9 research outputs found
Coherent modulation up to 100 GBd 16QAM using silicon-organic hybrid (SOH) devices
We demonstrate the generation of higher-order modulation formats using
silicon-based inphase/quadrature (IQ) modulators at symbol rates of up to 100
GBd. Our devices exploit the advantages of silicon-organic hybrid (SOH)
integration, which combines silicon-on-insulator waveguides with highly
efficient organic electro-optic (EO) cladding materials to enable small drive
voltages and sub-millimeter device lengths. In our experiments, we use an SOH
IQ modulator with a {\pi}-voltage of 1.6 V to generate 100 GBd 16QAM signals.
This is the first time that the 100 GBd mark is reached with an IQ modulator
realized on a semiconductor substrate, leading to a single-polarization line
rate of 400 Gbit/s. The peak-to-peak drive voltages amount to 1.5 Vpp,
corresponding to an electrical energy dissipation in the modulator of only 25
fJ/bit
Silicon-Organic Hybrid (SOH) Mach-Zehnder Modulators for 100 Gbit/s On-Off Keying
Electro-optic modulators for high-speed on-off keying (OOK) are key
components of short- and mediumreach interconnects in data-center networks.
Besides small footprint and cost-efficient large-scale production, small drive
voltages and ultra-low power consumption are of paramount importance for such
devices. Here we demonstrate that the concept of silicon-organic hybrid (SOH)
integration is perfectly suited for meeting these challenges. The approach
combines the unique processing advantages of large-scale silicon photonics with
unrivalled electro-optic (EO) coefficients obtained by molecular engineering of
organic materials. In our proof-of-concept experiments, we demonstrate
generation and transmission of OOK signals with line rates of up to 100 Gbit/s
using a 1.1 mm-long SOH Mach-Zehnder modulator (MZM) which features a
{\pi}-voltage of only 0.9 V. This experiment represents not only the first
demonstration of 100 Gbit/s OOK on the silicon photonic platform, but also
leads to the lowest drive voltage and energy consumption ever demonstrated at
this data rate for a semiconductor-based device. We support our experimental
results by a theoretical analysis and show that the nonlinear transfer
characteristic of the MZM can be exploited to overcome bandwidth limitations of
the modulator and of the electric driver circuitry. The devices are fabricated
in a commercial silicon photonics line and can hence be combined with the full
portfolio of standard silicon photonic devices. We expect that high-speed
power-efficient SOH modulators may have transformative impact on short-reach
optical networks, enabling compact transceivers with unprecedented energy
efficiency that will be at the heart of future Ethernet interfaces at Tbit/s
data rates
Hot-spot relaxation time current dependence in niobium nitride waveguide-integrated superconducting nanowire single-photon detectors
We investigate how the bias current affects the hot-spot relaxation dynamics in niobium nitride. We use for this purpose a near-infrared pump-probe technique on a waveguide-integrated superconducting nanowire single-photon detector driven in the twophoton regime. We observe a strong increase in the picosecond relaxation time for higher bias currents. A minimum relaxation time of (22 ± 1) ps is obtained when applying a bias current of 50% of the switching current at 1.7 K bath temperature. We also propose a practical approach to accurately estimate the photon detection regimes based on the reconstruction of the measured detector tomography at different bias currents and for different illumination conditions
InP/Silicon Hybrid External-Cavity Lasers (ECL) Using Photonic Wirebonds as Coupling Elements
Hybrid external-cavity lasers (ECL) using photonic wire bonds as coupling elements
Combining semiconductor optical amplifiers (SOA) on direct-bandgap III–V substrates with low-loss silicon or silicon-nitride photonic integrated circuits (PIC) has been key to chip-scale external-cavity lasers (ECL) that offer wideband tunability along with small optical linewidths. However, fabrication of such devices still relies on technologically demanding monolithic integration of heterogeneous material systems or requires costly high-precision package-level assembly, often based on active alignment, to achieve low-loss coupling between the SOA and the external feedback circuits. In this paper, we demonstrate a novel class of hybrid ECL that overcome these limitations by exploiting 3D-printed photonic wire bonds as intra-cavity coupling elements. Photonic wire bonds can be written in-situ in a fully automated process with shapes adapted to the mode-field sizes and the positions of the chips at both ends, thereby providing low-loss coupling even in presence of limited placement accuracy. In a proof-of-concept experiment, we use an InP-based reflective SOA (RSOA) along with a silicon photonic external feedback circuit and demonstrate a single-mode tuning range from 1515 to 1565 nm along with side mode suppression ratios above 40 dB and intrinsic linewidths down to 105 kHz. Our approach combines the scalability advantages of monolithic integration with the performance and flexibility of hybrid multi-chip assemblies and may thus open a path towards integrated ECL on a wide variety of integration platforms
Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects
Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding