Multimode PDMS waveguides fabricated using a hot-embossing technique

A novel method for fabricating multimode PDMS waveguides is presented. This process is based on a hot-embossing technique and generates high quality optical waveguides without a substantial residual layer after embossing. Furthermore, the process allows for low-cost fabrication since it relies on a replication technique and additionally only commercially available materials are used. The measured propagation loss is smaller than 0.24dB/cm and can be further reduced by improving the master mould quality

Flexible photonic sensors realized using printing technologies

Making sensors flexible and thin, is key to apply them on curved, moving surfaces, e.g. for wearable applications or to embed them in mechanical structures. Photonic sensor systems require the integration of microstructures (e.g. polymer waveguides), nanostructures (e.g. gratings), which can be realized using nanoimprint lithography, but may also need additional active or passive optical components, which can be integrated using laser printing technologies

Fully embedded optical and electrical interconnections in flexible foils

This paper presents the development of a technology platform for the full integration of opto-electronic and electronic components, as well as optical interconnections in a flexible foil. A technology is developed to embed ultra thin (20 μ m) VCSEL's and Photodiodes in layers of optical transparent material. These layers are sandwiched in between two Polyimide layers to get a flexible foil with a final stack thickness of 150 μ m. Optical waveguides are structured by photolithography in the optical layers and pluggable mirror components couple the light from the embedded opto-electronics in and out of the waveguides. Besides optical links and optoelectronic components, electrical circuitry is also embedded by means of embedded copper tracks and thinned down Integrated Circuits (20 μ m). Optical connection towards the outer world is realized by U-groove passive alignment coupling of optical fibers with the embedded waveguides

Flexible thin polymer waveguide Bragg grating sensor foils for strain sensing

This paper demonstrates that epoxy-based single mode polymer waveguides with Bragg gratings can be realized in very thin (down to 50 micron) polymer foils which are suitable for strain sensing when integrated inside glass fiber reinforced polymer composite materials. The single mode waveguides were fabricated using laser direct-write lithography and the gratings were realized using nanoimprint lithography. These steps were performed on a temporary rigid carrier substrate and afterwards the functional layers were released yielding the thin, flexible sensor foils which can be laser-cut to the required dimensions. The Bragg grating-based polymer waveguide sensor foils were characterized before and after embedding into the composite. As expected, there was a blue shift in the reflection spectrum because of residual strain due to the embedding process. However, the quality of the signal did not degrade after embedding, both for 50 and 100 micron thick sensor foils. Finally, the sensitivity to strain of the embedded sensors was determined using a tensile test and found to be about 1 pm / microstrain

Expanded-beam backside coupling interface for alignment-tolerant packaging of silicon photonics

We demonstrate an alignment-tolerant backside coupling interface in the O-band for silicon photonics by generating an optimized through-substrate (downward) directionality beam from a TE-mode grating coupler and hybrid integrating the chip with backside silicon microlenses to achieve expanded beam collimation. The key advantage of using such an expanded beam interface is an increased coupling tolerance to lateral and longitudinal misalignment. A 34 mu m beam diameter was achieved over a combined substrate thickness of 630 mu m which was then coupled to a thermally expanded core single-mode fiber to investigate the tolerances. A 1-dB fiber-to-microlens lateral alignment tolerance of 14 mu m and an angular alignment tolerance of 1 degrees was measured at a wavelength of 1310 nm. In addition, a large +/- 2.5 mu m 1-dB backside alignment accuracy was measured for the placement of microlens with respect to the grating. The radius of curvature of Si microlens to achieve a collimated beam was 480 mu m, and a 1-dB longitudinal alignment tolerance of 700 mu m was measured for coupling to a single-mode expanded core fiber. The relaxation in alignment tolerances make the demonstrated coupling interface suitable for chip-to-package or chip-to-board couplin

Ball lens embedded through-package via to enable backside coupling between silicon photonics interposer and board-level interconnects

Development of an efficient and densely integrated optical coupling interface for silicon photonics based board-level optical interconnects is one of the key challenges in the domain of 2.5D/3D electro-optic integration. Enabling high-speed on-chip electro-optic conversion and efficient optical transmission across package/board-level short-reach interconnections can help overcome the limitations of a conventional electrical I/O in terms of bandwidth density and power consumption in a high-performance computing environment. In this context, we have demonstrated a novel optical coupling interface to integrate silicon photonics with board-level optical interconnects. We show that by integrating a ball lens in a via drilled in an organic package substrate, the optical beam diffracted from a downward directionality grating on a photonics chip can be coupled to a board-level polymer multimode waveguide with a good alignment tolerance. A key result from the experiment was a 14 chip-to-package 1-dB lateral alignment tolerance for coupling into a polymer waveguide with a cross-section of 20 x 25. An in-depth analysis of loss distribution across several interfaces was done and a -3.4 dB coupling efficiency was measured between the optical interface comprising of output grating, ball lens and polymer waveguide. Furthermore, it is shown that an efficiency better than -2 dB can be achieved by tweaking few parameters in the coupling interface. The fabrication of the optical interfaces and related measurements are reported and verified with simulation results

Mid-infrared resonant ablation of PMMA

Laser ablation proved to be a reliable micro-fabrication technique for patterning and structuring of both thin film and bulk polymer materials. In most of the industrial applications ultra-violet (UV) laser sources are employed, however they have limitations such as maintenance costs and practical issues. As an alternative and promising approach, mid-infrared resonant laser ablation (RIA) has been introduced, in which the laser wavelength is tuned to one of the molecular vibrational transi-tions of the polymer to be ablated. Consequently, the technique is selective in respect of processing a diversity of polymers which usually have different infrared absorption bands. In this paper, we present mid-infrared resonant ablation of PolyMethyl MethAcrylate (PMMA), employing nanosec-ond laser pulses tunable between 3 and 4 microns. This RIA nanosecond laser set-up is based on a commercial laser at 1064 nm pumping a singly resonant Optical Parametric Oscillator (OPO) built around a Periodically-Poled Lithium Niobate (PPLN) crystal with several Quasi-Phase Matching (QPM) periods. RIA has been successfully demonstrated for structuring bulk PMMA, and selective patterning of PMMA thin films on a glass substrate has been implemented