The Investigation of Die Back Edge Cracking in Flip Chip Ceramic Ball Grid Array Package (FC-CBGA)

The cracking between die back edge and top fillet for Flip Chip Ceramic Ball Grid Array (FC-CBGA) package due to thermal cycling have been investigated in this study. Finite Element Analysis (FEA) model was used to analyze the effect of fillet geometry and material properties of underfill upon stresses along the die back edge. The thermo-mechanical properties of commercial underfill were obtained by using Thermal Mechanical Analyzer (TMA) and Dynamic Mechanical Analyzer (DMA) as the input for the simulation. Die stress distribution for different fillet height and width were generated to depict variation of stress due thermal loading and the variations of tensile stress were discussed for parameter optimization. The effect of different underfill material properties were discussed as well for thermal stress reliability improvement

Effect of the silane coupling agent on the hybrid thermoplastic natural rubber composites filled rice husk and oil palm empty fruit bunch

The used of lignocellulosic material as replacement in composites is currently generating much interest in most application. Lignocellulosic-derived fillers have many advantages compared to inorganic fillers. The advantages of natural filler receiving increasing attention for industrial application due to cost effectiveness,low density, high specific strength, bio-degradability and free from health hazard

Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan(Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader)

Kertas ini membentangkan kesan dua teknik pengaktifan bermangkin yang berbeza terhadap prestasi terma bagi penyebar haba cip balikan. Penyaduran nikel tanpa elektrik digunakan sebagai salah satu teknik saduran kerana ia boleh membentuk satu lapisan nikel yang ketebalannya seragam ke atas substrat kuprum. Proses pengaktifan bermangkin perlu dilakukan dahulu untuk mengenapkan sesetengah atom nikel ke atas substrat kuprum, supaya enapan nikel mampu untuk memangkinkan proses penurunan yang seterusnya. Dua jenis teknik pengakitfan telah dikaji, iaitu pemulaan galvani dan penyaduran nipis nikel-kuprum. Ujian simpanan suhu tinggi telah dijalankan untuk mengkaji takat resapan antara logam bagi lapisan nikel and kuprum. Kemeresapan terma bagi penyebar haba telah dikaji dengan menggunakan peralatan Nano-flash. Keputusan yang diperolehi menunjukkan bahawa penyebar haba yang diproses dengan penyaduran nipis nikel-kuprum mempunyai nilai kemeresapan terma (35-65 mm2 s-1) yang lebih rendah berbanding dengan penyebar haba yang diproses dengan teknik pemulaan galvani (60-85 mm2 s-1). Selain daripada itu, kajian ini juga menemui ketebalan lapisan antara logam nikel-kuprum dalam penyebar haba ini bertambah daripada 0.2 μm pada keadaan asal kepada 0.55 μm selepas 168 jam simpanan suhu tinggi. Lapisan antara logam nikel-kuprum mempunyai kekonduksian terma yang lebih rendah berbanding dengan kuprum tulen, ini telah merendahkan kemeresapan terma bagi penyebar haba. Kesimpulannya, teknik pemulaan galvani meyediakan prestasi terma yang lebih baik untuk penyebar haba yang digunakan dalam pembungkusan semikonduktor

Mechanical, Thermal and Morphological Properties of PLA/PP Melt Blends

In this study, polylactic acid (PLA) was melt blended with polypropylene (PP) and liquid natural rubber (LNR) with the ratio of PLA/PP (90/10) and PLA/PP/LNR (90/10/10) in the Haake Rheomix internal mixer. The mechanical properties of such as stress-strain, flexural and impact were studied. It was found that the elongation at break, flexural and notched impact strength increased significantly for the LNR compatibilized PLA/PP blend. The DSC and FTIR showed the PLA/PP and PLA/PP/LNR were not miscible