ACCESS AND SECONDARY USE OF DATA COLLECTED IN AN ELECTRONIC MEDICAL CHART: RESULTS OF THE REAL WORLD ROSWITCH STUDY

International audienc

High temperature stability embedded ReRAM for 2x nm node and beyond

International audienc

ITAC: A complete 3D integration test platform

International audienceSystem integration takes benefit from 3D stacking technology in a wide range of applications such as smart imagers, photonic, wide I/O memories and high-performance computing. The 700 mm 2 ITAC 3D integration test platform contains a set of “Integrated Technological and Application Circuits” for process development, electrical and RF characterization, reliability, die stacking, warpage and underfilling studies, DC-DC converter and IntAct chip which is the full application chip. After a brief presentation of the targeted high performance computing application. The contributions integrated in the test platform are described with a particular focus on the 10 μm diameter 20 μm pitch die-to-die interconnects which is the key technology of the 3D stack. These test vehicles have been embedded on the same silicon to secure the application chip at all the steps from technology development to assembly and test

Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures

International audienceWe report the first successful technology integration of chiplets on an active silicon interposer, fully processed, packaged and tested. Benefits of chiplet-based architectures are discussed. Built up technology is presented and focused on 3D interconnects process and characterization. 3D packaging is presented up to the successful structural test and characterization of the demonstrator