Patterning of graphene on silicon-on-insulator waveguides through laser ablation and plasma etching

We present the use of femtosecond laser ablation for the removal of monolayer graphene from silicon-on-insulator (SOI) waveguides, and the use of oxygen plasma etching through a metal mask to peel off graphene from the grating couplers attached to the waveguides. Through Raman spectroscopy and atomic force microscopy, we show that the removal of graphene is successful with minimal damage to the underlying SOI waveguides. Finally, we employ both removal techniques to measure the contribution of graphene to the loss of grating-coupled graphene-covered SOI waveguides using the cut-back method. This loss contribution is measured to be 0.132 dB/μm

Graphene growth on Ge(100)/Si(100) substrates by CVD method

The successful integration of graphene into microelectronic devices is strongly dependent on the availability of direct deposition processes, which can provide uniform, large area and high quality graphene on nonmetallic substrates. As of today the dominant technology is based on Si and obtaining graphene with Si is treated as the most advantageous solution. However, the formation of carbide during the growth process makes manufacturing graphene on Si wafers extremely challenging. To overcome these difficulties and reach the set goals, we proposed growth of high quality graphene layers by the CVD method on Ge(100)/Si(100) wafers. In addition, a stochastic model was applied in order to describe the graphene growth process on the Ge(100)/Si(100) substrate and to determine the direction of further processes. As a result, high quality graphene was grown, which was proved by Raman spectroscopy results, showing uniform monolayer films with FWHM of the 2D band of 32 cm−1

Robustness of momentum-indirect interlayer excitons in MoS2/WSe2 heterostructure against charge carrier doping

Monolayer transition-metal dichalcogenide (TMD) semiconductors exhibit strong excitonic effects and hold promise for optical and optoelectronic applications. Yet, electron doping of TMDs leads to the conversion of neutral excitons into negative trions, which recombine predominantly non-radiatively at room temperature. As a result, the photoluminescence (PL) intensity is quenched. Here we study the optical and electronic properties of a MoS2/WSe2 heterostructure as a function of chemical doping by Cs atoms performed under ultra-high vacuum conditions. By PL measurements we identify two interlayer excitons and assign them to the momentum-indirect Q-Gamma and K-Gamma transitions. The energies of these excitons are in a very good agreement with ab initio calculations. We find that the Q-Gamma interlayer exciton is robust to the electron doping and is present at room temperature even at a high charge carrier concentration. Submicrometer angle-resolved photoemission spectroscopy (micro-ARPES) reveals charge transfer from deposited Cs adatoms to both the upper MoS2 and the lower WSe2 monolayer without changing the band alignment. This leads to a small (10 meV) energy shift of interlayer excitons. Robustness of the momentum-indirect interlayer exciton to charge doping opens up an opportunity of using TMD heterostructures in light-emitting devices that can work at room temperature at high densities of charge carriers

Residual Metallic Contamination of Transferred Chemical Vapor Deposited Graphene

Integration of graphene with Si microelectronics is very appealing by offering potentially a broad range of new functionalities. New materials to be integrated with Si platform must conform to stringent purity standards. Here, we investigate graphene layers grown on copper foils by chemical vapor deposition and transferred to silicon wafers by wet etch and electrochemical delamination methods with respect to residual sub-monolayer metallic contaminations. Regardless of the transfer method and associated cleaning scheme, time-of-flight secondary ion mass spectrometry and total reflection x-ray fluorescence measurements indicate that the graphene sheets are contaminated with residual metals (copper, iron) with a concentration exceeding 10$^{13}$ atoms/cm$^{2}$. These metal impurities appear to be partly mobile upon thermal treatment as shown by depth profiling and reduction of the minority charge carrier diffusion length in the silicon substrate. As residual metallic impurities can significantly alter electronic and electrochemical properties of graphene and can severely impede the process of integration with silicon microelectronics these results reveal that further progress in synthesis, handling, and cleaning of graphene is required on the way to its advanced electronic and optoelectronic applications.Comment: 26 pages, including supporting informatio

Case studies of electrical characterisation of graphene by terahertz time-domain spectroscopy

Graphene metrology needs to keep up with the fast pace of developments in graphene growth and transfer. Terahertz time-domain spectroscopy (THz-TDS) is a non-contact, fast, and non-destructive characterization technique for mapping the electrical properties of graphene. Here we show several case studies of graphene characterization on a range of different substrates that highlight the versatility of THz-TDS measurements and its relevance for process optimization in graphene production scenarios

Design of Material Structures for Heterostructure Barrier Varactors

The Heterostructure Barrier Varactor (HBV), first proposed by Kollberg et al. [1], has a symmetric C-V and an anti-symmetric I-V characteristic. Therefore it will only produce odd harmonics of the input frequency when used in mm- and submm-wave frequency multipliers, which greatly simplifies the multiplier design. The high-bandgap barriers prevent electron transport through the structure so that the depletion region of the modulation layers is controlled by the applied bias, thus modulating the capacitance of the device. By varying the number of barriers and the thickness and doping of the modulation layers, it is possible to tailor the HBV diode for various applications, e.g. power-handling capability and frequency of operation.We present four different InGaAs/InAlAs HBV materials on InP fabricated by MOVPE. Two are designed for high-power, mm-wave applications and the other two are optimised for high efficiency up to submm-wave frequencies. In order to handle high power levels, materials 1816 and 1817 have six barriers and a relatively low doping concentration which results in a high break-down voltage. The measured break-down voltage for 1817 of approximately 52 Volts for a current density of 0,1\ub5A/\ub5m2 is, to the best of our knowledge, the highest value reported for HBVs. Materials 1819 and 1820 have higher doping concentrations and shorter modulation layers to reduce losses and the effect of current saturation, see Table 1. Design methods and predicted RF-performance will be presented

Design of Material Structures for Heterostructure Barrier Varactors

The Heterostructure Barrier Varactor (HBV), first proposed by Kollberg et al. [1], has a symmetric C-V and an anti-symmetric I-V characteristic. Therefore it will only produce odd harmonics of the input frequency when used in mm- and submm-wave frequency multipliers, which greatly simplifies the multiplier design. The high-bandgap barriers prevent electron transport through the structure so that the depletion region of the modulation layers is controlled by the applied bias, thus modulating the capacitance of the device. By varying the number of barriers and the thickness and doping of the modulation layers, it is possible to tailor the HBV diode for various applications, e.g. power-handling capability and frequency of operation.We present four different InGaAs/InAlAs HBV materials on InP fabricated by MOVPE. Two are designed for high-power, mm-wave applications and the other two are optimised for high efficiency up to submm-wave frequencies. In order to handle high power levels, materials 1816 and 1817 have six barriers and a relatively low doping concentration which results in a high break-down voltage. The measured break-down voltage for 1817 of approximately 52 Volts for a current density of 0,1\ub5A/\ub5m2 is, to the best of our knowledge, the highest value reported for HBVs. Materials 1819 and 1820 have higher doping concentrations and shorter modulation layers to reduce losses and the effect of current saturation, see Table 1. Design methods and predicted RF-performance will be presented