Aqueous-Base-Developable Benzocyclobutene (BCB)-Based Material -An Emerging Dielectric Material for Microelectronics

A self-priming and photosensitive aqueous-base-developable benzocyclobutene (BCB)-based dielectric material curable in air is described. The polymer is made from divinylsiloxane benzocyclobutene and BCB-acrylic acid. Patterned films have high resolution, and via openings are scum-free without a descum operation. Whether cured in nitrogen or in air, the formulation produces a film with optical, electrical, thermal, and mechanical properties desired for many microelectronic applications, such as packaging applications and a planarization layer or insulation layer in display applications

Denotative and Connotative Semantics in Hypermedia: Proposal for a Semiotic-Aware Architecture

In this article we claim that the linguistic-centered view within hypermedia systems needs refinement through a semiotic-based approach before real interoperation between media can be achieved. We discuss the problems of visual signification for images and video in dynamic systems, in which users can access visual material in a non-linear fashion. We describe how semiotics can help overcome such problems, by allowing descriptions of the material on both denotative and connotative levels. Finally we propose an architecture for a dynamic semiotic-aware hypermedia system

The Effects of Two Types of Sleep Deprivation on Visual Working Memory Capacity and Filtering Efficiency

Sleep deprivation has adverse consequences for a variety of cognitive functions. The exact effects of sleep deprivation, though, are dependent upon the cognitive process examined. Within working memory, for example, some component processes are more vulnerable to sleep deprivation than others. Additionally, the differential impacts on cognition of different types of sleep deprivation have not been well studied. The aim of this study was to examine the effects of one night of total sleep deprivation and 4 nights of partial sleep deprivation (4 hours in bed/night) on two components of visual working memory: capacity and filtering efficiency. Forty-four healthy young adults were randomly assigned to one of the two sleep deprivation conditions. All participants were studied: 1) in a well-rested condition (following 6 nights of 9 hours in bed/night); and 2) following sleep deprivation, in a counter-balanced order. Visual working memory testing consisted of two related tasks. The first measured visual working memory capacity and the second measured the ability to ignore distractor stimuli in a visual scene (filtering efficiency). Results showed neither type of sleep deprivation reduced visual working memory capacity. Partial sleep deprivation also generally did not change filtering efficiency. Total sleep deprivation, on the other hand, did impair performance in the filtering task. These results suggest components of visual working memory are differentially vulnerable to the effects of sleep deprivation, and different types of sleep deprivation impact visual working memory to different degrees. Such findings have implications for operational settings where individuals may need to perform with inadequate sleep and whose jobs involve receiving an array of visual information and discriminating the relevant from the irrelevant prior to making decisions or taking actions (e.g., baggage screeners, air traffic controllers, military personnel, health care providers)

Associations between physical activity types and multi-domain cognitive decline in older adults from the Three-city cohort

Several studies suggest that physical activity improves cognitive functions and reduces cognitive decline, whereas others did not find any evidence of a neuroprotective effect. Furthermore, few cohort studies have analyzed the different physical activity types and particularly household activities. Our objective was to assess the association of two physical activity types with the decline in different cognitive domains in a large prospective cohort of community-dwelling older adults from the Three-city study. Physical activity (domestic/transportation activities and leisure/sport activities) was assessed with the Voorrips questionnaire, specific for older adults. Baseline sociodemographic and health history variables as well as cognitive performance data at baseline and during the 8-year follow-up (Mini-Mental State Examination, Benton Visual Retention Test, Trail Making Tests A and B, Isaac's Set Test and Free and Cued Selective Reminding Test) were also available. Associations between physical activity scores and cognitive decline in different domains were tested using minimally- and multi-adjusted linear mixed models. The analysis included 1697 participants without dementia at baseline and with at least one follow-up visit. At baseline, participants with higher sub-scores for the two physical activity types had better cognitive performances. Interaction with time showed that decline in some cognitive scores (Trail Making Test B and Isaac's Set Test) was significantly less pronounced in participants with higher household/transportation activity sub-scores. No significant effect over time was found for leisure/sport activities. This study shows that during an 8-year follow-up, executive functions and verbal fluency were better preserved in older adults who performed household/transportation activities at moderate to high level. Participation in domestic activities and using adapted transport means could allow older adults to maintain specific cognitive abilities

Low cost UBM for lead free solder bumping with C4NP

The under bump metallurgy (UBM) structure is a critical component of any solder interconnect system. The UBM typically provides three functions: adhesion to underlying dielectric and metal, barrier to protect the silicon circuitry, and a solder wettable surface. For lead-free solder bumps, the barrier layer is key to reliability due to their higher Sn content. A common barrier layer used in the industry is electroplated nickel. This layer provides good protection from degradation of the silicon metallurgy by tin rich lead free solders. Controlled Collapse Chip Connection - New Process (C4NP) provides an opportunity to eliminate electroplating, and its associated costs for plating chemistry, analysis, supply and waste treatment. This paper analyzes electroless Ni/immersion Au (ENIG), with and without Pd, as an alternative UBM structure. Wafers were fabricated with these UBM structures, solder applied with C4NP, and chip level stressing performed to determine the robustne ss of these alternative stack-ups. Analysis of these structures following multiple reflows and thermal cycling is presented. In addition, the paper also reviews production cost analysis for various UBM stackups and solder bump processes, based on a specifically developed cost model. The ENIG UBM structures in combination with C4NP solder bumping provide a significant cost reduction over alternative structures. C4NP is a unique solder bumping technology developed by IBM which addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. It is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass molds. The glass mold contains etched cavities which mirror the bump pattern on the wafer. The filled mold is inspected prior to solder transfer to the wafer to ensure high final yields. Filled mold and wafer are brought into close proximity/soft contact at reflow temperature and so

Low temperature wafer level bonding using benzocyclobutene adhesive polymers

3D stacking, one of the 3D integration technologies using through silicon vias (TSVs), is considered as a desirable 3D solution due to its cost effectiveness and matured technical background. For successful 3D stacking, precisely controlled bonding of the two substrates is necessary, so that various methods and materials have been developed over the last decade. Wafer bonding using polymeric adhesives has advantages. Surface roughness, which is critical in direct bonding and metal-to-metal bonding, is not a significant issue, as the organic adhesive can smooth out the unevenness during bonding process. Moreover, bonding of good quality can be obtained using relatively low bonding pressure and low bonding temperature. Benzocyclobutene (BCB) polymers have been commonly used as bonding adhesives due to their relatively low curing temperature (~250°C), very low water uptake (<0.2%), excellent planarizing capability, and good affinity to Cu metal lines. In this study, we pr esent wafer bonding with BCB at various conditions. In particular, bonding experiments are performed at low temperature range (180°C ~ 210°C), which results in partially cured state. In order to examine the effectiveness of the low temperature process, the mechanical (adhesion) strength and dimensional changes are measured after bonding, and compared with the values of the fully cured state. Two different BCB polymers, dry-etch type and photo type, are examined. Dry etch BCB is proper for full-area bonding, as it has low degree of cure and therefore less viscosity. Photo-BCB has advantages when a pattern (frame or via open) is to be structured on the film, since it is photoimageable (negative tone), and its moderate viscosity enables the film to sustain the patterns during the wafer bonding process. The effect of edge beads at the wafer rim area and the soft cure (before bonding) conditions on the bonding quality are also studied

UBM structures for lead free solder bumping using C4NP

This paper analyzes electroless Ni/immersion Au (ENIG), with and without Pd, as an alternative Under Bump Metallurgy (UBM) structure in combination with lead free solders. Wafers were fabricated with these UBM structures, lead-free solders applied with Controlled Collapse Chip Connection - New Process (C4NP), and chip level stressing performed to determine the robustness of this alternative stack-up. Shear strength of these structures following multiple reflows and thermal cycling is presented. The data in this paper is provided by the analytical laboratory at Fraunhofer Institute, IZM, Berlin, Germany. UBM formation was done at Fraunhofer IZM. Wafer bumping was done using the C4NP process at IBM Hudson Valley Research Park, NY

Elimination und Rueckgewinnung von Schwermetallen. Teilprojekt: Aufklaerung der Bindungsmechanismen zwischen Schwermetallen und Mikroalgen Schlussbericht

The report describes sorption experiments with devitalized marine Phaeophyceae and their waste products, which aimed to establish their sorption potential and the factors bearing on biological sorption (pH, concentration of biomass, particle size, heavy metal concentration, heavy metal and algae species, co-ions, time). Apart from reference contaminated water samples, real industrial waste water samples were successfully treated with algal sorbents in batch and continuous column experiments, both on the laboratory scale and on a semi-technical scale. (orig./SR)SIGLEAvailable from TIB Hannover: F97B2138+a / FIZ - Fachinformationszzentrum Karlsruhe / TIB - Technische InformationsbibliothekBundesministerium fuer Bildung, Wissenschaft, Forschung und Technologie, Bonn (Germany)DEGerman