Carbon Nanotube Capacitors

We introduce a vertical carbon nanotube capacitor with high capacitance per unit area. Using an electrical model of single-walled, metallic carbon nanotubes and the extracted capacitance values of a carbon nanotube bundle network, we develop an electrical model for the capacitor. The device can exhibit a capacitance greater than 175fF/mu m(2)

MRAM-Based FPGAs: A Survey

Over the last decade, field programmable gate arrays (FPGAs) have embraced heterogeneity in a transformative way by leveraging emerging memory devices along with conventional CMOS-based devices to realize technology-specific benefits. Memristive device technologies exhibit desirable characteristics such as non-volatility, scalability, near-zero leakage, radiation hardness, and more, making them promising alternatives for SRAM cells found in conventional SRAM-based FPGAs. In recent years, a significant amount of research has been performed to take advantage of these emerging technologies to develop fundamental building blocks of FPGAs like hybrid CMOS-memristive look-up tables (LUTs) and configurable logic blocks (CLBs). In this chapter, we will provide a brief overview of the previous work on hybrid CMOS-memristive FPGAs and their corresponding opportunities and challenges

Air Force Institute of Technology Research Report 2010

This report summarizes the research activities of the Air Force Institute of Technology’s Graduate School of Engineering and Management. It describes research interests and faculty expertise; lists student theses/dissertations; identifies research sponsors and contributions; and outlines the procedures for contacting the school. Included in the report are: faculty publications, conference presentations, consultations, and funded research projects. Research was conducted in the areas of Aeronautical and Astronautical Engineering, Electrical Engineering and Electro-Optics, Computer Engineering and Computer Science, Systems and Engineering Management, Operational Sciences, Mathematics, Statistics and Engineering Physic

Phase Noise in CMOS Phase-Locked Loop Circuits

Phase-locked loops (PLLs) have been widely used in mixed-signal integrated circuits. With the continuously increasing demand of market for high speed, low noise devices, PLLs are playing a more important role in communications. In this dissertation, phase noise and jitter performances are investigated in different types of PLL designs. Hot carrier and negative bias temperature instability effects are analyzed from simulations and experiments. Phase noise of a CMOS phase-locked loop as a frequency synthesizer circuit is modeled from the superposition of noises from its building blocks: voltage-controlled oscillator, frequency divider, phase-frequency detector, loop filter and auxiliary input reference clock. A linear time invariant model with additive noise sources in frequency domain is presented to analyze the phase noise. The modeled phase noise results are compared with the corresponding experimentally measured results on phase-locked loop chips fabricated in 0.5 m n-well CMOS process. With the scaling of CMOS technology and the increase of electrical field, MOS transistors have become very sensitive to hot carrier effect (HCE) and negative bias temperature instability (NBTI). These two reliability issues pose challenges to designers for designing of chips in deep submicron CMOS technologies. A new strategy of switchable CMOS phase-locked loop frequency synthesizer is proposed to increase its tuning range. The switchable PLL which integrates two phase-locked loops with different tuning frequencies are designed and fabricated in 0.5 µm CMOS process to analyze the effects under HCE and NBTI. A 3V 1.2 GHz programmable phase-locked loop frequency synthesizer is designed in 0.5 μm CMOS technology. The frequency synthesizer is implemented using LC voltage-controlled oscillator (VCO) and a low power dual-modulus prescaler. The LC VCO working range is from 900MHz to 1.4GHz. Current mode logic (CML) is used in designing high speed D flip-flop in the dual-modulus prescaler circuits for low power consumption. The power consumption of the PLL chip is under 30mW. Fully differential LC VCO is used to provide high oscillation frequency. A new design of LC VCO using carbon nanotube (CNT) wire inductor has been proposed. The PLL design using CNT-LC VCO shows significant improvement in phase noise due to high-Q LC circuit

Provably Trustworthy and Secure Hardware Design with Low Overhead

Due to the globalization of IC design in the semiconductor industry and outsourcing of chip manufacturing, 3PIPs become vulnerable to IP piracy, reverse engineering, counterfeit IC, and hardware Trojans. To thwart such attacks, ICs can be protected using logic encryption techniques. However, strong resilient techniques incur significant overheads. SCAs further complicate matters by introducing potential attacks post-fabrication. One of the most severe SCAs is PA attacks, in which an attacker can observe the power variations of the device and analyze them to extract the secret key. PA attacks can be mitigated via adding large extra hardware; however, the overheads of such solutions can render them impractical, especially when there are power and area constraints. In our first approach, we present two techniques to prevent normal attacks. The first one is based on inserting MUX equal to half/full of the output bit number. In the second technique, we first design PLGs using SiNW FETs and then replace some logic gates in the original design with their SiNW FETs-based PLGs counterparts. In our second approach, we use SiNW FETs to produce obfuscated ICs that are resistant to advanced reverse engineering attacks. Our method is based on designing a small block, whose output is untraceable, namely URSAT. Since URSAT may not offer very strong resilience against the combined AppSAT-removal attack, S-URSAT is achieved using only CMOS-logic gates, and this increases the security level of the design to robustly thwart all existing attacks. In our third topic, we present the usage of ASLD to produce secure and resilient circuits that withstand IC attacks (during the fabrication) and PA attacks (after fabrication). First, we show that ASLD has unique features that can be used to prevent PA and IC attacks. In our three topics, we evaluate each design based on performance overheads and security guarantees

Air Force Institute of Technology Research Report 2006

This report summarizes the research activities of the Air Force Institute of Technology’s Graduate School of Engineering and Management. It describes research interests and faculty expertise; lists student theses/dissertations; identifies research sponsors and contributions; and outlines the procedures for contacting the school. Included in the report are: faculty publications, conference presentations, consultations, and funded research projects. Research was conducted in the areas of Aeronautical and Astronautical Engineering, Electrical Engineering and Electro-Optics, Computer Engineering and Computer Science, Systems and Engineering Management, Operational Sciences, Mathematics, Statistics and Engineering Physics

The Thermal-Constrained Real-Time Systems Design on Multi-Core Platforms -- An Analytical Approach

Over the past decades, the shrinking transistor size enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Over the past decades, the shrinking transistor size, benefited from the advancement of IC technology, enabled more transistors to be integrated into an IC chip, to achieve higher and higher computing performances. However, the semiconductor industry is now reaching a saturation point of Moore’s Law largely due to soaring power consumption and heat dissipation, among other factors. High chip temperature not only significantly increases packing/cooling cost, degrades system performance and reliability, but also increases the energy consumption and even damages the chip permanently. Although designing 2D and even 3D multi-core processors helps to lower the power/thermal barrier for single-core architectures by exploring the thread/process level parallelism, the higher power density and longer heat removal path has made the thermal problem substantially more challenging, surpassing the heat dissipation capability of traditional cooling mechanisms such as cooling fan, heat sink, heat spread, etc., in the design of new generations of computing systems. As a result, dynamic thermal management (DTM), i.e. to control the thermal behavior by dynamically varying computing performance and workload allocation on an IC chip, has been well-recognized as an effective strategy to deal with the thermal challenges. Different from many existing DTM heuristics that are based on simple intuitions, we seek to address the thermal problems through a rigorous analytical approach, to achieve the high predictability requirement in real-time system design. In this regard, we have made a number of important contributions. First, we develop a series of lemmas and theorems that are general enough to uncover the fundamental principles and characteristics with regard to the thermal model, peak temperature identification and peak temperature reduction, which are key to thermal-constrained real-time computer system design. Second, we develop a design-time frequency and voltage oscillating approach on multi-core platforms, which can greatly enhance the system throughput and its service capacity. Third, different from the traditional workload balancing approach, we develop a thermal-balancing approach that can substantially improve the energy efficiency and task partitioning feasibility, especially when the system utilization is high or with a tight temperature constraint. The significance of our research is that, not only can our proposed algorithms on throughput maximization and energy conservation outperform existing work significantly as demonstrated in our extensive experimental results, the theoretical results in our research are very general and can greatly benefit other thermal-related research