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Direct metallisation of polyetherimide substrates by activation with different metals

This article reports the performance of different metallic ions and nanoparticles (Ag, Cu, Ni, Pd, Cr, Co, Au and Fe) used as seed layers, formed by chemical or optical reduction, for the electroless Cu plating of metal tracks onto polyetherimide (PEI). Plated Cu performance was tested by adhesion, electrical conductivity, plating rate, XPS, SEM, XRD and EDX analysis. The application of Cu and Ag seeds resulted in high quality electroless Cu deposits presenting strong adhesion properties and high conductivity ((2.0 ± 0.5) × 107 S/m and (3.6 ± 0.2) × 107 S/m, respectively) compared with bulk copper (5.96 × 107 S/m). Performance is attributed to the high surface density and uniformity of seed layers. Of the metals, only Ag ions were photoreduced under the conditions applied and were subsequently used to electroless Cu plate high quality track features of 150 μm width. The application of sulphuric acid pre-treatment to PEI prior to Ag ion exchange, improved the photoinitiated track formation process, as demonstrated by a threefold increase to both photoinduced Ag nanoparticle density on the surface and electroless Cu plating rate, as well as improved electroless Cu adhesion to PEI

A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications

Metallization of a polydimethylsiloxane (PDMS)-based substrate is a challenge due to the difficulties in forming crack-free polymer and metal features using standard deposition techniques. Frequently, additional adhesion layers, rigid substrates, multiple processing steps (lift-off and etching) and expensive metal sputtering techniques are required, to achieve such metal patterns. This work presents a novel and rapid technique for the direct metallization of PDMS substrates using photolithography and electroless copper plating. The method has the advantage of not requiring expensive vacuum processing or multiple metallization steps. Electroless copper layer is demonstrated to have a strong adhesion to PDMS substrate with a high conductivity of (3.6 ± 0.7) × 107 S/m, which is close to the bulk copper (5.9 × 107 S/m). The copper-plated PDMS substrate displays mechanical and electrical stability whilst undergoing stretching deformations up to 10% due to applied strain. A functional electronic circuit was fabricated as a demonstration of the mechanical integrity of the copper-plated PDMS after bending

A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography‐inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light‐patterned areas, both on flexible films and 3D printed surfaces

Is in-vivo sensing in a total hip replacement a possibility? A review on past systems and future challenges.

Surgery to implant a total hip replacement (THR) is very successful in reducing pain and restoring function. This procedure has become more prevalent, and projections estimate further increases in demand. However, complications can arise, and current diagnostic techniques often fail to expose underlying issues before they result in a catastrophic failure that requires revision surgery. An instrumented implant, with embedded sensors capable of real time condition monitoring, would be an attractive proposition to incorporate within a THR. Continued advances in the performance and miniaturisation of electronic components, embedded systems, sensing and wireless communications have given the tools and resources medical device manufacturers need to innovate in the field of implantable medical devices. Smart implants are already being widely used in healthcare including pacemakers, cochlear implants, glucose monitors and insulin pumps however, a widely used smart THR has not yet been realised. Since the implantation of the first instrumented hip implant in the 1960s there have been several in-vitro studies monitoring levels of implant loosening. Additionally, significant research has been conducted using instrumented THRs to perform in-vivo measurement of biomechanical metrics, including force and moments. To date less than 100 patients have successfully received an instrumented implant. The results of these studies have aided researchers, designers and surgeons in wider research projects, however, the motivation behind the work was to provide discrete biomechanical data sets and not provide real-time condition monitoring of an implants performance or highlight early indications for revision surgery. If in-vivo sensing within a THR is to be achieved and adopted in regular clinical practice then the following challenges need to be addressed: choice of the sensing method, biocompatibility and integration within the implant, power supply, communication, and regulatory considerations

Inertial Tracking System for Monitoring Dual Mobility Hip Implants In Vitro

Dual mobility (DM) implants are being increasingly used for total hip arthroplasties due to the additional range of motion and joint stability they afford over more traditional implant types. Currently, there are no reported methods for monitoring their motions under realistic operating conditions while in vitro and, therefore, it is challenging to predict how they will function under clinically relevant conditions and what failure modes may exist. This study reports the development, calibration, and validation of a novel inertial tracking system that directly mounts to the mobile liner of DM implants. The tracker was custom built and based on a miniaturized, off-the-shelf inertial measurement unit (IMU) and employed a gradient-decent sensor fusion algorithm for amalgamating nine degree-of-freedom IMU readings into three-axis orientation estimates. Additionally, a novel approach to magnetic interference mitigation using a fixed solenoid and magnetic field simulation was evaluated. The system produced orientation measurements to within 1.0° of the true value under ideal conditions and 3.9° with a negligible drift while in vitro, submerged in lubricant, and without a line of sight

Evaluating Depressive Symptoms in Schizophrenia: A Psychometric Comparison of the Calgary Depression Scale for Schizophrenia and the Hamilton Depression Rating Scale

Background: The aim of this study was to compare two measures of depression in patients with schizophrenia and schizophrenia spectrum disorder, including patients with delusional and schizoaffective disorder, to conclude implications for their application. Sampling and Methods: A total of 278 patients were assessed using the Calgary Depression Scale for Schizophrenia (CDSS) and the Hamilton Depression Rating Scale (HAMD-17). The Positive and Negative Syndrome Scale (PANSS) was also applied. At admission and discharge, a principal component analysis was performed with each depression scale. The two depression rating scales were furthermore compared using correlation and regression analyses. Results: Three factors were revealed for the CDSS and HAMD-17 factor component analysis. A very similar item loading was found for the CDSS at admission and discharge, whereas results of the loadings of the HAMD-17 items were less stable. The first two factors of the CDSS revealed correlations with positive, negative and general psychopathology. In contrast, multiple significant correlations were found for the HAMD-17 factors and the PANSS sub-scores. Multiple regression analyses demonstrated that the HAMD-17 accounted more for the positive and negative symptom domains than the CDSS. Conclusions:The present results suggest that compared to the HAMD-17, the CDSS is a more specific instrument to measure depressive symptoms in schizophrenia and schizophrenia spectrum disorder, especially in acutely ill patients. Copyright (c) 2012 S. Karger AG, Base

Mapping Patent Classifications: Portfolio and Statistical Analysis, and the Comparison of Strengths and Weaknesses

The Cooperative Patent Classifications (CPC) jointly developed by the European and US Patent Offices provide a new basis for mapping and portfolio analysis. This update provides an occasion for rethinking the parameter choices. The new maps are significantly different from previous ones, although this may not always be obvious on visual inspection. Since these maps are statistical constructs based on index terms, their quality--as different from utility--can only be controlled discursively. We provide nested maps online and a routine for portfolio overlays and further statistical analysis. We add a new tool for "difference maps" which is illustrated by comparing the portfolios of patents granted to Novartis and MSD in 2016.Comment: Scientometrics 112(3) (2017) 1573-1591; http://link.springer.com/article/10.1007/s11192-017-2449-

Selective Electroless Copper Deposition by Using Photolithographic Polymer/Ag Nanocomposite

This paper presents a novel, direct, selective, vacuum-free, and low-cost method of electroless copper deposition, allowing additive patterning of nonconductive surfaces. Ag nanoparticles (NPs) synthesized inside a photosensitive polymer are acting as seeds for electroless copper deposition. The resulting copper film surface morphology was studied with scanning electron microscopy. Copper films were shown to display a rough grain like structure, covering substrate uniformly with good metal-substrate adhesion. Copper thickness was studied as a function of the plating time, temperature, and Ag NPs seed concentration. A maximal copper thickness of 0.44 ± 0.05 μm was achieved when plated at 30 °C with 0.4 M Ag(I). The minimum feature resolution of copper patterns, grown with 0.025- and 0.1-M silver salt, is attained down to 10 μm. The maximum electrical conductivity of the copper film prepared with 0.025-, 0.1-, and 0.4-M Ag(I) approaches (0.8 ± 0.1) × 10⁷ S/m, (1.1 ± 0.1) ×10⁷ S/m and (1.6 ± 0.4)×10⁷ S/m, respectively. Electroless copper interconnections and LED circuit on glass substrate were fabricated as a proof of concept demonstrators

Digitally Driven Aerosol Jet Printing to Enable Customisable Neuronal Guidance

Digitally driven manufacturing technologies such as aerosol jet printing (AJP) can make a significant contribution to enabling new capabilities in the field of tissue engineering disease modeling and drug screening. AJP is an emerging non-contact and mask-less printing process which has distinct advantages over other patterning technologies as it offers versatile, high-resolution, direct-write deposition of a variety of materials on planar and non-planar surfaces. This research demonstrates the ability of AJP to print digitally controlled patterns that influence neuronal guidance. These consist of patterned poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) (PEDOT:PSS) tracks on both glass and poly(potassium 3-sulfopropyl methacrylate) (PKSPMA) coated glass surfaces, promoting selective adhesion of SH-SY5Y neuroblastoma cells. The cell attractive patterns had a maximum height ≥0.2 μm, width and half height ≥15 μm, Ra = 3.5 nm, and RMS = 4.1. The developed biocompatible PEDOT:PSS ink was shown to promote adhesion, growth and differentiation of SH-SY5Y neuronal cells. SH-SY5Y cells cultured directly onto these features exhibited increased nuclei and neuronal alignment on both substrates. In addition, the cell adhesion to the substrate was selective when cultured onto the PKSPMA surfaces resulting in a highly organized neural pattern. This demonstrated the ability to rapidly and flexibly realize intricate and accurate cell patterns by a computer controlled process