102,007 research outputs found

    Simultaneous junction formation

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    High-risk, high-payoff improvements to a baseline process sequence of simultaneous junction formation of silicon solar cells are discussed. The feasibility of simultaneously forming front and back junctions of solar cells using liquid dopants on dendritic web silicon was studied. Simultaneous diffusion was compared to sequential diffusion. A belt furnace for the diffusion process was tested

    Error-correcting codes for high-speed digital computers

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    Published document discusses method for correcting errors. According to this method, computer operation becomes fault-tolerant, i.e., its operation is error-free in spite of single hardware element malfunction. Also, method provides for detection and correction of repetitive and spurious processing and transmission errors

    [Review] Jay M. Smith, ed. (2006) The French nobility in the eighteenth century: reassessments and new approaches

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    A 6,000 word review article discussing this book and recent approaches to the nobility in eighteenth-century France

    Ionospheric Corrections via PIM and Real-Time Data

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    We describe a method for removing ionospheric effects from single-frequency radio data a posteriori. This method is based on a theoretical climatological model developed by the USAF, which returns electron density as a function of position and time along the line of sight to the source. Together with a model of the earth's magnetic field, ionospheric delays and Faraday rotation values ensue. If contemoraneous ionospheric data -- GPS TEC observations or ionosonde profiles -- exist, they can be incorporated to update the modeled electron densities.Comment: 6 pages, 2 fiugres; LaTeX2e (96/12/01); uses elsart.cls (2.15, 98/07/15); to appear in New Astronomy Review

    Dendritic web-type solar cell mini-modules

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    Twenty-five minimodules composed of dendritic web solar cells with nominal glass size of 12 by 40 cm were provided for study. The modules were identical with respect to design, materials, and manufacturing and assembly processes to full scale modules. The modules were also electrically functional. These minimodules were fabricated to provide test vehicle for environmental testing and to assess reliability of process and design procedures. The module design and performance are outlined

    Process research of non-Czochralski silicon material

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    Simultaneous diffusion of liquid precursors containing phosphorus and boron into dendritic web silicon to form solar cell structures was investigated. A simultaneous junction formation techniques was developed. It was determined that to produce high quality cells, an annealing cycle (nominal 800 C for 30 min) should follow the diffusion process to anneal quenched-in defects. Two ohm-cm n-base cells were fabricated with efficiencies greater than 15%. A cost analysis indicated that the simultansous diffusion process costs can be as low as 65% of the costs of the sequential diffusion process

    Real time integration of user preferences into virtual prototypes

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    Within new product development (NPD), both virtual prototypes and physical prototypes play important roles in creating, testing and modifying designs. However, in the current design process, these two forms of prototyping methods are normally used independently and converted from one to the other during different design phases. This conversion process is time consuming and expensive and also introduces potential information loss/corruption problems. If the design process requires many iterations, it may simply be impractical to generate all the conversions that are theoretically required. Therefore, the integration of virtual and physical prototyping may offer a possible solution where the design definition is maintained simultaneously in both the virtual and physical environment. The overall aim of this research was to develop an interface or a tool that achieves real time integration of physical and virtual prototyping. “Real time integration” here means changes to the virtual prototypes will reflect any changes that have been made contemporaneously to the physical prototypes, and vice versa. Thus, conversion of the prototype from physical to virtual (or vice versa) will be achieved immediately, hence saving time and cost. A review of the literature was undertaken to determine what previous research has been conducted in this area. The result of the review shows the research in this area is still in its infancy. The research hypothesis was developed through the use of a questionnaire survey. Totally 102 questionnaires were sent to designers, design directors or design managers to address the issue: will industrial designers want to make use of real time integration and if so, how? The outcome from the literature review drove further development of the research hypothesis and an initial pilot experiment to test this. The pilot trial was designed to address the research questions: • Can real time physical and virtual prototyping integration be conveniently demonstrated? • Will designers and users be comfortable using the integration method? • Will users recognise the benefits of the integration? The results showed that real time integration between physical and virtual prototyping is necessary in helping designers develop new products and for getting users more closely involved. The future research suggested is that more investigations and experiments are needed to explore a proper method that simultaneously employing these two types of prototyping in product development process. Keywords: Physical Prototyping; Virtual Prototyping; Integration; Real Time.</p

    Whatever happened to silicon carbide

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    The progress made in silicon carbide semiconductor devices in the 1955 to 1975 time frame is examined and reasons are given for the present lack of interest in the material. Its physical and chemical properties and methods of preparation are discussed. Fabrication techniques and the characteristics of silicon carbide devices are reviewed. It is concluded that a combination of economic factors and the lack of progress in fabrication techniques leaves no viable market for SiC devices in the near future
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