22 research outputs found
3D-Printed Optics for Wafer-Scale Probing
Mass production of photonic integrated circuits requires high-throughput
wafer-level testing. We demonstrate that optical probes equipped with
3D-printed elements allow for efficient coupling of light to etched facets of
nanophotonic waveguides. The technique is widely applicable to different
integration platforms.Comment: Accepted for presentation at European Conference on Optical
Communications (ECOC) 201
3D-Printed Ultra-Broadband Highly Efficient Out-of-Plane Coupler for Photonic Integrated Circuits
Photonic-integrated circuits with non-planar topologies realized by 3D-printed waveguide overpasses
Hybrid 2D/3D Photonic Integration for Non-Planar Circuit Topologies
We present a concept for realizing crossing-free photonic integrated circuits (PIC) using 3D freeform waveguides. We prove the viability of the approach using a silicon photonic 4 x 4 switch-andselect device. The method is applicable to a wide range of PIC technologies
3D-printed optical probes for wafer-level testing of photonic integrated circuits
Wafer-level probing of photonic integrated circuits is key to reliable process control and efficient performance assessment in advanced production workflows. In recent years, optical probing of surface-coupled devices such as vertical-cavity lasers, top-illuminated photodiodes, or silicon photonic circuits with surface-emitting grating couplers has seen great progress. In contrast to that, wafer-level probing of edge-emitting devices with hard-to-access vertical facets at the sidewalls of deep-etched dicing trenches still represents a major challenge. In this paper, we address this challenge by introducing a novel concept of optical probes based on 3D-printed freeform coupling elements that fit into deep-etched dicing trenches on the wafer surface. Exploiting the design freedom and the precision of two-photon laser lithography, the coupling elements can be adapted to a wide variety of mode-field sizes. We experimentally demonstrate the viability of the approach by coupling light to edge-emitting waveguides on different integration platforms such as silicon photonics (SiP), silicon nitride (TriPleX), and indium phosphide (InP). Achieving losses down to 1.9 dB per coupling interface, we believe that 3D-printed coupling elements represent a key step towards highly reproducible wafer-level testing of edge-coupled photonic integrated circuits. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreemen
3D-printed optical probes for wafer-level testing of photonic integrated circuits
Wafer-level probing of photonic integrated circuits is key to reliable process control and efficient performance assessment in advanced production workflows. In recent years, optical probing of surface-coupled devices such as vertical-cavity lasers, top-illuminated photodiodes, or silicon photonic circuits with surface-emitting grating couplers has seen great progress. In contrast to that, wafer-level probing of edge-emitting devices with hard-to-access vertical facets at the sidewalls of deep-etched dicing trenches still represents a major challenge. In this paper, we address this challenge by introducing a novel concept of optical probes based on 3D-printed freeform coupling elements that fit into deep-etched dicing trenches on the wafer surface. Exploiting the design freedom and the precision of two-photon laser lithography, the coupling elements can be adapted to a wide variety of mode-field sizes. We experimentally demonstrate the viability of the approach by coupling light to edge-emitting waveguides on different integration platforms such as silicon photonics (SiP), silicon nitride (TriPleX), and indium phosphide (InP). Achieving losses down to 1.9 dB per coupling interface, we believe that 3D-printed coupling elements represent a key step towards highly reproducible wafer-level testing of edge-coupled photonic integrated circuits. (C) 2020 Optical Society of America under the terms of the OSA Open Access Publishing Agreemen