining, and mm-Wave signal radiation. Moreover, we analyze the far-field transmission of the proposed Doherty Radiator and demonstrate its wide Field-of-View (FoV). On the active circuits, we employ a GHz-bandwidth adaptive biasing at the Doherty Auxiliary power amplifier (PA) path to enhance the Main/Auxiliary Doherty cooperation and appropriate turning-on/-off of the Auxiliary path. A proof-of-concept Doherty Radiator implemented in a 45nm CMOS SOI process over 62-68GHz exhibits a consistent 1.45-1.53× PAE enhancement at 6dB PBO over an idealistic class-B PA with the same PAE at P1dB. The measured Continuous-Wave (CW) performance at 65GHz demonstrates 19.4/19.2dBm PSAT/P1dB and achieves 27.5%/20.1% PAE at peak/6dB PBO, respectively. For single-carrier 1Gsym/s 64-QAM modulation, the Doherty Radiator shows average output power of 14.2dBm with an average 20.2% PAE and -26.7dB EVM without digital predistortion. Consistent EVMs are observed over the entire antenna FoV, demonstrating spatially undistorted transmission and constant Doherty PBO efficiency enhancement.M.S

    Wireless wire - ultra-low-power and high-data-rate wireless communication systems

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    With the rapid development of communication technologies, wireless personal-area communication systems gain momentum and become increasingly important. When the market gets gradually saturated and the technology becomes much more mature, new demands on higher throughput push the wireless communication further into the high-frequency and high-data-rate direction. For example, in the IEEE 802.15.3c standard, a 60-GHz physical layer is specified, which occupies the unlicensed 57 to 64 GHz band and supports gigabit links for applications such as wireless downloading and data streaming. Along with the progress, however, both wireless protocols and physical systems and devices start to become very complex. Due to the limited cut-off frequency of the technology and high parasitic and noise levels at high frequency bands, the power consumption of these systems, especially of the RF front-ends, increases significantly. The reason behind this is that RF performance does not scale with technology at the same rate as digital baseband circuits. Based on the challenges encountered, the wireless-wire system is proposed for the millimeter wave high-data-rate communication. In this system, beamsteering directional communication front-ends are used, which confine the RF power within a narrow beam and increase the level of the equivalent isotropic radiation power by a factor equal to the number of antenna elements. Since extra gain is obtained from the antenna beamsteering, less front-end gain is required, which will reduce the power consumption accordingly. Besides, the narrow beam also reduces the interference level to other nodes. In order to minimize the system average power consumption, an ultra-low power asynchronous duty-cycled wake-up receiver is added to listen to the channel and control the communication modes. The main receiver is switched on by the wake-up receiver only when the communication is identified while in other cases it will always be in sleep mode with virtually no power consumed. Before transmitting the payload, the event-triggered transmitter will send a wake-up beacon to the wake-up receiver. As long as the wake-up beacon is longer than one cycle of the wake-up receiver, it can be captured and identified. Furthermore, by adopting a frequency-sweeping injection locking oscillator, the wake-up receiver is able to achieve good sensitivity, low latency and wide bandwidth simultaneously. In this way, high-data-rate communication can be achieved with ultra-low average power consumption. System power optimization is achieved by optimizing the antenna number, data rate, modulation scheme, transceiver architecture, and transceiver circuitries with regards to particular application scenarios. Cross-layer power optimization is performed as well. In order to verify the most critical elements of this new approach, a W-band injection-locked oscillator and the wake-up receiver have been designed and implemented in standard TSMC 65-nm CMOS technology. It can be seen from the measurement results that the wake-up receiver is able to achieve about -60 dBm sensitivity, 10 mW peak power consumption and 8.5 µs worst-case latency simultaneously. When applying a duty-cycling scheme, the average power of the wake-up receiver becomes lower than 10 µW if the event frequency is 1000 times/day, which matches battery-based or energy harvesting-based wireless applications. A 4-path phased-array main receiver is simulated working with 1 Gbps data rate and on-off-keying modulation. The average power consumption is 10 µW with 10 Gb communication data per day

    Design and characterization of monolithic millimeter-wave active and passive components, low-noise and power amplifiers, resistive mixers, and radio front-ends

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    This thesis focuses on the design and characterization of monolithic active and passive components, low-noise and power amplifiers, resistive mixers, and radio front-ends for millimeter-wave applications. The thesis consists of 11 publications and an overview of the research area, which also summarizes the main results of the work. In the design of millimeter-wave active and passive components the main focus is on realized CMOS components and techniques for pushing nanoscale CMOS circuits beyond 100 GHz. Test structures for measuring and analyzing these components are shown. Topologies for a coplanar waveguide, microstrip line, and slow-wave coplanar waveguide that are suitable for implementing transmission lines in nanoscale CMOS are presented. It is demonstrated that the proposed slow-wave coplanar waveguide improves the performance of the transistor-matching networks when compared to a conventional coplanar waveguide and the floating slow-wave shield reduces losses and simplifies modeling when extended below other passives, such as DC decoupling and RF short-circuiting capacitors. Furthermore, wideband spiral transmission line baluns in CMOS at millimeter-wave frequencies are demonstrated. The design of amplifiers and a wideband resistive mixer utilizing the developed components in 65-nm CMOS are shown. A 40-GHz amplifier achieved a +6-dBm 1-dB output compression point and a saturated output power of 9.6 dBm with a miniature chip size of 0.286 mm². The measured noise figure and gain of the 60-GHz amplifier were 5.6 dB and 11.5 dB, respectively. The V-band balanced resistive mixer achieved a 13.5-dB upconversion loss and 34-dB LO-to-RF isolation with a chip area of 0.47 mm². In downconversion, the measured conversion loss and 1-dB input compression point were 12.5 dB and +5 dBm, respectively. The design and experimental results of low-noise and power amplifiers are presented. Two wideband low-noise amplifiers were implemented in a 100-nm metamorphic high electron mobility transistor (HEMT) technology. The amplifiers achieved a 22.5-dB gain and a 3.3-dB noise figure at 94 GHz and a 18-19-dB gain and a 5.5-7.0-dB noise figure from 130 to 154 GHz. A 60-GHz power amplifier implemented in a 150-nm pseudomorphic HEMT technology exhibited a +17-dBm 1-dB output compression point with a 13.4-dB linear gain. In this thesis, the main system-level aspects of millimeter-wave transmitters and receivers are discussed and the experimental circuits of a 60-GHz transmitter front-end and a 60-GHz receiver with an on-chip analog-to-digital converter implemented in 65-nm CMOS are shown. The receiver exhibited a 7-dB noise figure, while the saturated output power of the transmitter front-end was +2 dBm. Furthermore, a wideband W-band transmitter front-end with an output power of +6.6 dBm suitable for both image-rejecting superheterodyne and direct-conversion transmission is demonstrated in 65-nm CMOS

    0.42 THz Transmitter with Dielectric Resonator Array Antenna

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    Off chip antennas do not occupy the expensive die area, as there is no limitation on their building material, and can be built in any size and shape to match the system requirements, which are all in contrast to on-chip antenna solutions. However, integration of off-chip antennas with Monolithic-Microwave-Integrated Chips (MMIC) and designing a low loss signal transmission from the signal source inside the MMIC to the antenna module is a major challenge and trade off. High resistivity silicon (HRS), is a low cost and extremely low loss material at sub-THz. It has become a prevailing material in fabrication of passive components for THz applications. This work makes use of HRS to build an off-chip Dielectric Resonator Antenna Array Module (DRAAM) to realize a highly efficient transmitter at 420 GHz. This work proposes novel techniques and solutions for design and integration of DRRAM with MMIC as the signal source. A proposed scalable 4×4 antenna structure aligns DRRAM on top of MMIC within 2 μm accuracy through an effortless assembly procedure. DRAAM shows 15.8 dB broadside gain and 0.85 efficiency. DRAs in the DRAAM are differentially excited through aperture coupling. Differential excitation not only inherently provides a mechanism to deliver more power to the antenna, it also removes the additional loss of extra balluns when outputs are differential inside MMIC. In addition, this work proposes a technique to double the radiation power from each DRA. Same radiating mode at 0.42 THz inside every DRA is excited through two separate differential sources. This approach provides an almost loss-less power combining mechanism inside DRA. Two 140_GHz oscillators followed by triplers drive each DRA in the demonstrated 4×4 antenna array. Each oscillator generates 7.2 dBm output power at 140 GHz with -83 dBc/Hz phase noise at 100 KHz and consumes 25 mW of power. An oscillator is followed by a tripler that generates -8 dBm output power at 420 GHz. Oscillator and tripler circuits use a smart layer stack up arrangement for their passive elements where the top metal layer of the die is grounded to comply with the planned integration arrangement. This work shows a novel circuit topology for exciting the antenna element which creates the feed element part of the tuned load for the tripler circuit, therefore eliminates the loss of the transition component, and maximizes the output power delivered to the antenna. The final structure is composed of 32 injection locked oscillators and drives a 4×4 DRAAM achieves 22.8 dBm EIRP

    CMOS Front-End Circuits in 45-nm SOI Suitable for Modular Phased-Array 60-GHz Radios

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    Next Fifth-generation (5G) wireless technologies enabling ultra-wideband spectrum availability and increased system capacity can achieve multi-gigabit/s (Gbps) data rates suitable for ultra-high-speed internet access around the 60-GHz band (i.e., Wi-Gig Technology). This mm-wave band is unlicensed and experiences high propagation power losses. Therefore, it is suitable for short-range communications and requires antenna arrays to satisfy the link budget requirements. Half-duplex reconfigurable phased-array transceivers require wideband, low-cost, highly integrated front-end circuits such as bilateral RF switches, low-noise/power amplifiers, passive RF splitters/combiners, and phase shifters implemented in deep sub-micron CMOS. In this dissertation, analysis, design, and verification of essential CMOS front-end components are covered and fabricated in GlobalFoundries 45-nm RF-SOI CMOS technology. Firstly, a fully-differential, single-pole, single-throw (SPST) switch capable of high isolation in broadband CMOS transceivers is described. The SPST switch realizes better than 50-dB isolation (ISO) across DC to 43 GHz while maintaining an insertion loss (IL) below 3 dB. Measured RF input power for 1-dB compression (IP1dB) of the IL is +19.6 dBm, and the measured input third-order intercept point (IIP3) is +30.4 dBm (both assuming differential inputs at 20 GHz). The prototype has an active area of 0.0058 mm^2. Secondly, a single-pole double-throw (SPDT) switch is implemented using the SPST concept by using a balun to convert the shared differential path to a single-ended antenna port. The SPDT simulations predict less than 3.5-dB IL and greater than 40-dB ISO across 55 to 65 GHz frequency band. An IP1dB of +21 dBm is expected from large-signal simulations. The prototype has an active area of 0.117 mm^2. Thirdly, a fully-differential switched-LC topology adopted with slow-wave artificial transmission line concept, and phase inversion network is described for a 360-degree phase shift range with 11.25-degree phase resolution. The average IL of the complete phase shifter is 5.3 dB with less than 1-dB rms IL error. Furthermore, the IP1dB of the phase shifter is +16 dBm. The prototype has an active area of 0.245 mm^2. Lastly, a fully-differential, 2-stage, common-source (CS) low-noise amplifier (LNA) is developed with wideband matching from 57.8 GHz to 67 GHz, a maximum simulated forward power gain of 20.8 dB, and a minimum noise figure of 3.07 dB. The LNA consumes 21 mW and predicts an OP1dB of 4.8 dBm from the 1-V supply. The LNA consumes an active area of 0.028 mm^2
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