Surveillance of Hepatitis B in Malta : a four year trend

Surveillance systems include three fundamental elements of ongoing collection, analysis and feedback or dissemination of the data. A surveillance system for Hepatitis B was established in 1988 in order to improve prevention and control of transmission of this endemic disease. A disease register including data obtained mainly from notifications, laboratory reports and active case finding was established. This paper shows the findings from 1990 to 1993. The system shown cannot claim to be complete. However the findings suggest that some 14 clinically evident cases of Hepatitis B are confirmed each year. No rising trend has been seen. In anyone year a prevalence of 15.4 x 10-5 HBsAg positive results in persons who had previously not known that they were positive may be detected. Six month follow-up of these persons reveals that some 39 persons become chronic carriers each year. This has implications both for the targeted vaccination programme as well as for the individual’s chronic liver complications and treatment.peer-reviewe

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages. Phase 2, supplement 1: Moisture permeation of adhesive-sealed hybrid microcircuit packages

The susceptibility of adhesive-sealed ceramic packages to moisture permeation was investigated. The two adhesives, Ablebond 789-1 and Epo-Tek H77, were evaluated as package sealants. These adhesives were previously selected as the most promising candidates for this application from a group of ten adhesives. Ceramic packages sealed with these adhesives were exposed to temperature-humidity conditions of 25 C/98 percent RH, 50 C/60 percent RH, 50 C/98 percent RH, and 85 C/85 percent RH and their moisture contents using were monitored solid state moisture sensors sealed inside them. Five packages were tested at each of these exposures - two ceramic packages sealed with each of the two adhesives and one seam-sealed gold-plated Kovar package. This latter package was included to serve as a control. The results showed that the adhesive-sealed packages were not hermetic to moisture. The rates at which moisture entered the packages increased with the severity of the exposure environments (i.e., higher temperatures and higher moisture vapor pressures) with greater dependence on temperature than on moisture vapor pressure

Investigation of low cost, high reliability sealing techniques for hybrid microcircuits, phase 1

A preliminary investigation was made to determine the feasibility of using adhesive package sealing for hybrid microcircuits. Major effort consisted of: (1) surveying representative hybrid manufacturers to assess the current use of adhesives for package sealing; (2) making a cost comparison of metallurgical versus adhesive package sealing; (3) determining the seal integrity of gold plated flatpack type packages sealed with selected adhesives, thermal shock, temperature cycling, mechanical shock, and constant acceleration test environments; and (4) defining a more comprehensive study to continue the evaluation of adhesives for package sealing. Results showed that 1.27 cm square gold plated flatpack type packages sealed with the film adhesives and the paste adhesive retained their seal integrity after all tests, and that similarly prepared 2.54 cm square packages retained their seal integrity after all tests except the 10,000 g's constant acceleration test. It is concluded that these results are encouraging, but by no means sufficient to establish the suitability of adhesives for sealing high reliability hybrid microcircuits

Design guidelines for hybrid microcircuits; organic adhesives for hybrid microcircuits

The properties of organic adhesives were studied to acquire an adequate information base to generate a guideline document for the selection of adhesives for use in high reliability hybrid microcircuits. Specific areas covered include: (1) alternate methods for determining the outgassing of cured adhesives; (2) effects of long term aging at 150C on the electrical properties of conductive adhesives; (3) effects of shelf life age on adhesive characteristics; (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive; (6) effects of products outgassed from cured adhesives on device electrical parameters; (7) metal migration from electrically conductive adhesives; and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed in detail

Development of low cost, high reliability sealing techniques for hybrid microcircuit packages, phase 2

Adhesives were evaluated to determine if they qualify for application to hybrid microcircuit packages. The effort consisted of the following: (1) seal gold-plated Kovar packages with selective adhesives and determine seal integrity after exposure to temperature humidity environments; (2) seal both gold-plated Kovar and ceramic packages with the four best adhesives identified in (1) and determine seal integrity after exposure to MIL-STD-883A test environments; and (3) subject the best adhesive identified in (2) to a 60 C/98% RH environment and determine susceptibility to moisture permeation. Test results are provided

Investigation of organic adhesives for hybrid microcircuits

The properties of organic adhesives were investigated to acquire information for a guideline document regarding the selection of adhesives for use in high reliability hybrid microcircuits. Specifically, investigations were made of (1) alternate methods for determining the outgassing of cured adhesives, (2) effects of long term aging at 150 C on the electrical properties of conductive adhesives, (3) effects of shelf life age on adhesive characteristics, (4) bond strengths of electrically conductive adhesives on thick film gold metallization, (5) a copper filled adhesive, (6) effects of products outgassed from cured adhesives on device electrical parameters, (7) metal migration from electrically conductive adhesives, and (8) ionic content of electrically insulative adhesives. The tests performed during these investigations are described, and the results obtained are discussed

Development of a qualification standard for adhesives used in hybrid microcircuits

Improved qualification standards and test procedures for adhesives used in microelectronic packaging are developed. The test methods in specification for the Selection and Use of Organic Adhesives in Hybrid Microcircuits are reevaluated versus industry and government requirements. Four electrically insulative and four electrically conductive adhesives used in the assembly of hybrid microcircuits are selected to evaluate the proposed revised test methods. An estimate of the cost to perform qualification testing of an adhesive to the requirements of the revised specification is also prepared

Design guidelines for use of adhesives and organic coatings in hybrid microcircuits

A study was conducted to investigate the reliability of organic adhesives in hybrid microcircuits. The objectives were twofold: (1) to identify and investigate problem areas that could result from the use of organic adhesives and (2) to develop evaluation tests to quantify the extent to which these problems occur for commercially available adhesives. Efforts were focused on electrically conductive adhesives. Also, a study was made to evaluate selected organic coatings for contamination protection for hybrid microcircuits

Development of low cost custom hybrid microcircuit technology

Selected potentially low cost, alternate packaging and interconnection techniques were developed and implemented in the manufacture of specific NASA/MSFC hardware, and the actual cost savings achieved by their use. The hardware chosen as the test bed for this evaluation ws the hybrids and modules manufactured by Rockwell International fo the MSFC Flight Accelerometer Safety Cut-Off System (FASCOS). Three potentially low cost packaging and interconnection alternates were selected for evaluation. This study was performed in three phases: hardware fabrication and testing, cost comparison, and reliability evaluation