Mechanical properties of silicon nitride using RUS & C-Sphere methodology

Silicon Nitride is a type of engineering ceramics which has been used in ball bearing and other rolling contact applications due to its good fatigue life, high temperature strength and tribological performance. In this paper, the mechanical properties of Hot Isostatically Pressed (HIPed) and Sintered and Reaction Bonded Silion Nitride (SRBSN) have been studied. The elastic modulus and poisson’s ratio of three type of commerical grade HIPed silicon nitride, and groudn SRBSN with three surface condidtions were measured using a Resonance Ultrasound Spectroscopy (RUS). The RUS measurement reveals the variation of elastic properties across different types of HIPed silicon nitride specimens. The surface strength of silicon nitride are studied using a C-Sphere specimen, and the results show that different commercial grade HIPed silicon nitride show varying surface strength. The surface conditions of ground SRBSN have an effect on the surface strength of the specimens. The RUS and C-Sphere techniques can potentially be used to sample the quality and consistency of ball bearing elements

Postmortem analyses of salvaged conventional silica bricks from glass production furnaces

The microstructure, phase content, and thermal conductivity of salvaged conventional silica bricks from float glass and TV-panel glass production furnaces were examined as a function of position through the brick, and compared with the original, unaltered brick materials. The silica brick from the float glass furnace was in service for approximately 10 years while that for the TV-panel glass furnace was for approximately 6 1/2 years. The microstructure and phase content in both salvaged bricks showed gradients, from tridymite at the bricks' cold-face ends, to cristobalite at their hot-face end even though both bricks were an initial mixture of tridymite and cristobalite to begin with. The thermal conductivity of both bricks had increased as a consequence of these phase and microstructural changes. Α thermal analysis model predicted that such changes would result in an increase in the bricks' cold-face temperature and heat content during service. The initially-produced temperature gradients and environment caused microstructural changes in the silica brick; however, the cause-and-effect relationship between temperature/environment and microstructural changes in the brick likely became mutually reversible once the microstructural changes initiated and the thermal conductivity of the brick started to change as a consequence

Direct-Cooled Power Electronics Substrate

The goal of the Direct-Cooled Power Electronics Substrate project is to reduce the size and weight of the heat sink for power electronics used in hybrid electric vehicles (HEVs) and plug-in hybrid electric vehicles (PHEVs). The concept proposed in this project was to develop an innovative power electronics mounting structure, model it, and perform both thermal and mechanical finite-element analysis (FEA). This concept involved integrating cooling channels within the direct-bonded copper (DBC) substrate and strategically locating these channels underneath the power electronic devices. This arrangement would then be directly cooled by water-ethylene glycol (WEG), essentially eliminating the conventional heat sink and associated heat flow path. The concept was evaluated to determine its manufacturability, its compatibility with WEG, and the potential to reduce size and weight while directly cooling the DBC and associated electronics with a coolant temperature of 105 C. This concept does not provide direct cooling to the electronics, only direct cooling inside the DBC substrate itself. These designs will take into account issues such as containment of the fluid (separation from the electronics) and synergy with the whole power inverter design architecture. In FY 2008, mechanical modeling of substrate and inverter core designs as well as thermal and mechanical stress FEA modeling of the substrate designs was performed, along with research into manufacturing capabilities and methods that will support the substrate designs. In FY 2009, a preferred design(s) will be fabricated and laboratory validation testing will be completed. In FY 2010, based on the previous years laboratory testing, the mechanical design will be modified and the next generation will be built and tested in an operating inverter prototype

Properties of Bulk Sintered Silver As a Function of Porosity

This report summarizes a study where various properties of bulk-sintered silver were investigated over a range of porosity. This work was conducted within the National Transportation Research Center's Power Device Packaging project that is part of the DOE Vehicle Technologies Advanced Power Electronics and Electric Motors Program. Sintered silver, as an interconnect material in power electronics, inherently has porosity in its produced structure because of the way it is made. Therefore, interest existed in this study to examine if that porosity affected electrical properties, thermal properties, and mechanical properties because any dependencies could affect the intended function (e.g., thermal transfer, mechanical stress relief, etc.) or reliability of that interconnect layer and alter how its performance is modeled. Disks of bulk-sintered silver were fabricated using different starting silver pastes and different sintering conditions to promote different amounts of porosity. Test coupons were harvested out of the disks to measure electrical resistivity and electrical conductivity, thermal conductivity, coefficient of thermal expansion, elastic modulus, Poisson's ratio, and yield stress. The authors fully recognize that the microstructure of processed bulk silver coupons may indeed not be identical to the microstructure produced in thin (20-50 microns) layers of sintered silver. However, measuring these same properties with such a thin actual structure is very difficult, requires very specialized specimen preparation and unique testing instrumentation, is expensive, and has experimental shortfalls of its own, so the authors concluded that the herein measured responses using processed bulk sintered silver coupons would be sufficient to determine acceptable values of those properties. Almost all the investigated properties of bulk sintered silver changed with porosity content within a range of 3-38% porosity. Electrical resistivity, electrical conductivity, thermal conductivity, elastic modulus, Poisson's ratio, and yield stress all depended on the porosity content in bulk-sintered silver. The only investigated property that was independent of porosity in that range was coefficient of thermal expansion

Revisiting the Recommended Geometry for the Diametrally Compressed Ceramic C-Ring Specimen

A study conducted several years ago found that a stated allowable width/thickness (b/t) ratio in ASTM C1323 (Standard Test Method for Ultimate Strength of Advanced Ceramics with Diametrally Compressed C-Ring Specimens at Ambient Temperature) could ultimately cause the prediction of a non-conservative probability of survival when the measured C-ring strength was scaled to a different size. Because of that problem, this study sought to reevaluate the stress state and geometry of the C-ring specimen and suggest changes to ASTM C1323 that would resolve that issue. Elasticity, mechanics of materials, and finite element solutions were revisited with the C ring geometry. To avoid the introduction of more than 2% error, it was determined that the C ring width/thickness (b/t) ratio should range between 1-3 and that its inner radius/outer radius (ri/ro) ratio should range between 0.50-0.95. ASTM C1323 presently allows for b/t to be as large as 4 so that ratio should be reduced to 3

In-Situ Mechanical Property Evaluation of Dielectric Ceramics in Multilayer Capacitors

The Young's modulus, hardness, and fracture toughness of barium titanate dielectric ceramics in three commercially available multilayer capacitors (MLCs) were measured in-situ using indentation and a mechanical properties microprobe. The three MLCs were equivalent in size (0805), capacitance (0.1 uF) and dielectric type (X7R). The Young's modulus and hardness of the dielectric ceramics in the three MLCs were similar, while there were statistically significant differences in their fracture toughnesses. The results provide insight into the assessment of MLC mechanical reliability, and show that equivalent electrical MLC rating is not necessarily a guarantee that the dielectric ceramics in them will exhibit equivalent mechanical performance