Foreword

This work reports on the performances of ohmic contacts fabricated on highly p-type doped 4H-SiC epitaxial layer selectively grown by vapor-liquid-solid transport. Due to the very high doping level obtained, the contacts have an ohmic behavior even without any annealing process. Upon variation of annealing temperatures, it was shown that both 500 and 800 °C annealing temperature lead to a minimum value of the Specific Contact Resistance (SCR) down to 1.3×10−6 Ω⋅cm2. However, a large variation of the minimum SCR values has been observed (up to 4×10−4 Ω⋅cm2). Possible sources of this fluctuation have been also discussed in this paper

GaN metal-oxide-semiconductor field-effect transistor inversion channel mobility modeling

6 páginas, 6 figuras, 2 tablas.Lateral n-channel enhancement-mode GaN metal-oxide-semiconductor (MOS) field-effect transistors and lateral capacitors have been fabricated on a p-type epi-GaN substrate semiconductor and electrically characterized at different temperatures. A clear positive behavior of the inversion channel mobility with temperature has been obtained. A physics-based model on the inversion charge and charge trapped in interface states characteristics has been used to investigate the temperature dependence of the inversion MOS channel mobility. The field-effect mobility increase with temperature is due to an increase in the inversion charge and a reduction in the trapped charge for a given voltage gate. Then, for larger gate bias and/or higher temperatures, surface roughness effects become relevant. The good fitting of the model with the experimental data leads us to consider that the high density of charged acceptor interface traps together with a large interface roughness modulates the channel mobility due to scattering of free carriers in the inversion layer. A closed form expression for the experimental inversion MOS channel mobility is proposed.This work was supported in part by the Spanish Ministry of Science under Research Contract No. TEC2008-05577/ TEC (THERMOS Project).Peer reviewe

Edge termination design improvements for 10 kV 4H-SiC bipolar diodes

International audience10 kV class 4H-SiC bipolar diodes have been fabricated. Two different edge terminations (Mesa/JTE or MESA/JTE with JTE rings) with two different junction bend radius have been designed and tested. Measurement results show that the inclusion of JTE rings improve the edge termination efficiency. The measurements indicate also better reverse performances of diodes with large bend radius

SiC Schottky Diodes for Harsh Environment Space Applications

9 páginas, 11 figuras, 4 tablas.This paper reports on the fabrication technology and packaging strategy for 300-V 5-A silicon carbide Schottky diodes with a wide temperature operation range capability (between -170 °C and 300 °C). These diodes have been designed for harsh environment space applications such as inner Solar System exploration probes. Different endurance tests have been performed to evaluate the diode behavior when working at a high temperature and under severe thermal cycling conditions (ranged from -170 °C to 270 °C). The radiation hardness capability has been also tested. It has been found that the hermeticity of the package in a neutral atmosphere is a key aspect to avoid an electrical parameter drift. Moreover, the use of gold metallization and gold wire bonds on the anode allows reducing the diode surface and bonding degradation when compared to Al-containing technology. On the back-side cathode contact, the Ti/Ni/Au metallization and AuGe combination have shown a very good behavior. As a result, the manufactured diodes demonstrated high stability for a continuous operation at 285 °C.This work was performed in the framework of the European Space Agency project (BEPI/SC/CNM-0700- Solar Array HT Blocking Diodes) under the supervision of Dr. C. Baur from the European Space Research and Technology Centre.Peer reviewe

Field-effect mobility temperature modeling of 4H-SiC metal-oxide-semiconductor transistors

Here a physically based channel mobility model has been developed to investigate the temperature dependence of the field-effect mobility of 4H-SiC metal-oxide-semiconductor (MOS) transistors with thermally oxidized gate insulators. This model has been designed so that it accounts for the high density of traps at the MOS interface. This temperature dependence is a key issue for silicon carbide electronics, as its basic material properties make it the foremost semiconductor for high power/high temperature electronic devices in applications such as spacecraft, aircraft, automobile, and energy distribution. Our modeling suggests that the high density of charged acceptor interface traps, encountered in thermally grown gate oxides, modulates the channel mobility due to the Coulomb scattering of free carriers in the inversion layer. When the temperature increases, the field-effect mobility of these devices also increases, due to an increase in inversion charge and a reduction of the trapped charge. Experimental data of the field-effect mobility temperature dependence are in good agreement with this model. (c) 2006 American Institute of Physics