8 research outputs found

    Carbon footprint of wood and plastic as packaging materials – An Australian case of pallets

    No full text
    Pallets play a critical role in supply chains across a variety of industries in the world, since they are used for holding items during transportation and in transit. Pallets can be constructed using different materials and assembled in various designs to satisfy their functional requirements. Currently, material selection is predominantly based on material performance and cost analysis. Nonetheless, it is important to evaluate the suitability of the material in terms of an environmental footprint to reduce emissions generation. This study performed an environmental footprint assessment for the two most common packaging materials - wood and plastic, complying with GHG Protocol standards, in the Australian context. A quantitative analysis was carried out based on empirical data obtained from an Australian wooden pallet manufacturer (WPM) and published data for plastic pallets. Results demonstrated the carbon footprint of the plastic pallets (216 kgCO2-e) to complete 100 trips is 1.5 times higher than the wooden pallets (144 kgCO2-e), from a cradle-to-grave perspective. Uncertainty and sensitivity analysis was also conducted to identify sensitive variables and assess the accuracy of the results. Findings of this study can assist industry practitioners, academia, and policy enablers in selecting suitable materials to achieve emissions reduction

    Hematologically important mutations: Leukocyte adhesion deficiency (second update)

    Get PDF
    © 2023Leukocyte adhesion deficiency (LAD) is an immunodeficiency caused by defects in the adhesion of leukocytes (especially neutrophils) to the blood vessel wall. As a result, patients with LAD suffer from severe bacterial infections and impaired wound healing, accompanied by neutrophilia. In LAD-I, characterized directly after birth by delayed separation of the umbilical cord, mutations are found in ITGB2, the gene that encodes the β subunit (CD18) of the β2 integrins. In the rare LAD-II disease, the fucosylation of selectin ligands is disturbed, caused by mutations in SLC35C1, the gene that encodes a GDP-fucose transporter of the Golgi system. LAD-II patients lack the H and Lewis Lea and Leb blood group antigens. Finally, in LAD-III, the conformational activation of the hematopoietically expressed β integrins is disturbed, leading to leukocyte and platelet dysfunction. This last syndrome is caused by mutations in FERMT3, encoding the kindlin-3 protein in all blood cells, involved in the regulation of β integrin conformation. This article contains an update of the mutations that we consider to be relevant for the various forms of LAD

    Hematologically important mutations: Leukocyte adhesion deficiency (second update)

    No full text
    Leukocyte adhesion deficiency (LAD) is an immunodeficiency caused by defects in the adhesion of leukocytes (especially neutrophils) to the blood vessel wall. As a result, patients with LAD suffer from severe bacterial infections and impaired wound healing, accompanied by neutrophilia. In LAD-I, characterized directly after birth by delayed separation of the umbilical cord, mutations are found in ITGB2, the gene that encodes the β subunit (CD18) of the β 2 integrins. In the rare LAD-II disease, the fucosylation of selectin ligands is disturbed, caused by mutations in SLC35C1, the gene that encodes a GDP-fucose transporter of the Golgi system. LAD-II patients lack the H and Lewis Le a and Le b blood group antigens. Finally, in LAD-III, the conformational activation of the hematopoietically expressed β integrins is disturbed, leading to leukocyte and platelet dysfunction. This last syndrome is caused by mutations in FERMT3, encoding the kindlin-3 protein in all blood cells, involved in the regulation of β integrin conformation. This article contains an update of the mutations that we consider to be relevant for the various forms of LAD

    High In-Plane Thermal Conductivity of Aluminum Nitride Thin Films

    No full text
    High thermal conductivity materials show promise for thermal mitigation and heat removal in devices. However, shrinking the length scales of these materials often leads to significant reductions in thermal conductivities, thus invalidating their applicability to functional devices. In this work, we report on high in-plane thermal conductivities of 3.05, 3.75, and 6 μm thick aluminum nitride (AlN) films measured via steady-state thermoreflectance. At room temperature, the AlN films possess an in-plane thermal conductivity of ∼260 ± 40 W m–1 K–1, one of the highest reported to date for any thin film material of equivalent thickness. At low temperatures, the in-plane thermal conductivities of the AlN films surpass even those of diamond thin films. Phonon–phonon scattering drives the in-plane thermal transport of these AlN thin films, leading to an increase in thermal conductivity as temperature decreases. This is opposite of what is observed in traditional high thermal conductivity thin films, where boundaries and defects that arise from film growth cause a thermal conductivity reduction with decreasing temperature. This study provides insight into the interplay among boundary, defect, and phonon–phonon scattering that drives the high in-plane thermal conductivity of the AlN thin films and demonstrates that these AlN films are promising materials for heat spreaders in electronic devices
    corecore