2D Monte Carlo Simulation of Hole and Electron Transport in Strained Si

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Quantum corrected full-band semiclassical Monte Carlo simulation research of charge transport in Si, stressed-Si, and SiGe MOSFETs

This Ph.D. research is centered around a full-band Monte Carlo device simulator (“Monte Carlo at the University of Texas”, MCUT) with quantum corrections (based on one-dimensional Schrödinger equation solver). The code itself was based on a solid infrastructure of a Monte Carlo simulator, “MoCa” from the University of Illinois at Urbana-Champaign. To that there were added new methods and features during my Ph.D. program, including strained band structures, alternative (to conventional 100 ) surface orientations, full-band scattering mechanisms, and valley-dependent quantum correction. These features enable “MCUT” to be used to model various strained and/or alloyed silicon MOSFETs, as well as the MOSFETs composed of alternative materials such as Ge, in sub-100 nm regime. Monte Carlo simulation, itself, handles short channel effects and hot carriers in ultra small device well; full-band structure replaces the inaccurate and unknown (for new/strained materials) analytical formulae; and the quantum corrections approximate quantum-confinement effects on device performance. The goal is to understand and predict the device behavior of the so called “non-classical” CMOS ― beyond bulk Si based CMOS ― in the sub-100 nm regime.Electrical and Computer Engineerin

Monte Carlo simulation of silicon-germanium transistors

Self-consistent Monte Carlo simulation studies of n-channel Si/SiGe modulation doped field effect transistors (MODFETs) and silicon-on-insulator lateral bipolar junction transistors (SOI- LBJTs) are reported in this thesis. As a preliminary to the device studies Monte Carlo simulations of electron transport in bulk Si strained as if grown on Si(_0.77)Ge(_0.23) and Si(_0.55)Ge(_0.45) substrates have been carried out at 300 K, for field strengths varied from 10(^4) to 2 x 10(^7) Vm(^-1). The calculations indicate an enhancement of the average electron drift velocity when Si is tensilely strained in the growth plane. The enhancement of electron velocity is more marked at low and intermediate electric fields, while at very high fields the velocity saturates at about the same value as unstrained Si. In addition the ensemble Monte Carlo method has been used to study the transient response to a stepped electric field of electrons in strained and unstrained Si. The calculations suggest that significant velocity overshoots occurs in strained material. Simulations of n-channel Si/Si(_1=z)Ge(_z) MODFETs with Ge fractions of 0.23, 0.25, and 0.45 have been performed. Five depletion mode devices with x = 0.23 and 0.25 were studied. The simulations provide information on the microscopic details of carrier behaviour, including carrier velocity, kinetic energy and carrier density, as a function of position in the device. Detailed time-dependent voltage signal analysis has been carried out to test device response and derive the frequency bandwidth. The simulations predict a current gain cut-off frequency of 60 ± 10 GHz for a device with a gate length of 0.07 /nm and a channel length of 0.25 um. Similar studies of depletion and enhancement mode n-channel Si/Sio.55Geo.45 MODFETs with a gate length of 0.18 /im have been carried out. Cut-off frequencies of 60 ±10 GHz and 90± 10 GHz are predicted for the depletion and enhancement mode devices respectively. A Monte Carlo model has also been devised and used to simulate steady state and transient electron and hole transport in SOI-LBJTs. Four devices have been studied and the effects of junction depth and silicon layer thickness have been investigated. The advantage of the silicon-on-insulator technology SOI device is apparent in terms of higher collector current, current gain, and cut-off frequency obtained in comparison with an all-silicon structure. The simulations suggest that the common-emitter current gain of the most promising SOI-LBJT structure considered could have a cut-off frequency approaching 35 ± 5 GHz

Simulation study of vertically stacked lateral Si nanowires transistors for 5 nm CMOS applications

In this paper we present a simulation study of vertically stacked lateral nanowires transistors (NWTs), which may have applications at 5nm CMOS technology. Our simulation approach is based on a collection of simulation techniques to capture the complexity in such ultra-scaled devices. Initially, we used drift-diffusion methodology with activated Poisson-Schrodinger quantum corrections to accurately capture the quantum confinement in the cross-section of the device. Ensemble Monte Carlo simulations are used to accurately evaluate the drive current capturing the complexity of the carrier transport in the NWTs. We compared the current flow in single, double, and triple vertically stacked lateral NWTs with and without contact resistance. The results presented here suggest a consistent link between channel strain and device performance. Furthermore, we propose a device structure for the 5nm CMOS technology node that meets the required industry scaling projection. We also consider the interplay between various sources of statistical variability and reliability in this work

Numerical simulation of advanced CMOS and beyond CMOS devices

Co-supervisore: Marco PalaopenLo scaling dei dispositivi elettronici e l'introduzione di nuove opzioni tecnologiche per l'aumento delle prestazioni richiede un costante supporto dal punto di vista della simulazione numerica. Questa tesi si inquadra in tale ambito ed in particolare si prefigge lo scopo di sviluppare due tool software completi basati su tecniche avanzate al fine di predire le prestazioni di dipositivi nano-elettronici progettati per i futuri nodi tecnologiciDottorato di ricerca in Ingegneria industriale e dell'informazioneembargoed_20131103Conzatti, Francesc

A review of selected topics in physics based modeling for tunnel field-effect transistors

The research field on tunnel-FETs (TFETs) has been rapidly developing in the last ten years, driven by the quest for a new electronic switch operating at a supply voltage well below 1 V and thus delivering substantial improvements in the energy efficiency of integrated circuits. This paper reviews several aspects related to physics based modeling in TFETs, and shows how the description of these transistors implies a remarkable innovation and poses new challenges compared to conventional MOSFETs. A hierarchy of numerical models exist for TFETs covering a wide range of predictive capabilities and computational complexities. We start by reviewing seminal contributions on direct and indirect band-to-band tunneling (BTBT) modeling in semiconductors, from which most TCAD models have been actually derived. Then we move to the features and limitations of TCAD models themselves and to the discussion of what we define non-self-consistent quantum models, where BTBT is computed with rigorous quantum-mechanical models starting from frozen potential profiles and closed-boundary Schr\uf6dinger equation problems. We will then address models that solve the open-boundary Schr\uf6dinger equation problem, based either on the non-equilibrium Green's function NEGF or on the quantum-transmitting-boundary formalism, and show how the computational burden of these models may vary in a wide range depending on the Hamiltonian employed in the calculations. A specific section is devoted to TFETs based on 2D crystals and van der Waals hetero-structures. The main goal of this paper is to provide the reader with an introduction to the most important physics based models for TFETs, and with a possible guidance to the wide and rapidly developing literature in this exciting research field

Self-consistent energy balance simulations of hole dynamics in SiGe/Si THz quantum cascade structures

Analysis of hole transport in cascaded p-Si/SiGe quantum well structures is performed using self-consistent rate equations simulations. The hole subband structure is calculated using the 6×6 k·p model, and then used to find carrier relaxation rates due to the alloy disorder, acoustic, and optical phonon scattering, as well as hole-hole scattering. The simulation accounts for the in-plane k-space anisotropy of both the hole subband structure and the scattering rates. Results are presented for prototype THz Si/SiGe quantum cascade structures. © 2004 American Institute of Physic

Correlation between the golden ratio and nanowire transistor performance

An observation was made in this research regarding the fact that the signatures of isotropic charge distributions in silicon nanowire transistors (NWT) displayed identical characteristics to the golden ratio (Phi). In turn, a simulation was conducted regarding ultra-scaled n-type Si (NWT) with respect to the 5-nm complementary metal-oxide-semiconductor (CMOS) application. The results reveal that the amount of mobile charge in the channel and intrinsic speed of the device are determined by the device geometry and could also be correlated to the golden ratio (Phi). This paper highlights the issue that the optimization of NWT geometry could reduce the impact of the main sources of statistical variability on the Figure of Merit (FoM) of devices. In the context of industrial early successes in fabricating vertically stacked NWT, ensemble Monte Carlo (MC) simulations with quantum correction are used to accurately predict the drive current. This occurs alongside a consideration of the degree to which the carrier transport in the vertically stacked lateral NWTs are complex

Advanced numerical modeling of semiconductor material properties and their device performances

With the renewed concept of "Materials by Design" attracting particular attentions from the engineering communities in recent years, numerical methods that can reliably predict the optical and electrical properties of materials is highly preferable. Since the growth or the synthesis of a "designed" material and the ensuing devices is usually prohibitively expensive and time-consuming, numerical simulation tools that predict the properties of a proposed material together with its device performance before production is especially important and cost-effective. Furthermore, as the technology advances, semiconductor devices have been pushed to operate at their material limits, which requires a thorough understanding of the materials' microscopic processes under different conditions. Therefore, developing numerical models that are capable of investigating the semiconductor properties from material level to device level is highly desirable. This dissertation develops a suite of numerical models in which optical absorption and Auger recombination in semiconductor materials are studied and simulated together with their device performances. In particular, Green's function theory with full band structures is employed to investigate the material properties by evaluating the broadening of the electronic bands under the perturbation of phonons. As a result, both direct and phonon-assisted indirect processes are computed and compared among different materials. Drift-diffusion model and a 3D Monte-Carlo model are subsequently used to simulate the device characteristics with the obtained material parameters. This work first determines the full band structures for Si, Ge, α-Sn, HgCdTe, InAsSb and InGaAs alloys from EPM model, and then investigated the materials' minority carrier lifetime for IR detector applications. Finally device level simulations using drift-diffusion and 3D Monte-Carlo models are demonstrated. In particular, two issues of developing 3D Monte-Carlo device simulation models, namely the use of unstructured spatial meshes and elimination of particle-mesh forces, are discussed, which are crucial in simulating modern semiconductor devices having complex geometry and doping profiles