Silicon nanophotonic ring resonators sensors integrated in reaction tubes

Enzyme-linked immunosorbent assays (ELISA) are the most popular immunoassay techniques performed every day in hospitals and laboratories and they are used as a diagnostic tool in medicine and plant pathology, as well as a quality-control check in various industries. However, complex labeling techniques are required to be able to perform the assay and non-specific binding and endpoint timing are difficult to optimize. These issues could be solved by label-free techniques such as silicon nanophotonic microring resonator sensors, but this platform requires complex microfluidics, which is very much removed from the daily practice in e. g. hospital labs, which still relies to a large degree on platforms like 96-well microtiter plates or reaction tubes. To address these issues, here, we propose the combination of a simple and compatible reaction tube platform with label free silicon-on-insulator (SOI) photonic biosensors, where the flow is through the sensor chip as opposed to over the chip as in more conventional approaches. This device allows real time detection and analysis. Its great flexibility and small footprint make it ideal for an easy handling in any laboratory

An approach to produce a stack of photo definable polyimide based flat UTCPs

Getting output of multiple chips within the volume of a single chip is the driving force behind development of this novel 3D integration technology which has a broad range of industrial and medical electronic applications. This can be achieved by laminating multiple layers of spin-on polyimide based ultrathin chip packages (UTCPs) with fine pitch through hole interconnects

Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

We present the use of femtosecond laser ablation for the removal of monolayer graphene from silicon-on-insulator (SOI) waveguides, and the use of oxygen plasma etching through a metal mask to peel off graphene from the grating couplers attached to the waveguides. Through Raman spectroscopy and atomic force microscopy, we show that the removal of graphene is successful with minimal damage to the underlying SOI waveguides. Finally, we employ both removal techniques to measure the contribution of graphene to the loss of grating-coupled graphene-covered SOI waveguides using the cut-back method. This loss contribution is measured to be 0.132 dB/μm

Stretchable mould interconnect optimization : peeling automation and carrierless techniques

The primary bottleneck of the stretchable mold interconnect (SMI) technology is its reliance on carrier boards. These are necessary to handle the meandered circuit during production and to ensure dimensional stability of the flexible circuit board before encapsulation. However, for all the problems it solves, it also introduces a new major problem by requiring a peeling step – which is difficult to automate. This manuscript aims to present some of the work that went into eliminating this problem, discussing both unsuccessful and functioning methods to tackle this conundrum and some of the experimental work that went into verifying these techniques. First, alterations to the design to simplify peeling are considered, followed by adhesivebased peeling processes and mechanical pin-based systems. Next, masking and structuring of the carrier board adhesive are considered. Finally, two carrierless methods which circumvent the problems are discussed, a two-step process – which cuts temporary support structures after partial encapsulation – and a technique whereby the frame is designed to fail in a controlled manner during the first use of the circuit, creating a carrierless process feasible for high-volume production