Концепт PRIVACY в англомовній картині світу

(uk) Стаття присвячена дослідженню концепту PRIVACY в аспектах лінгвокогнітології та лінгвокультурології в англійській мові.(en) The article is devoted to the investigation of the concept PRIVACY in the aspects of Cognitive and Cultural Linguistics in the English Language

Precursors and defect control for halogenated CVD of thick SiC epitaxial layers

Silicon carbide (SiC) is a very hard semiconductor material with wide band gap, high breakdown electric field strength, high thermal conductivity and high saturation electron drift velocity making it a promising material for high frequency and high power devices. The performance of electrical devices is strongly dependent on the quality, doping level and thickness of the grown epitaxial layers. The SiC epitaxial layers are usually grown by chemical vapor deposition (CVD), using silane (SiH4) and light hydrocarbons (C2H4 or C3H8) as precursors, diluted in a massive flow of hydrogen (H2), at growth temperatures and pressures of 1500-1600 °C and 100-300 mbar, respectively. A Silicon Carbide (SiC) device with a high breakdown voltage (> 10 kV) requires thick (> 100 μm) and low doped (1014cm-3) epitaxial layers. The typical growth rate is usually 5-10 μm/h, rendering very long growth times which result in a high cost for the final device. It is hard to increase the growth rate without running into problems with homogeneous gas phase nucleation, which badly affects the surface morphology and the usefulness of the epitaxial layers for devices. This problem can be avoided by lowering the growth pressure and/or increasing the carrier gas flow (H2) to minimize the homogeneous gas phase nucleation or by increasing the growth temperature to evaporate the silicon droplets. On the other hand introducing chlorine into the gas mixture, by adding HCl or using some chlorinated silicon precursor, such as trichlorosilane (SiHCl3) or tetrachlorosilane (SiCl4), or by methyltrichlorosilane (CH3SiCl3) as a single molecule will prevent nucleation in the gas phase. In this thesis a detailed study of the chloride-based processes and an investigation of a bromide-based CVD process is made using a horizontal hot wall reactor. Focus has been mainly on the study of various precursor molecules but also the effect of process parameters on the growth of thick epitaxial layers (100-200 μm). In paper 1 the growth of SiC epitaxial layers on 4° off-axis substrates manifesting very good morphology when using methane (CH4) as carbon precursor is demonstrated. A comparative study of SiCl4, SiHCl3, SiH4+HCl, C3H8, C2H4 and CH4 in an attempt to find the optimal precursor combination is presented in Paper 2 for growth of 4H-SiC epitaxial layers on 4° off-axis substrates with very good morphology. Paper 3 presents a direct comparison between chloride-based and bromide-based CVD chemistries for growth of SiC epitaxial layers using SiH4 and C2H4 as Si- respectively C-precursors with HCl or HBr as growth additives. The influence of temperature ramp up conditions on the carrot defect density on 8° off-axis 4H-SiC epitaxial layers using the single molecule precursor methyltrichlorosilane (MTS) as growth precursor is studied in Paper 4. In paper 5 growth of about 200 μm thick epitaxial layers with very good morphology at growth rates exceeding 100 μm/h using SiCl4+C2H4 and SiH4+HCl+C2H4 precursor approaches is reported. The effect of growth conditions on dislocation density by decorating the dislocations using KOH etching is reported in Paper 6. In Paper 7 the effect of varying parameters such as growth  temperature, C/Si ratio, Cl/Si ratio, Si/H2 ratio and in situ pre-growth surface etching time are studied in order to reduce the formation of step bunching and structural defects, mainly triangular defects for growth of about 100 μm thick epitaxial layers on 4° off-axis substrates with very good morphology at growth rates up to 115 μm/h

Simulation of Gas-Phase Chemistry for Selected Carbon Precursors in Epitaxial Growth of SiC Simulation of gas-phase chemistry for selected carbon precursors in epitaxial growth of SiC

Abstract. Numerical simulations are one way to obtain a better and more detailed understanding of the chemical vapor deposition process of silicon carbide. Although several attempts have been made in this area during the past ten years, there is still no general model valid for any range of process parameters and choice of precursors, that can be used to control the growth process, and to optimize growth equipment design. In this paper a first step towards such a model is taken. Here, mainly the hydrocarbon chemistry is studied by a detailed gas-phase reaction model, and comparison is made between C 3 H 8 and CH 4 as carbon precursor. The results indicate that experimental differences, which previous models have been unable to predict, may be explained by the new model

Effect of process parameters on dislocation density in thick 4H-SiC epitaxial layers grown by chloride-based CVD on 4 degrees off-axis substrates

The effect of process parameters such as growth temperature, C/Si ratio, etching time, and Si/H2 ratio on dislocation density was investigated by performing KOH etching on 100 mu m thick epitaxial layers grown on 4 degrees off axis 4H-SiC substrates at various growth conditions by a chemical vapor deposition (CVD) process using a chloride-based chemistry to achieve growth rates exceeding 100 mu m/h. We observe that the growth temperature and the growth rate have no significant influence on the dislocation density in the grown epitaxial layers. A low C/Si ratio increases the density of threading screw dislocations (TSD) markedly. The basal plane dislocation (BPD) density was reduced by using a proper in-situ etch prior to growth

Neoliberalism, law and post communist reform : the evolving role of law in Russia’s transition to capitalism

EThOS - Electronic Theses Online ServiceGBUnited Kingdo

Simulation of Gas-Phase Chemistry for Selected Carbon Precursors in Epitaxial Growth of SiC

Numerical simulations are one way to obtain a better and more detailed understanding of the chemical vapor deposition process of silicon carbide. Although several attempts have been made in this area during the past ten years, there is still no general model valid for any range of process parameters and choice of precursors, that can be used to control the growth process, and to optimize growth equipment design. In this paper a first step towards such a model is taken. Here, mainly the hydrocarbon chemistry is studied by a detailed gas-phase reaction model, and comparison is made between C3H8 and CH4 as carbon precursor. The results indicate that experimental differences, which previous models have been unable to predict, may be explained by the new model

Reduction of structural defects in thick 4H-SiC epitaxial layers grown on 4° off-axis substrates

By carefully controlling the surface chemistry of the chemical vapor deposition process for silicon carbide (SiC), 100 μm thick epitaxial layers with excellent morphology were grown on 4° off-axis SiC substrates at growth rates exceeding 100 μm/h. In order to reduce the formation of step bunching and structural defects, mainly triangular defects, the effect of varying parameters such as growth temperature, C/Si ratio, Cl/Si ratio, Si/H2 ratio, and in situ pre-growth surface etching time are studied. It was found that an in-situ pre growth etch at growth temperature and pressure using 0.6% HCl in hydrogen for 12 min reduced the structural defects by etching preferentially on surface damages of the substrate surface. By then applying a slightly lower growth temperature of 1575 °C, a C/Si ratio of 0.8, and a Cl/Si ratio of 5, 100 μm thick, step-bunch free epitaxial layer with a minimum triangular defect density and excellent morphology could be grown, thus enabling SiC power device structures to be grown on 4° off axis SiC substrates

On the use of methane as a carbon precursor in Chemical Vapor Deposition of silicon carbide

It is generally considered that methane is not a suitable carbon precursor for growth of silicon carbide (SiC) epitaxial layers by Chemical Vapor Deposition (CVD) since its use renders epitaxial layers with very high surface roughness. In this work we demonstrate that in fact SiC epitaxial layers with high-quality morphology can be grown using methane. It is shown that a key factor in obtaining high-quality material is tuning the C/Si ratio of the process gas mixture to a region where the growth is limited neither by carbon nor by silicon supplies. From the growth characteristics presented here, we argue that the reactivity of methane with the SiC surface is much higher than generally assumed in SiC CVD modeling today