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3D active modules for high integration active antennas
Authors
Jean-Louis Cazaux
C. Drevon
+4Â more
Sebastien George
Philippe Monfraix
Christian Tronche
Patrice Ulian
Publication date
1 October 1998
Publisher
Doi
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Abstract
This paper describes the different parts of active antenna sub-systems currently developed in Alcatel Espace. These modules are realized according to some new 3D RF packaging technologies, mainly based on moulding assembly
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AMS Acta
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oai:amsacta.unibo.it:1658
Last time updated on 09/07/2013
AMS Acta - Alm@DL - Università di Bologna
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oai:amsacta.unibo.it:1658
Last time updated on 29/12/2017
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Last time updated on 27/02/2019