Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation

Atomic layer deposition (ALD) for tin whisker mitigation on Pb-free surfaces

Atomic layer deposition (ALD) for tin whisker mitigation on Pb-free surface

Performance of Cu‐ and Ag‐based microstrips up to millimetre wave frequencies

Attenuation characteristics of microstrip transmission lines on alumina substrates up to 50GHz are discussed. The lines under test came from three different manufacturers, each of whom used different processes to realise the transmission lines. Two of the manufacturers used silver (Ag) paste, whereas the process of one of the manufacturers was copper (Cu) based. Each manufacturer used identical alumina substrates and identical test pattern files so that the measured attenuation properties reflected manufacturer’s capability to fabricate microstrips and the quality of the metal system used. Measurements showed that the attenuation of copper microstrips was slightly lower than that of the silver microstrips, but the difference was small. Measured attenuation (S21) of about 50Ω microstrips was approximately 0.5db/cm at 30GHz and 0.8dB/cm at 50GHz, respectively. The loss coefficient, αt, of about 0.035dB/mm at 40GHz was obtained for the Cu microstrips. Such an attenuation is reasonable for many practical applications in the microwave and millimetre wave regions.</jats:p