Is Oak Establishment in Old‐fields and Savanna Openings Context Dependent?

Multiple factors are known to influence tree seedling establishment, yet the degree to which these factors depend on each other and on spatial context is largely unknown. We examined the influence of herbaceous competition and water and nitrogen limitations on tree seedling establishment as functions of distance from trees (within‐site spatial context) and site history (between‐site spatial context; as old‐fields vs. savanna openings). We grew Quercus ellipsoidalis E.J. Hill (pin oak) and Q. macrocarpa Michx. (bur oak) seedlings for 3 years in abandoned agricultural fields and savannas in central Minnesota, USA, near and distant from adult oak trees, with and without water and nitrogen resource additions, and with and without clipping of herbaceous vegetation (reducing above‐ground competition). The strongest treatment effects were found in response to distance from trees and clipping herbaceous vegetation. Ectomycorrhizal infection, year 1 foliar N concentrations, and survival were greater in seedlings growing near vs. distant from adult trees, while clipping herbaceous vegetation increased above‐ground seedling biomass but reduced seedling heights, regardless of distance from adult trees. There were conflicting effects of resource addition, which were dependent on clipping of herbaceous vegetation and site (savanna vs. old‐field). Distance from adult trees and clipping herbaceous vegetation appear to have largely independent effects. Thus, while being near trees benefits seedlings, probably via increased mycorrhizal infection, competition from herbaceous vegetation limits seedlings regardless of distance from trees. In contrast, the effects of resource addition were more context dependent, interacting significantly with herbaceous context and site. The factors influencing seedling success can perhaps be best conceptualized as a series of largely independent environmental filters: seedlings near trees have increased mycorrhizal infection, nutrient uptake and survival, but face competition from herbaceous vegetation regardless of distance from trees. The slow encroachment of woody vegetation into old‐fields and savanna openings in this region is likely to be the result of the net cumulative effect of such filters

Method to Improve Indium Bump Bonding via Indium Oxide Removal Using a Multi-Step Plasma Process

A process for removing indium oxide from indium bumps in a flip-chip structure to reduce contact resistance, by a multi-step plasma treatment. A first plasma treatment of the indium bumps with an argon, methane and hydrogen plasma reduces indium oxide, and a second plasma treatment with an argon and hydrogen plasma removes residual organics. The multi-step plasma process for removing indium oxide from the indium bumps is more effective in reducing the oxide, and yet does not require the use of halogens, does not change the bump morphology, does not attack the bond pad material or under-bump metallization layers, and creates no new mechanisms for open circuits

Promoting Value Practice in Museums Creates Impact

This article examines how museological value discussion can offer a tool for museum professionals to engage themselves in the current discourse regarding building sustainable futures. The focus of the article is on collection care and collection development. It describes the latest interview and workshop results regarding museum values in the field of collection development among Finnish museum professionals and students. In addition, it emphasizes the integration of theoretical knowledge and its practical application. Promoting and creating opportunities for value discussion among museum professionals increases the ability of these professionals to further engage in such value-related discourse with various stakeholders. Eventually, the benefits of this kind of value-based discussions are to be seen in the more coherent and focused ones regarding museological values between and among various parties, be they museum professionals, politicians, students or museum visitors. The initial idea for the interviews, and subsequently the workshops as well, emerged from a collection development survey conducted in 2012 among Finnish art museums, which was published in 2016 by the author. Based on the material analyzed at that time, it became clear that the issue of active values in Finnish museums would need further study.Peer reviewe

Myeloid Wnt ligands are required for normal development of dermal lymphatic vasculature

Resident tissue myeloid cells play a role in many aspects of physiology including development of the vascular systems. In the blood vasculature, myeloid cells use VEGFC to promote angiogenesis and can use Wnt ligands to control vascular branching and to promote vascular regression. Here we show that myeloid cells also regulate development of the dermal lymphatic vasculature using Wnt ligands. Using myeloid-specific deletion of the WNT transporter Wntless we show that myeloid Wnt ligands are active at two distinct stages of development of the dermal lymphatics. As lymphatic progenitors are emigrating from the cardinal vein and intersomitic vessels, myeloid Wnt ligands regulate both their numbers and migration distance. Later in lymphatic development, myeloid Wnt ligands regulate proliferation of lymphatic endothelial cells (LEC) and thus control lymphatic vessel caliber. Myeloid-specific deletion of WNT co-receptor Lrp5 or Wnt5a gain-of-function also produce elevated caliber in dermal lymphatic capillaries. These data thus suggest that myeloid cells produce Wnt ligands to regulate lymphatic development and use Wnt pathway co-receptors to regulate the balance of Wnt ligand activity during the macrophage-LEC interaction

Two-Step Plasma Process for Cleaning Indium Bonding Bumps

A two-step plasma process has been developed as a means of removing surface oxide layers from indium bumps used in flip-chip hybridization (bump bonding) of integrated circuits. The two-step plasma process makes it possible to remove surface indium oxide, without incurring the adverse effects of the acid etching process