34 research outputs found

    Near-surface processing on AlGaN/GaN heterostructures: a nanoscale electrical and structural characterization

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    The effects of near-surface processing on the properties of AlGaN/GaN heterostructures were studied, combining conventional electrical characterization on high-electron mobility transistors (HEMTs), with advanced characterization techniques with nanometer scale resolution, i.e., transmission electron microscopy, atomic force microscopy (AFM) and conductive atomic force microscopy (C-AFM). In particular, a CHF3-based plasma process in the gate region resulted in a shift of the threshold voltage in HEMT devices towards less negative values. Two-dimensional current maps acquired by C-AFM on the sample surface allowed us to monitor the local electrical modifications induced by the plasma fluorine incorporated in the material

    CaCu3Ti4O12 single crystals: insights on growth and nanoscopic investigation

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    The combination of scanning impedance microscopy and conductive atomic force microscopy was applied to single crystals of the perovskite-type oxide CaCu3Ti4O12 (CCTO) in order to provide a local dielectric characterization on ingot sections. Both techniques clearly showed dielectric heterogeneities due to the presence of inclusions within crystals grown in different laboratories. Despite macroscopic characterizations, such as Laue diffraction, gave no indications for the presence of inclusions within the crystals, the discovery of dielectric heterogeneities prompted a careful structural analysis, which revealed the presence of crystalline CaTiO3 (CTO) precipitates. Thus, the scanning probe investigation provided the evidence for the electrical homogeneity within the CCTO crystal and the presence of internal barriers due to the CCTO/CTO interfaces

    Nanoscale structural characterization of epitaxial graphene grown on off-axis 4H-SiC (0001)

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    In this work, we present a nanometer resolution structural characterization of epitaxial graphene (EG) layers grown on 4H-SiC (0001) 8° off-axis, by annealing in inert gas ambient (Ar) in a wide temperature range (Tgr from 1600 to 2000°C). For all the considered growth temperatures, few layers of graphene (FLG) conformally covering the 100 to 200-nm wide terraces of the SiC surface have been observed by high-resolution cross-sectional transmission electron microscopy (HR-XTEM). Tapping mode atomic force microscopy (t-AFM) showed the formation of wrinkles with approx. 1 to 2 nm height and 10 to 20 nm width in the FLG film, as a result of the release of the compressive strain, which builds up in FLG during the sample cooling due to the thermal expansion coefficients mismatch between graphene and SiC. While for EG grown on on-axis 4H-SiC an isotropic mesh-like network of wrinkles interconnected into nodes is commonly reported, in the present case of a vicinal SiC surface, wrinkles are preferentially oriented in the direction perpendicular to the step edges of the SiC terraces. For each Tgr, the number of graphene layers was determined on very small sample areas by HR-XTEM and, with high statistics and on several sample positions, by measuring the depth of selectively etched trenches in FLG by t-AFM. Both the density of wrinkles and the number of graphene layers are found to increase almost linearly as a function of the growth temperature in the considered temperature range

    Enhanced efficiency of the second harmonic inhomogeneous component in an opaque cavity

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    In this Letter, we experimentally demonstrate the enhancement of the inhomogeneous second harmonic conversion in the opaque region of a GaAs cavity with efficiencies of the order of 0.1% at 612nm, using 3 ps pump pulses having peak intensities of the order of 10MW=cm2. We show that the conversion efficiency of the inhomogeneous, phase-locked second harmonic component is a quadratic function of the cavity factor Q.Peer ReviewedPostprint (published version

    Nanoscale electro-structural characterisation of ohmic contacts formed on p-type implanted 4H-SiC

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    This work reports a nanoscale electro-structural characterisation of Ti/Al ohmic contacts formed on p-type Al-implanted silicon carbide (4H-SiC). The morphological and the electrical properties of the Al-implanted layer, annealed at 1700°C with or without a protective capping layer, and of the ohmic contacts were studied using atomic force microscopy [AFM], transmission line model measurements and local current measurements performed with conductive AFM

    Microscopic study of electrical properties of CrSi2 nanocrystals in silicon

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    Semiconducting CrSi2 nanocrystallites (NCs) were grown by reactive deposition epitaxy of Cr onto n-type silicon and covered with a 50-nm epitaxial silicon cap. Two types of samples were investigated: in one of them, the NCs were localized near the deposition depth, and in the other they migrated near the surface. The electrical characteristics were investigated in Schottky junctions by current-voltage and capacitance-voltage measurements. Atomic force microscopy (AFM), conductive AFM and scanning probe capacitance microscopy (SCM) were applied to reveal morphology and local electrical properties. The scanning probe methods yielded specific information, and tapping-mode AFM has shown up to 13-nm-high large-area protrusions not seen in the contact-mode AFM. The electrical interaction of the vibrating scanning tip results in virtual deformation of the surface. SCM has revealed NCs deep below the surface not seen by AFM. The electrically active probe yielded significantly better spatial resolution than AFM. The conductive AFM measurements have shown that the Cr-related point defects near the surface are responsible for the leakage of the macroscopic Schottky junctions, and also that NCs near the surface are sensitive to the mechanical and electrical stress induced by the scanning probe

    Scanning Probe Microscopy on heterogeneous CaCu3Ti4O12 thin films

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    The conductive atomic force microscopy provided a local characterization of the dielectric heterogeneities in CaCu3Ti4O12 (CCTO) thin films deposited by MOCVD on IrO2 bottom electrode. In particular, both techniques have been employed to clarify the role of the inter- and sub-granular features in terms of conductive and insulating regions. The microstructure and the dielectric properties of CCTO thin films have been studied and the evidence of internal barriers in CCTO thin films has been provided. The role of internal barriers and the possible explanation for the extrinsic origin of the giant dielectric response in CCTO has been evaluated

    Nanoscale characterization of electrical transport at metal/3C-SiC interfaces

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    In this work, the transport properties of metal/3C-SiC interfaces were monitored employing a nanoscale characterization approach in combination with conventional electrical measurements. In particular, using conductive atomic force microscopy allowed demonstrating that the stacking fault is the most pervasive, electrically active extended defect at 3C-SiC(111) surfaces, and it can be electrically passivated by an ultraviolet irradiation treatment. For the Au/3C-SiC Schottky interface, a contact area dependence of the Schottky barrier height (ΊB) was found even after this passivation, indicating that there are still some electrically active defects at the interface. Improved electrical properties were observed in the case of the Pt/3C-SiC system. In this case, annealing at 500°C resulted in a reduction of the leakage current and an increase of the Schottky barrier height (from 0.77 to 1.12 eV). A structural analysis of the reaction zone carried out by transmission electron microscopy [TEM] and X-ray diffraction showed that the improved electrical properties can be attributed to a consumption of the surface layer of SiC due to silicide (Pt2Si) formation. The degradation of Schottky characteristics at higher temperatures (up to 900°C) could be ascribed to the out-diffusion and aggregation of carbon into clusters, observed by TEM analysis

    Probing dielectric ceramics surface at sub-micrometer scale

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    Scanning probe microscopy (SPM) with conductive tips has been used to image the dielectric properties of ceramics with giant permittivity. In particular, measurements in impedance mode of local resistivity allowed to image the permittivity map on polycrystalline materials. Such imaging provides correlation between the dielectric properties and the sample structure, in particular focusing on defects inside the single grains. Great attention has been devoted to the possible artefacts due to surface imperfections, such as huge roughness and/or contamination. A reliable surface investigation has been obtained after the definition of both the physical and geometrical criteria to avoid the artefacts due to both the surface or anomalous tip-sample contact area variation (for instance, in grain boundaries, holes and cracks in the ceramic pills). In particular, the power spectral density (PSD) allows to get access to the different periodic components of the surface roughness. The PSD demonstrated to be a sensitive tool to check the surface conditions after the polishing procedures aimed to the progressive decreasing of surface roughness, in order to reach the SPM limits and to avoid artefacts inducing wrong data interpretation
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