Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding

Alloatti, Luca

Billah, Muhammad Rodlin

Dalton, L. R.

Freude, Wolfgang

Giesecke, A.-L.

Hartmann, Wladislaw

Hoose, Tobias

Koeber, Sebastian

Koos, Christian

Korn, Dietmar

Lauermann, Matthias

Leuthold, J.

Lindenmann, Nicole

Melikyan, Argishti

Palmer, Robert

Wahlbrink, T.

Weimann, Claudius

Wolf, Stefan M.

Zwickel, H.

KITopen

This article has been accepted for publication, but has not been fully edited. Content may change prior to final publication.  Citation information: DOI https://doi.org/10.1109/OIC.2016.7483033   © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future me-dia, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistri-bution to servers or lists, or reuse of any copyrighted component of this work in other works. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects C. Koos1,2,*, W. Freude1, J. Leuthold3, L. R. Dalton4, S. Wolf1, H. Zwickel1,2, T. Hoose2, M. R. Billah2,  M. Lauermann1, C. Weimann1, W. Hartmann1,2, A. Melikyan2, N. Lindenmann2, S. Koeber1,2,  R. Palmer1, D. Korn1, L. Alloatti1, A.-L. Giesecke6, T. Wahlbrink6 1Institute of Photonics and Quantum Electronics (IPQ), Karlsruhe Institute of Technology (KIT), 76131 Karlsruhe, Germany 2Institute of Microstructure Technology (IMT), Karlsruhe Institute of Technology (KIT), 76131 Karlsruhe, Germany 3Now with: Institute of Electromagnetic Fields (IEF), Swiss Federal Institute of Technology (ETH), Zurich, Switzerland 4University of Washington, Department of Chemistry, Seattle, WA 98195-1700, United States 6AMO GmbH, 52074 Aachen, Germany *email: christian.koos@kit.edu  Abstract— Limitations of silicon photonics can be overcome by hybrid integration of silicon photonic or plasmonic circuits with organic materials or by photonic multi-chip systems. We give an overview on our recent progress regarding both silicon-organic hybrid (SOH) integration and multi-chip integration enabled by photonic wire bonding. Keywords — Silicon photonics, silicon-organic hybrid (SOH) integration, plasmonic-organic hybrid (SOH) integration, multi-chip integration, photonic wire bonding, optical interconnects SUMMARY Silicon photonics shows tremendous potential for large-scale photonic-electronic integration by fabless fabrica-tion of photonic and electronic circuits [1]. Silicon as an optical material, however, falls short of properties that are indispensable for high-performance devices: The in-direct bandgap of crystalline silicon inhibits efficient light emission, and the inversion symmetry of the silicon crystal lattice prevents second-order optical nonlineari-ties, thereby making electro-optic modulators challeng-ing. Our research focusses on hybrid integration con-cepts, which combine silicon photonic circuits with other material systems that provide complementary optical properties. In this paper, we give an overview on our re-cent progress in the fields of silicon-based hybrid integra-tion and of photonic multi-chip integration.  To enable efficient electro-optic modulators on the silicon photonic platform, we exploit the concept of sili-con-organic hybrid (SOH) integration that combines nanophotonic silicon waveguides with organic cladding materials [2] – [15]. This approach [2] leads to highly efficient devices, featuring energy consumptions of only a few fJ per bit [3], [4]. The response of the electro-optic materials is ultra-fast and enables small-signal modula-tion at 100 GHz [5], generation of 100 Gbit/s on-of-keying (OOK) signals [6], and symbol rates of 64 GBd for multi-level signaling [7]. Moreover, we demonstrated generation of advanced modulation formats such as 16QAM using in-phase-quadrature (IQ-)modulators with record-low energy consumption and symbol rates (bit rates) of up to 40 GBd (160 Gbit/s) [8], [9]. We further show that the extraordinarily low operating voltage of SOH modulators allows operation of these devices di-rectly from standard output ports of field-programmable gate arrays (FPGA), without the need for external ampli-fiers and digital-to-analog converters. Such schemes can be used even if higher-order modulation formats such as 16QAM are to be generated [10]. Moreover, we use SOH devices for generating broadband frequency combs, which are well suited as optical multi-wavelength sources for terabit/s transmission [11]. On the long run, organic electro-optic materials might be replaced by second-order nonlinear metamaterials that exploit highly stable inor-ganic ABC-type nanolaminates fabricated by atomic-layer deposition (ALD) [12].  The SOH approach is a versatile concept that goes far beyond electro-optic modulators. In particular, we have also shown that compact and power-efficient SOH phase shifters can realized by using liquid crystals (LC) as cladding materials [13]. Moreover, optically pumped la-sers have been demonstrated on the silicon photonic plat-form by using SOH waveguides that are based on dye-doped cladding materials [14]. These devices can only be operated in pulsed mode and lend themselves as sources in optical biosensors. We have also shown that the con-cept of SOH integration can be transferred to plasmonic waveguide structures, leading to plasmonic-organic hy-brid (POH) devices [15]. We have demonstrated POH Mach-Zehnder modulators that feature a flat frequency response up to at least 65 GHz. Such devices and will potentially open the route for modulation at THz fre-quencies [15].  This article has been accepted for publication, but has not been fully edited. Content may change prior to final publication.  Citation information: DOI https://doi.org/10.1109/OIC.2016.7483033   © 2016 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future me-dia, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistri-bution to servers or lists, or reuse of any copyrighted component of this work in other works. See http://www.ieee.org/publications_standards/publications/rights/index.html for more information. The concepts of SOH and POH integration are com-plemented by photonic multi-chip integration that ex-ploits photonic wire bonding [16] for assembling photon-ic systems from discrete dies fabricated on different ma-terial platforms [17], [18]. We have introduced photonic wire bonding and demonstrated its viability for chip-chip [16], [18] and fiber-chip [17] interfaces. The concept en-ables, e.g., hybrid multi-chip integration of silicon pho-tonic circuitry along with InP-based light sources [18]. We believe that hybrid integration and photonic multi-chip systems are key concepts for highly scalable tera-bit/s photonic transceiver systems. ACKNOWLEDGEMENTS This work was supported by the European Research Council (ERC Starting Grant ‘EnTeraPIC’, number 280145), by the Alfried Krupp von Bohlen und Halbach Foundation, by the EU projects PhoxTroT and BigPipes, by the BMBF project PHOIBOS, by the Collaborative Research Centre “Wave-Phenomena” (CRC 1173) of Deutsche Forschungsgemein-schaft (DFG), by the Helmholtz International Research School for Teratronics (HIRST), by the Karlsruhe School of Optics and Photonics (KSOP), and by the Karlsruhe Nano-Micro Fa-cility (KNMF). REFERENCES [1] Sun, C.; Wade, M. T.; Lee, Y.; Orcutt, J. S.; Alloatti, L.; Georgas, M. S.; Waterman, A. S.; Shainline, M. S.;  Avizienis, R. R.; Lin, S.; Moss, B. R.; Kumar, R.; Pavanello, F.; Atabaki, A. H.; Cook, H. M.; Ou, A. J.; Leu, J. C.; Chen, Y.-H.;  Asanović, K.;  Ram, R. J.; Popović, M. A.; Stojanović, V. M.. 'Single-chip microprocessor that communicates directly using light" Nature 528, 534-538 (2015) [2] Koos, C.; Leuthold, J.; Freude, W.; Kohl, M.; Dalton, L. R.; Bogaerts, W.; Giesecke, A.-L-; Lauermann, M.; Melikyan, A.; Koeber, S.; Wolf, S.; Weimann, C.; Muehlbrandt, S.; Koehnle, K.; Pfeifle, J.; Hartmann, W.; Kutuvantavida, Y.; Ummethala, S.; Palmer, R.; Korn, D.; Alloatti, L.; Schindler, P. C.; Elder, D. L.; Wahlbrink, T.; Bolten, J.: ‘Silicon-Organic Hybrid (SOH) and Plasmonic-Organic Hybrid (POH) Integration’, J. Lightw. Technol., DOI: 10.1109/JLT.2015.2499763 (2016) [3] Palmer, R.; Koeber, S.; Elder, D. L.; Woessner, M.; Heni, W.; Korn, D.; Lauermann, D.; Bogaerts, W.; Dalton, L. R.; Freude, W.; Leuthold, J.; Koos, C.: ‘High-Speed, Low Drive-Voltage Silicon-Organic Hybrid Modulator based on a Binary-Chromophore Electro-Optic Material’, J. Lightw .Technol. 32, 2726–2734 (2014)  [4] Koeber, S.; Palmer, R.; Lauermann, M.; Heni, W.; Elder, D.; Korn, D.; Woessner, M; Alloatti, L.; Koenig, S.; Schindler, P.-C.; Yu, H.; Bogaerts, W.; Dalton, L.-R.; Freude, W.; Leuthold, J.; Koos, C.: ‘Femtojoule electro-optic modulation using a silicon-organic hybrid device’; Light: Science & Applications 4, e255 (2015)  [5] Alloatti, L.; Palmer, R.; Diebold, S.; Pahl, K. P.; Chen, B.; Dinu, R.; Fournier, M.; Fedeli, J.-M.; Zwick, T.; Freude, W.; Koos, C.; Leuthold, J.: ‘100 GHz silicon–organic hybrid modulator,’ Light: Science & Applications 3, e173 (2014)  [6] Hartmann, W.; Lauermann, M.; Wolf, S.; Zwickel, H.; Kutuvantavida, Y.; Luo, J.; Jen, A. K.-Y.; Freude, W.; Koos, C.: '100 Gbit/s OOK using a silicon-organic hybrid (SOH) modulator,' 41th European Conf. Opt. Commun. (ECOC'15), Valencia, Spain, Sept. 27 – Oct. 5, 2015. Paper PDP1.4  [7] Lauermann, M.; Wolf, S.; Palmer, R.; Bielik, A.; Altenhain, L.; Lutz, J.; Schmid, R.; Wahlbrink, T.; Bolten, J.; Giesecke, A. L.;  Freude, W.; Koos, C.: '64 GBd operation of a silicon-organic hybrid modulator at elevated temperature,' Optical Fiber Communication Conference (OFC'15), Los Angeles (CA), USA, 22.–26.03.2015. Paper Tu2A.5 [8] Lauermann, M.; Palmer, R.; Koeber, S.; Schindler, P. C.; Korn, D.; Wahlbrink, T.; Bolten, J.; Waldow, M.; Elder, D. L.; Dalton, L. R.; Leuthold, J.; Freude, W.; Koos, C.: ‘Low-power silicon-organic hybrid (SOH) modulators for advanced modulation formats,’ Opt. Express 22, 29927–29936 (2014)  [9] Lauermann, M.; Wolf, S.; Schindler, P.C.; Palmer, R.; Koeber, S.; Korn, D.; Alloatt, L.; Wahlbrink, T.; Bolten, J.; Waldow, M.; Koenigsmann, M.; Kohler, M.; Malsam, D.; Elder, D.L.; Johnston, P.V.; Phillips-Sylvain, N.; Sullivan, P.A.; Dalton, L. R.; Leuthold, J.; Freude, W.; Koos, C.: ‘40 GBd 16QAM Signaling at 160 Gbit/s in a Silicon-Organic Hybrid (SOH) Modulator,’, J. Lightw. Technol. 33, 1210–1216 (2015) [10] Wolf, S.; Lauermann, M.; Schindler, P.C.; Ronniger, G.; Geistert, K.; Palmer, R.; Koeber, S.; Bogaerts, W.; Leuthold, J.; Freude, W.; Koos, C.: "DAC-less Amplifier-less Generation and Transmission of QAM Signals Using Sub-Volt Silicon-organic Hybrid Modulators," J. Lightw. Technol. 33, 1425–1432 (2015)  [11] Weimann, C.; Schindler, P.; Palmer, R.; Wolf, S.; Bekele, D.; Korn, D.; Pfeifle, J.; Koeber, S.; Schmogrow, R.; Alloatti, L.; Elder, D.; Yu, H.; Bogaerts, W.; Dalton, L.; Freude, W.; Leuthold, J.; and Koos, C.: ‘Silicon-organic hybrid (SOH) frequency comb sources for terabit/s data transmission,’ Opt. Express 22, 3629–3637 (2014). [12] Alloatti, L.; Kieninger, C.; Froelich, A.; Lauermann, M.; Frenzel, T.; Köhnle, K.; Freude, W.; Leuthold, J.; Wegener, M.; Koos, C.: 'Second-order nonlinear optical metamaterials: ABC-type nanolaminates,' Appl. Phys. Lett. 107, 121903-1–4 (2015) [13] Pfeifle, J.; Alloatti, L.; Freude, W.; Leuthold, J. and Koos, C.: ‘Silicon-organic hybrid phase shifter based on a slot waveguide with a liquid-crystal cladding,’ Opt. Express 20 (2012), 15359–15376 [14] Korn, D.; Lauermann, M.; Koeber, S.; Appel, P.; Alloatti, L.; Palmer, R.; Dumon, P.; Freude, W.; Leuthold, J.; Koos, C.: “Lasing in Silicon-Organic Hybrid (SOH) Waveguides”; Nature Communications (2016)  [15] Melikyan, A.; Koehnle, K.; Lauermann, M.; Palmer, R.; Koeber, S.; Muehlbrandt, S.; Schindler, P. C.; Elder, D. L.; Wolf, S.; Heni, W.; Haffner, C.; Fedoryshyn, Y.; Hillerkuss, D.; Sommer, M.; Dalton, L. R.; Thourhout, D. V.; Freude, W.; Kohl, M.; Leuthold, J.; Koos, C.: ‘Plasmonic-organic hybrid (POH) modulators for OOK and BPSK signaling at 40 Gbit/s,’ Opt. Express 23, 9938–9946 (2015)  [16] Lindenmann, N.; Balthasar, G.; Hillerkuss, D.; Schmogrow, R.; Jordan, M.; Leuthold, J.; Freude, W.; Koos, C.: ‘Photonic wire bonding: a novel concept for chip-scale interconnects,’ Opt. Express 20, 17667–17677 (2012)  [17] Lindenmann, N.; Dottermusch, S.; Goedecke, M.-L.; Hoose, T.; Billah, M.-R.; Onanuga, T.-P; Hofmann, A.; Freude, W.; Koos, C.: ‘Connecting silicon photonic circuits to multicore fibers by photonic wire bonding;’ J. Lightw. Technol. 33, 755–760 (2015) [18] Billah, M.  R.; Hoose, T.; Onanuga, T.; Lindenmann, N.; Dietrich, P.; Wingert, T.; Goedecke, M. L.; Hoffmann, A.; Troppenz, U.; Sigmund, A.; Möhrle, M.; Freude, W.; Koos, C.: 'Multi-chip integration of lasers and silicon photonics by photonic wire bonding,' Conf. on Lasers and Electro-Optics (CLEO'15), San Jose (CA), USA, May 10–15, 2015. Paper STu2F.2  

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects

https://publikationen.bibliothek.kit.edu/1000058907/8218475

Silicon-organic hybrid (SOH) integration and photonic multi-chip systems: Technologies for high-speed optical interconnects

Abstract

Similar works

Full text

Available Versions

KITopen