Ultra high data rate CMOS FEs

The availability of numerous mm-wave frequency bands for wireless communication has motived the exploration of multi-band and multi-mode integrated components and systems in the main stream CMOS technology. This opportunity has faced the RF designer with the transition between schematic and layout. Modeling the performance of circuits after layout and taking into account the parasitic effects resulting from the layout are two issues that are more important and influential at high frequency design. Performaning measurements using on-wafer probing at 60GHz has its own complexities. The very short wave-length of the signals at mm-wave frequencies makes the measurements very sensitiv to the effective length and bending of the interfaces. This paper presents different 60GHz corner blocks, e.g. Low Noise Amplifier, Zero IF mixer, Phase-Locked Loop, A Dual-Mode Mm-Wave Injection-Locked Frequency Divider and an active transformed power amplifiers implemented in CMOS technologies. These results emphasize the feasibility of the realization 60GHZ integrated components and systems in the main stream CMOS technology

Ultra high data rate CMOS front ends

The availability of numerous mm-wave frequency bands for wireless communication has motivated the exploration of multi-band and multi-mode integrated components and systems in the main stream CMOS technology. This opportunity has faced the RF designer with the transition between schematic and layout. Modeling the performance of circuits after layout and taking into account the parasitic effects resulting from the layout are two issues that are more important and influential at high frequency design. Performing measurements using on-wafer probing at 60 GHz has its own complexities. The very short wave-length of the signals at mm-wave frequencies makes the measurements very sensitive to the effective length and bending of the interfaces. This paper presents different 60 GHz corner blocks, e.g. Low Noise Amplifier, Zero IF mixer, Phase-Locked Loop, a Dual-Mode Mm-Wave Injection-Locked Frequency Divider and an active transformed power amplifiers implemented in CMOS technologies. These results emphasize the feasibility of the realization 60 GHZ integrated components and systems in the main stream CMOS technology

A review of technologies and design techniques of millimeter-wave power amplifiers

his article reviews the state-of-the-art millimeter-wave (mm-wave) power amplifiers (PAs), focusing on broadband design techniques. An overview of the main solid-state technologies is provided, including Si, gallium arsenide (GaAs), GaN, and other III-V materials, and both field-effect and bipolar transistors. The most popular broadband design techniques are introduced, before critically comparing through the most relevant design examples found in the scientific literature. Given the wide breadth of applications that are foreseen to exploit the mm-wave spectrum, this contribution will represent a valuable guide for designers who need a single reference before adventuring in the challenging task of the mm-wave PA design

Analysis and design of a high power millimeter-wave power amplifier in a SiGe BiCMOS technology

Our current society is characterized by an ever increasing need for bandwidth leading towards the exploration of new parts of the electromagnetic spectrum for data transmission. This results in a rising interest and development of millimeter-wave (mm-wave) circuits which hold the promise of short range multi-gigabit wireless transmissions at 60GHz. These relatively new applications are to co-exist with more established mm-wave consumer products including satellite systems in the Ka-band (26.5GHz - 40GHz) allowing e.g.: video broadcasting, voice over IP (VoIP), internet acces to remote areas, ... Both need significant linear power amplification due to the high attenuation typical for this part of the spectrum, however, satellite systems demand a saturated output power which is easily an order of magnitude larger (output powers in excess of 30dBm / 1W). Monolithic microwave integrated circuits (MMICs) employing III-V chip technologies, e.g.: gallium arsenide (GaAs), gallium nitride (GaN), have historically been the preferred choice to implement efficient mm-wave power amplifiers (PA) with a high saturated output power (>30dBm). To further increase the commercial viability of consumer products in this market segment a low manufacturing cost for the power amplifier, together with the possible integration of additional functions, is highly desirable. These features are the strongpoint of silicon based chip technologies like CMOS and SiGe BiCMOS. However, these technologies have a breakdown voltage typically below 2V for nodes capable of millimeter-wave applications while III-V transistors with equivalent frequency performance demonstrate breakdown voltages in excess of 8V. Because of this, output powers of CMOS and SiGe BiCMOS Ka-band power amplifiers rarely exceed 20dBm which poses the main hurdle for using these technologies in satellite communication (SATCOM). To overcome the limited output power of a single amplifying cell in a silicon technology, caused by the low breakdown voltage, multiple power amplifiers cells need to have their output power effectively combined on-chip. This requires the on-chip integration of high-Q passives within a relative small area to realize both the impedance transformation, to create the optimal load impedance for the different amplifier cells, and implement an efficient on-chip power combination network. Compared to III-V technologies this is again a challenge due to the use of a silicon substrate which introduces higher losses. Once a large enough on-chip output power is created, the issue of launching this signal to the outside world remains. Moreover, due to the limited efficiency of mm-wave PAs, the generated on-chip heat will increase when larger output power are required. This means a chipto-board interface with a low thermal resistance and a low loss electrical connection needs to be devised. Proof of the viability of silicon as a serious candidate for the integration of medium and high power Ka-band amplifiers will only be delivered by long term research and the actual creation of such an amplifier. In this context, the initial goal for the presented work is proposed. This consists of the creation of a power amplifier with a saturated output power above 24dBm (preferably 27dBm), a gain larger than 20dB and an efficiency in excess of 10% (preferably 15%). These specifications where conceived with the precondition of using a 250nm SiGe BiCMOS technology (IHP’s SG25H3) with an fT of 110GHz and a collector to emitter breakdown voltage in open base conditions (BVCEO) of 2.3V. The use of this technology is a significant challenge due to the limited speed, rule of thumb is to have at least one fifth of the fT as the operating frequency, which reflects in the attainable power added efficiency (PAE). On the other hand, proving the possible implementation in this “older” technology shows great potential towards the future integration in a fast technology (e.g.: IHP’s SG13G2, ft =300GHz). Next to issues caused by limitations of the chip technology, the proposed specifications allows to identify generic difficulties with high power silicon PA design, e.g.: design of efficient on-chip power combiners, thermal management, single-ended to differential conversion, ... As this work is of an academic nature the intention of this design was to leave the beaten track and explore alternative topologies. This has led to the adoption of a driver stage using translinear loops for biasing and a transformer-type Wilkinson power combiner previously only used in cable television (CATV) applications. Although the power combiner showed 2dB more loss than expected due to higher than expected substrate losses, both topologies show promise for further integration. Furthermore, an in-depth analysis was performed on the output stage which uses positive feedback to increase its gain. The entire design consists of a four-way power combining class AB power amplifier together with test structures of which the performance was verified by means of probing. Due to the previously mentioned higher than expected loss in the on-chip power combiner, the total output power and power added efficiency (PAE) was 2dB lower than expected from simulations. The result is a saturated output power at 32GHz of 24.1dBm with a PAE of 7.2% and a small signal gain of 25dB. This demonstrates the capability of SiGe BiCMOS to implement PA’s for medium-power mm-wave applications. Moreover, to the best of the author’s knowledge, this PA achieves the second highest saturated output power when comparing SiGe BiCMOS PA’s with center frequency in or close to the Ka-band. The 1dB compression point of this amplifier lies at 22.7dBm which is close to saturated output power and results in a low spectral regrowth when compared to commercial GaAs PA’s (compared with 2MBaud 16QAM input signal at 10dB back-off). Many possible improvements to this design remain. The most important would be the re-design of the on-chip power combiner, possibly with a floating ground shield, to reduce the losses and increase the total output power and PAE. Also the porting of the design to a faster chip technology might result in a considerable increase of the output stage efficiency at the cost of needing to combine more amplifier cells. The transition to a faster chip technology would additionally allow to use this design for alternative mm-wave applications like automotive radar at 79GHz andWiGig at 60GHz

SiGe-based broadband and high suppression frequency doubler ICs for wireless communications

制度:新 ; 報告番号:甲3419号 ; 学位の種類:博士(工学) ; 授与年月日:2011/9/15 ; 早大学位記番号:新574

Design, Fault Modeling and Testing Of a Fully Integrated Low Noise Amplifier (LNA) in 45 nm CMOS Technology for Inter and Intra-Chip Wireless Interconnects

Research in recent years has demonstrated that intra and inter-chip wireless interconnects are capable of establishing energy-efficient data communications within as well as between multiple chips. This thesis introduces a circuit level design of a source degenerated two stage common source low noise amplifier suitable for such wireless interconnects in 45-nm CMOS process. The design consists of a simple two-stage common source structure based Low Noise Amplifier (LNA) to boost the degraded received signal. Operating at 60GHz, the proposed low noise amplifier consumes only 4.88 mW active power from a 1V supply while providing 17.2 dB of maximum gain at 60 GHz operating frequency at very low noise figure of 2.8 dB, which translates to a figure of merit of 16.1 GHz and IIP3 as -14.38 dBm