Carbon nanotubes and silver flakes filled epoxy resin for new hybrid conductive adhesives

Combining conductive micro and nanofillers is a new way to improve electrical conductivity. Micrometric silver flakes and nanometric carbon nanotubes (CNTs) exhibit high electrical conductivity. A new type of hybrid conductive adhesives filled with silver flakes and carbon nanotubes (DWCNTs or MWCNTs) were investigated. High electrical conductivity is measured as well as improved mechanical properties at room temperature. Small agglomerates and free MWCNTs dispersed in the silver/epoxy composites improve the electrical conductivity and a synergistic effect between MWCNTs and micro sized silver flakes is observed in hybrid composites. Glassy and rubbery storage moduli of the hybrid composites increase with increasing silver loading at fixed CNTs volume fraction. High value of the storage modulus, measured in DWCNTs/μAg hybrid composites at rubbery state, is caused by strong agglomeration of DWCNTs bundles. The electrical and mechanical properties are consistent with the morphologies of the hybrid composites characterized by SEM

Developing new joining materials for low-temperature electronics assembly

International audienceThe present work focuses on a new kind of lead-free joining method for surface-mount technology based on precursor chemistry. The interest of metal oxalates as new soldering materials for die attachment (1st level packaging) was previously demonstrated with silver oxalate. The thermal decomposition of metal oxalates under controlled atmosphere can be used to produce small metal particles below their melting point. These particles are found to be in a highly active particulate form. First experimental studies are focusing on several metal oxalates (tin oxalate and bismuth oxalate) to assess their suitability for low-temperature metal particle production. The main work is dealing with controlled chemical precipitation synthesis and characterization of the compounds as well as study of the properties of decomposition solid products (powder X-ray diffraction, Fourier-transform infrared spectroscopy, scanning electron microscopy and thermal analyses under different atmospheres)

Matériaux innovants sans plomb pour l'assemblage de composants électroniques à basse température

Dans le cadre du développement de nouveaux matériaux d’assemblage sans plomb, les premiers résultats de synthèse et de caractérisations physicochimiques d’oxalate de bismuth sont présentés. Par une méthode de décomposition thermique de précurseurs métal-organiques, la possibilité de produire des particules métalliques en dessous de la température de fusion du bismuth massif (271°C) est discutée ici. L’étude du comportement en température de l’oxalate de bismuth montre l’influence de l’atmosphère (air ou azote) sur la nature des produits de décomposition (oxyde ou métal). Sous une atmosphère inerte contrôlée, les échantillons d’oxalate préparés se décomposent en bismuth métallique entre 210 et 250°C

Bi2(C2O4)3·7H2O and Bi(C2O4)OH Oxalates Thermal Decomposition Revisited. Formation of Nanoparticles with a Lower Melting Point than Bulk Bismuth

Two bismuth oxalates, namely, Bi2(C2O4)3·7H2O and Bi(C2O4)OH, were studied in terms of synthesis, structural characterization, particle morphology, and thermal behavior under several atmospheres. The oxalate powders were produced by chemical precipitation from bismuth nitrate and oxalic acid solutions under controlled pH, then characterized by X-ray diffraction (XRD), temperature-dependent XRD, IR spectroscopy, scanning electron microscopy, and thermogravimetric differential thermal analyses. New results on the thermal decomposition of bismuth oxalates under inert or reducing atmospheres are provided. On heating in nitrogen, both studied compounds decompose into small bismuth particles. Thermal properties of the metallic products were investigated. The Bi(C2O4)OH decomposition leads to a Bi−Bi2O3 metal−oxide composite product in which bismuth is confined in a nanometric size, due to surface oxidation. The melting point of such bismuth particles is strongly related to their crystallite size. The nanometric bismuth melting has thus been evidenced ∼40 °C lower than for bulk bismuth. These results should contribute to the development of the oxalate precursor route for low-temperature soldering applications

New Trends for Microwave Packaging into Space-Borne Equipment

This paper focuses on the most promising evolutions which are emerging in the packaging of microwave functions for space applications. Starting from the former micropackage solution, continuing with the current MCM technology, new routes are then reviewed. Those include flip-chip which has the huge advantage of short and reproducible connections, glob-top and other non-hermetic approaches. All of them are major departures from the present situation if not a complete revolution. Finally, a special attention is given to MEMS as these new devices can also bring their own intrinsic packaging solution. This is one of the most intriguing and captivating outcome of their apparition : at last, the convergence of electrical and mechanical expertise

Review of new combining techniques for space applications

International audienceReview of new combining techniques for space application

3D active modules for high integration active antennas

This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly

3D packaging for space application : imagination and reality

This paper describes theALCATELexperience on the design, manufacturingandmeasurementof microwave and digital modules based on 3D packagingapproach.Even if that appears as a very futuristic approachtoday,thiscould represent a packaging option for the nextspace equipment generation by the years2015-2025.Thisimplies to move from currenthermeticencapsulationofactive devices to advanced technologies suchChip on Board,including glob top encapsulation.The paper thendescribesthe design and manufacture of a low noise amplifiersectionbased on this quasi hermetic packaging option.ThisChip on Board approach is a real candidateforequipmentby the years 2007-2015