CAD model extraction of PCB signal discontinuity using a circuit extraction approach based on mixed-potential integral equation formulation

In high-speed digital design, signal via transitions on printed circuit boards (PCBs) are becoming an important signal integrity issue. Efficient and accurate models for via transitions are necessary to analyze high bit-rate digital circuit system. The circuit extraction approach based on a mixed-potential integral equation formulation (CEMPIE) is an extension of the Partial Element Equivalent Circuit approach (PEEC) to general multi-layered media. CEMPIE was further developed to include the horizontal current components on the vertical surface and extended to model the discontinuities on multilayer PCBs. A procedure of building SPICE models for signal via transitions between printed circuit board layers was developed. The method of extracting SPICE model parameters from full-wave simulation tool was studied. The validity of SPICE models was studied by comparing solutions from SPICE models with solutions from full-wave simulations. This procedure was further used for building SPICE models for via transitions in differential signaling --Abstract, page iii

Including SMT Ferrite Beads in DC Power Bus and High-Speed I/O Line Modeling

Surface mount technology (SMT) ferrite beads are often used in high-speed digital circuit designs to mitigate noise. The common modeling approach is to include SMT ferrite beads as equivalent lumped LCR circuits. The work presented in this paper included SMT ferrite beads as a frequency-dependent impedance in a PEEC-like modeling tool denoted CEMPIE, a circuit extraction approach based on a mixed-potential integral equation formulation. Agreement with measurements demonstrates the approach. The applications shown are segmentation of power areas for noise isolation, and I/O line filtering

The Design of a Lumped Element Impedance-Matching Network with Reduced Parasitic Effects Obtained From Numerical Modeling

This paper presents an impedance-matching network design with numerical modeling of the parasitic effects. A modeling tool CEMPIE (a Circuit Extraction approach based on a Mixed Potential Integral Equation formulation) is used to model the hoard-level parasitics of surface mount technology (SMT) resistors for impedance-matching networks. A 3-layer design of impedance-matching network with 0402 SMT resistors is implemented according to the modeling results. And its performance is demonstrated

Modeling Noise Coupling from Non-Parallel PCB Trace Routing

Coupling between PCB signal traces in proximity is of concern to PCB designers and EMC engineers. The behavior of noise coupling between non-parallel microstrip lines is studied in this paper by a full-wave numerical modeling method CEMPIE, designating a circuit extraction approach based on a mixed-potential integral equation formulation. Good agreement between the numerical results and measurements was obtained

Validation of Circuit Extraction Procedure by Means of Frequency and Time Domain Measurement

Aim of this paper is the validation in both frequency and time domain of the procedure to extract fully H-Spice compatible equivalent circuits of structures on printed circuit boards. The procedure is initiated by standard measurement of scattering parameters between 40MHz to 20GH. After the extraction of the equivalent circuit, the computed scattering parameters are compared with those measured. The same equivalent circuit is also used for transient analysis in order to compare TDR measurement and eye-pattern to a pseudo-random bit sequence with those coming from the simulations

An Efficient Approach for Power Delivery Network Design with Closed-Form Expressions for Parasitic Interconnect Inductances

Investigation of a dc power delivery network, consisting of a multilayer PCB using area fills for power and return, involves the distributed behavior of the power/ground planes and the parasitics associated with the lumped components mounted on it. Full-wave methods are often employed to study the power integrity problem. While full-wave methods can be accurate, they are time and memory consuming. The cavity model of a rectangular structure has previously been employed to efficiently analyze the simultaneous switching noise (SSN) in the power distribution network. However, a large number of modes in the cavity model are needed to accurately simulate the impedance associated with the vias, leading to computational inefficiency. A fast approach is detailed herein to accelerate calculation of the summation associated with the higher-order modes. Closed-form expressions for the parasitics associated with the interconnects of the decoupling capacitors are also introduced. Combining the fast calculation of the cavity models of regularly shaped planar circuits, a segmentation method, and closed-form expressions for the parasitics, an efficient approach is proposed herein to analyze an arbitrary shaped power distribution network. While it may take many hours for a full-wave method to do a single simulation, the proposed method can generally perform the simulation with good accuracy in several minutes. Another advantage of the proposed method is that a SPICE equivalent circuit of the power distribution network can be derived. This allows both frequency and transient responses to be done with SPICE simulation

Extracting CAD Models for Quantifying Noise Coupling Between Vias in PCB Layouts

A method to extract a lumped element prototype SPICE model is used to study noise coupling between non-parallel traces on a PCB. The parameters in this model are extracted using a PEEC-like approach, a Circuit Extraction approach based on a Mixed-Potential Integral Equation formulation (CEMPIE). Without large numbers of unknowns, the SPICE model saves computation time. Also, it is easy to incorporate into system SPICE net list to acquire the system simulation result considering the coupling between traces on the printed circuit board (PCB). A representative case is studied, and the comparison of measurements, CEMPIE simulation, and SPICE modeling are given

Extraction of a SPICE Via Model from Full-Wave Modeling for Differential Signaling

This paper presents a procedure for building SPICE models for via transitions in differential signaling. The method of extracting parameters of SPICE models from a full-wave simulation tool is demonstrated. Then the validity of the SPICE models is studied by comparing the solution from the SPICE models with that from the full-wave simulation

Validation of Equivalent Circuits Extracted from S-Parameter Data for Eye-pattern Evaluation

S-parameter circuit model extraction is usually characterized by a trade off between accuracy and complexity. Trading one feature for another may or may not affect the goodness of the reconstructed S-parameter data, which are obtained from frequency domain simulations of the models extracted. However, the ultimate test for the validity of these equivalent circuit representations should be left to eye-diagram simulations, which provide useful insights, from an SI point of view, about the degradation of the signal, as it travels through the system. Physics based simplication procedures can be used to tune the models and achieve less complexity, whereas the comparisons of the eye-diagrams may help to quantify the goodness of an these circuits extracted. In fact, the most accurate model is not necessary the best to be used

The trans-ancestral genomic architecture of glycemic traits

Glycemic traits are used to diagnose and monitor type 2 diabetes and cardiometabolic health. To date, most genetic studies of glycemic traits have focused on individuals of European ancestry. Here we aggregated genome-wide association studies comprising up to 281,416 individuals without diabetes (30% non-European ancestry) for whom fasting glucose, 2-h glucose after an oral glucose challenge, glycated hemoglobin and fasting insulin data were available. Trans-ancestry and single-ancestry meta-analyses identified 242 loci (99 novel; P < 5 x 10(-8)), 80% of which had no significant evidence of between-ancestry heterogeneity. Analyses restricted to individuals of European ancestry with equivalent sample size would have led to 24 fewer new loci. Compared with single-ancestry analyses, equivalent-sized trans-ancestry fine-mapping reduced the number of estimated variants in 99% credible sets by a median of 37.5%. Genomic-feature, gene-expression and gene-set analyses revealed distinct biological signatures for each trait, highlighting different underlying biological pathways. Our results increase our understanding of diabetes pathophysiology by using trans-ancestry studies for improved power and resolution. A trans-ancestry meta-analysis of GWAS of glycemic traits in up to 281,416 individuals identifies 99 novel loci, of which one quarter was found due to the multi-ancestry approach, which also improves fine-mapping of credible variant sets