Mechanics, mechanisms, and modeling of the chemical mechanical polishing process

Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2001.Includes bibliographical references.The ever-increasing demand for high-performance microelectronic devices has motivated the semiconductor industry to design and manufacture Ultra-Large-Scale Integrated (ULSI) circuits with smaller feature size, higher resolution, denser packing, and multi-layer interconnects. The ULSI technology places stringent demands on global planarity of the Interlevel Dielectric (ILD) layers. Compared with other planarization techniques, the Chemical Mechanical Polishing (CMP) process produces excellent local and global planarization at low cost. It is thus widely adopted for planarizing inter-level dielectric (silicon dioxide) layers. Moreover, CMP is a critical process for fabricating the Cu damascene patterns, low-k dielectrics, and shallow isolated trenches. The wide range of materials to be polished concurrently or sequentially, however, increases the complexity of CMP and necessitates an understanding of the process fundamentals for optimal process design. This thesis establishes a theoretical framework to relate the process parameters to the different wafer/pad contact modes to study the behavior of wafer-scale polishing. Several models of polishing - microcutting, brittle fracture, surface melting and burnishing - are reviewed. Blanket wafers coated with a wide range of materials are polished to verify the models. Plastic deformation is identified as the dominant mechanism of material removal in fine abrasive polishing.(cont.) Additionally, contact mechanics models, which relate the pressure distribution to the pattern geometry and pad elastic properties, explain the die-scale variation of material removal rate (MRR) on pattern geometry. The pad displacement into low features of submicron lines is less than 0.1 nm. Hence the applied load is only carried by the high features, and the pressure on high features increases with the area fraction of interconnects. Experiments study the effects of pattern geometry on the rates of pattern planarization, oxide overpolishing and Cu dishing. It was observed that Cu dishing of submicron features is less than 20 nm and contributes less to surface non-uniformity than does oxide overpolishing. Finally, a novel in situ detection technique, based on the change of the reflectance of the patterned surface at different polishing stages, is developed to detect the process endpoint and minimize overpolishing. Models that employ light scattering theory and statistical treatment correlate the sampled reflectance with the surface topography and Cu area fraction for detecting the process regime and endpoint. The experimental results agree well with the endpoint detection schemes predicted by the models.by Jiun-Yu Lai.Ph.D

A study of the fabrication of thin lamination stator cores by the uniform droplet spray process

Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1997.Includes bibliographical references (leaves 60-61).by Jiun-Yu Lai.M.S

Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process

The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material removal and pattern effect are not well understood. In this paper, three contact regimes between the wafer surface and the polishing pad were proposed: direct contact, mixed or partial contact, and hydroplaning. The interfacial friction force has been employed to characterize these contact conditions. Several polishing models are reviewed with emphasis on the mechanical aspects of CMP. Experiments have been conducted to verify the mechanical polishing models and to identify the dominant mechanism of material removal under typical CMP conditions.Singapore-MIT Alliance (SMA

Comparison of the safety and efficacy of a fixed-dose combination regimen and separate formulations for pulmonary tuberculosis treatment

OBJECTIVES: Fixed-dose combination formulations, which simplify the administration of drugs and prevent the development of drug resistance, have been recommended as a standard anti-tuberculosis treatment regimen. However, the composition and dosage recommendations for fixed-dose combination formulations differ from those for separate formulations. Thus, questions about the effectiveness and side effects of combination formulations remain. The aim of this study was to compare the safety and efficacy of these two types of anti-tuberculosis regimens for pulmonary tuberculosis treatment. METHOD: A prospective, randomized controlled study was conducted using the directly observed treatment short-course strategy. Patients were randomly allocated to one of two short-course regimens. One year after completing the treatment, these patients’ outcomes were analyzed. ClinicalTrials.gov: NCT00979290. RESULTS: A total of 161 patients were enrolled, 142 of whom were evaluable for safety assessment. The two regimens had a similar incidence of adverse effects. In the per-protocol population, serum bilirubin concentrations at the peak level, at week 4, and at week 8 were significantly higher for the fixed-dose combination formulation than for the separate formulations. All patients had negative sputum cultures at the end of the treatment, and no relapse occurred after one year of follow-up. CONCLUSIONS: In this randomized study, transient higher serum bilirubin levels were noted for the fixed-dose combination regimen compared with the separate formulations during treatment. However, no significant difference in safety or efficacy was found between the groups when the directly observed treatment short-course strategy was used

On the size of maximal binary codes with 2, 3, and 4 distances

We address the maximum size of binary codes and binary constant weight codes with few distances. Previous works established a number of bounds for these quantities as well as the exact values for a range of small code lengths. As our main results, we determine the exact size of maximal binary codes with two distances for all lengths $n\ge 6$ as well as the exact size of maximal binary constant weight codes with 2,3, and 4 distances for several values of the weight and for all but small lengths.Comment: Main text 23 pp. and Appendix 17p

On the size of maximal binary codes with 2, 3, and 4 distances

We address the maximum size of binary codes and binary constant weight codes with few distances. Previous works established a number of bounds for these quantities as well as the exact values for a range of small code lengths. As our main results, we determine the exact size of maximal binary codes with two distances for all lengths n≥6 as well as the exact size of maximal binary constant weight codes with 2,3, and 4 distances for several values of the weight and for all but small lengths

Advanced automation and robotics for high volume labour-intensive manufacturing

High volume, labour-intensive manufacturing operations pose several challenges for successful operations. It is an even bigger challenge to move away from manual dependency and shift towards automation of production processes. There seems to be no general agreement among researchers on what are the critical success factors (CSFs) on the implementation of advanced automation and robotics processes in the manufacturing environment. Success factors vary across the manufacturing industry and also organizational units. This paper attempts to elicit the opinion and perception of academic professionals with links to high volume labour-intensive manufacturing industry. A systematic literature search was conducted on the topic and semi-structured interviews were conducted with experts to gather their views on CSFs. Results from the literature search and interviews revealed that factors related to Organization Strategy, Culture, and Structure; Top management support; Past experience, staffing, and learning; Project management, planning, and control; Finance, and resource availability; Technology maturity and vendor support; to be critical for the success of the production process automation project initiatives. Findings from this study can be used as guidelines to ascertain CSFs for organizations and strategy planning. Manufacturing organizations can also use this study to evaluate their organizational readiness and enhance the level of automation further

Neuromagnetic amygdala response to pain-related fear as a brain signature of fibromyalgia

Fibromyalgia (FM) is a chronic pain condition characterized by impaired emotional regulation. This study explored the brain response to pain-related fear as a potential brain signature of FM

Pain sensitivities predict prophylactic treatment outcomes of flunarizine in chronic migraine patients: A prospective study

Abstract Background We aimed to assess the differences in quantitative sensory testing between chronic migraine and healthy controls and to explore the association between pain sensitivities and outcomes in chronic migraine following preventive treatment. Methods In this prospective open-label study, preventive-naïve chronic migraine and healthy controls were recruited, and cold, heat, mechanical punctate, and pressure pain thresholds over the dermatomes of first branch of trigeminal nerve and first thoracic nerve were measured by quantitative sensory testing at baseline. Chronic migraines were treated with flunarizine and treatment response was defined as ≥50% reduction in the number of monthly headache days over the 12-week treatment period. Results Eighty-four chronic migraines and fifty age-and-sex-matched healthy controls were included in the analysis. The chronic migraine had higher cold pain thresholds over the dermatomes of the first branch of trigeminal nerve and the first thoracic nerve (p  158 g (p = 0.020) or heat pain threshold over the dermatome of the first branch of the trigeminal nerve > 44.9°C (p = 0.002) were more likely to be responders. Conclusions Chronic migraine were generally more sensitive compared to healthy controls. Preventive treatment with flunarizine should be recommended particularly for chronic migraine who have relatively normal sensitivity to mechanical punctate or heat pain. Trial registration: This study was registered on ClinicalTrials.gov (Identifier: NCT02747940)