25 research outputs found

    Micromachined Flow Sensors Enabling Electrocalorimetric and TOF Transduction

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    AbstractA novel thermal flow sensor is presented featuring three spatially separated micromachined silicon-nitride membranes. A thin-film heater is embedded in the central one, while the others carry thermistors. This advanced sensor structure enables two different transduction modes. The electrocalorimetric mode exhibits high resolution and quick response at the expense of high power consumption. For slowly varying flows, the Time-of-Flight mode with low duty-cycles allows for power-saving operation but suffers from less sensitivity and slower response

    Fracture and Delamination of Chromium Thin Films on Polymer Substrates

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    An elevated temperature study of a Ti adhesion layer on polyimide

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    AbstractTitanium layers are used to promote adhesion between polymer substrates for flexible electronics and the Cu or Au conducting lines. Good adhesion of conducting lines in flexible circuits is critical in improving circuit performance and increasingcircuit lifetime. Nominally 50nm thick Ti films on polyimide (PI) are investigated by fragmentation testing under uniaxial tensile load in the as-deposited state, at 350°C, and after annealing. The cracking and buckling of the films show clear differences between the as-deposited and the thermally treated samples, cracks are much straighter and buckles are smaller following heat treatment. These changes are correlated to a drop in adhesion of the samples following heat treatment. Adhesion values are determined from the buckle dimensions using a total energy approach as described in the work of Cordill et al. (Acta Mater. 2010). Cross-sectional transmission electron microscopy of the Ti/PI interface found evidence of a ~5nm thick interlayer between the largely columnar Ti and the amorphous PI. This interlayer is amorphous in the as-deposited state but nano-crystalline in those coatings tested at elevated temperature or annealed. It is put forward that this alteration of the interfacial structure causes the reduced adhesion

    Momentum and Energy Predict the Backwater Rise Generated by a Large Wood Jam

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    Wood reintroduction is now considered an important aspect of stream restoration, due to ecohydraulic benefits associated with wood presence. Channel‐spanning wood jams create an upstream backwater, increasing flow heterogeneity, sediment deposition, and ecological productivity, but also flood risk. Backwater rise prediction is necessary to evaluate flood hazards in hydraulic models, improve design of engineered logjam projects, and compare jam effects across river systems. We present experimental results demonstrating that a jam can be modeled as a porous obstruction generating momentum loss proportional to the number, size, and packing density of the logs and the jam length. Energy and momentumconstraints are combined to predict backwater rise from unit discharge and a dimensionless structural parameter. This novel approach allows description of preexisting jams with a common metric. The model was used to demonstrate how backwater length, pool size, and upstream sediment deposition depend on jam structure and channel slope
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