Ionization versus displacement damage effects in proton irradiated CMOS sensors manufactured in deep submicron process

Proton irradiation effects have been studied on CMOS image sensors manufactured in a 0.18 μm technology dedicated to imaging. The ionizing dose and displacement damage effects were discriminated and localized thanks to 60Co irradiations and large photodiode reverse current measurements. The only degradation observed was a photodiode dark current increase. It was found that ionizing dose effects dominate this rise by inducing generation centers at the interface between shallow trench isolations and depleted silicon regions. Displacement damages are responsible for a large degradation of dark current non-uniformity. This work suggests that designing a photodiode tolerant to ionizing radiation can mitigate an important part of proton irradiation effects

Total dose evaluation of deep submicron CMOS imaging technology through elementary device and pixel array behavior analysis

Ionizing radiation effects on CMOS image sensors (CIS) manufactured using a 0.18 µm imaging technology are presented through the behavior analysis of elementary structures, such as field oxide FET, gated diodes, photodiodes and MOSFETs. Oxide characterizations appear necessary to understand ionizing dose effects on devices and then on image sensors. The main degradations observed are photodiode dark current increases (caused by a generation current enhancement), minimum size NMOSFET off-state current rises and minimum size PMOSFET radiation induced narrow channel effects. All these effects are attributed to the shallow trench isolation degradation which appears much more sensitive to ionizing radiation than inter layer dielectrics. Unusual post annealing effects are reported in these thick oxides. Finally, the consequences on sensor design are discussed thanks to an irradiated pixel array and a comparison with previous work is discussed

Theoretical evaluation of MTF and charge collection efficiency in CCD and CMOS image sensor

Classical models used to calculate the Modulation Transfer function (MTF) of a solid-state image sensor generally use a sinusoidal type of illumination. The approach, described in this paper, consists in considering a point-source illumination to built a theoretical three dimensional model of the diffusion and the collection of photo-carriers created within the image sensor array. Fourier transform formalism is used for this type of illumination. Solutions allow to evaluate the spatial repartition of the charge density collected in the space charge region, i.e. to get the Pixel Response Function (PRF) formulation. PRF enables to calculate analytically both MTF and crosstalk at every needed wavelengths. The model can take into account a uniformly doped substrate and an epitaxial layer grown on a highly doped substrate. The built-in electric field induced by the EPI/Substrate doping gradient is also taken into account. For these configurations, MTF, charge collection efficiency and crosstalk proportion are calculated. The study is established in the case of photodiode pixel but it can be easily extended to pinned photodiode pixels and photogate pixels

Multilevel RTS in proton irradiated CMOS image sensors manufactured in a deep submicron technology

A new automated method able to detect multilevel random telegraph signals (RTS) in pixel arrays and to extract their main characteristics is presented. The proposed method is applied to several proton irradiated pixel arrays manufactured using a 0.18um CMOS process dedicated to imaging. Despite the large proton energy range and the large fluence range used, similar exponential RTS amplitude distributions are observed. A mean maximum amplitude independent of displacement damage dose is extracted from these distributions and the number of RTS defects appears to scale well with total nonionizing energy loss. These conclusions allow the prediction of RTS amplitude distributions. The effect of electric field on RTS amplitude is also studied and no significant relation between applied bias and RTS amplitude is observed

Ionizing radiation effects on CMOS imagers manufactured in deep submicron process

We present here a study on both CMOS sensors and elementary structures (photodiodes and in-pixel MOSFETs) manufactured in a deep submicron process dedicated to imaging. We designed a test chip made of one 128×128-3T-pixel array with 10 µm pitch and more than 120 isolated test structures including photodiodes and MOSFETs with various implants and different sizes. All these devices were exposed to ionizing radiation up to 100 krad and their responses were correlated to identify the CMOS sensor weaknesses. Characterizations in darkness and under illumination demonstrated that dark current increase is the major sensor degradation. Shallow trench isolation was identified to be responsible for this degradation as it increases the number of generation centers in photodiode depletion regions. Consequences on hardness assurance and hardening-by-design are discussed

Displacement damage effects due to neutron and proton irradiations on CMOS image sensors manufactured in deep submicron technology

Displacement damage effects due to proton and neutron irradiations of CMOS image sensors dedicated to imaging are presented through the analysis of the dark current behavior in pixel arrays and isolated photodiodes. The mean dark current increase and the dark current nonuniformity are investigated. Dark current histogram observations are compared to damage energy distributions based on GEANT 4 calculations. We also discuss, through annealing analysis, which defects could be responsible for the dark current in CMOS image sensors

Similarities Between Proton and Neutron Induced Dark Current Distribution in CMOS Image Sensors

Several CMOS image sensors were exposed to neutron or proton beams (displacement damage dose range from 4 TeV/g to 1825 TeV/g) and their radiation-induced dark current distributions are compared. It appears that for a given displacement damage dose, the hot pixel tail distributions are very similar, if normalized properly. This behavior is observed on all the tested CIS designs (4 designs, 2 technologies) and all the tested particles (protons from 50 MeV to 500 MeV and neutrons from 14 MeV to 22 MeV). Thanks to this result, all the dark current distribution presented in this paper can be fitted by a simple model with a unique set of two factors (not varying from one experimental condition to another). The proposed normalization method of the dark current histogram can be used to compare any dark current distribution to the distributions observed in this work. This paper suggests that this model could be applied to other devices and/or irradiation conditions

Space optical instruments optimisation thanks to CMOS image sensor technology

Today, both CCD and CMOS sensors can be envisaged for nearly all visible sensors and instruments designed for space needs. Indeed, detectors built with both technologies allow excellent electro-optics performances to be reached, the selection of the most adequate device being driven by their functional and technological features and limits. The first part of the paper presents electro-optics characterisation results of CMOS Image Sensors (CIS) built with an optimised CMOS process, demonstrating the large improvements of CIS electro-optics performances. The second part reviews the advantages of CMOS technology for space applications, illustrated by examples of CIS developments performed by EADS Astrium and Supaéro/CIMI for current and short term coming space programs

CMOS detectors for space applications: from R&D to operational program with large volume foundry

Nowadays, CMOS image sensors are widely considered for space applications. The use of CIS (CMOS Image sensor) processes has significantly enhanced their performances such as dark current, quantum efficiency and conversion gain. However, in order to fulfil specific space mission requirements, dedicated research and development work has to be performed to address specific detector performance issues. This is especially the case for dynamic range improvement through output voltage swing optimisation, control of conversion gain and noise reduction. These issues have been addressed in a 0.35μm CIS process, based on a large volume CMOS foundry, by several joint ISAE- EADS Astrium R&D programs. These results have been applied to the development of the visible and near-infrared multi-linear imager for the SENTINEL 2 mission (LEO Earth observation mission for the Global Measurement Environment and Security program). For this high performance multi-linear device, output voltage swing improvement is achieved by process optimisation done in collaboration with foundry. Conversion gain control is also achieved for each spectral band by managing photodiode capacitance. A low noise level at sensor output is reached by the use of an architecture allowing Correlated Double Sampling readout in order to eliminate reset noise (KTC noise). KTC noise elimination reveals noisy pixels due to RTS noise. Optimisation of transistors’s dimensions, taking into account conversion gain constraints, is done to minimise these noisy pixels. Additional features have been also designed: 1) Due to different integration times between spectral bands required by mission, a specific readout mode was developed in order to avoid electrical perturbations during the integration time and readout. This readout mode leads to specific power supply architecture. 2)Post processing steps can be achieved by alignment marks design allowing a very good accuracy. These alignment marks can be used for a black coating deposition between spectral bands (pixel line) in order to minimise straight lighteffects. In conclusion a review of design improvements and performances of the final component is performed

Influence of displacement damage dose on dark current distributions of irradiated CMOS image sensors

Dark current increase distributions due to displacement damages are modeled using displacement damage dose concept. Several CMOS image sensors have been exposed to neutrons or protons and we have characterized their degradation in terms of dark current increase. We have been able to extract a set of two factors from the experimental dark current increase distributions. These factors are used to predict and build dark current increase distribution and leads to a better understanding of displacement damage effects on CMOS image sensors