Scanning European Needs and Expectations Related to Livestock Biosecurity Training by Using the World Café Method

The European Union Animal Health Law (2016/429) emphasizes disease prevention, underpinned by livestock biosecurity, surveillance, and traceability, as key aspects to minimize the risk of animal diseases. An important element of biosecurity is the training of key actors involved in implementing it. However, their needs and expectations regarding this training are poorly known. Under the COST action BETTER (CA20103), a World Café was organized to identify the needs and expectations of biosecurity training for farmers, veterinary practitioners, veterinary students, and other actors. A total of 78 participants distributed in four groups participated in the World Café. Needs and expectations were identified and ranked in decreasing order of importance. For farmers, the most important aspects were training focusing on practical aspects, the planning of training sessions in the day to accommodate workload, the need to prepare multiple reminders of upcoming training, and the short duration of events. For veterinary practitioners, it was considered that a mixed approach, including a theoretical and a practical part where people are invited to create a biosecurity plan and a follow-up report, were the most important features of training. For veterinary students, creating a good knowledge of the main principles of biosecurity was found as an essential element of training. Regarding other actors, gaining an understanding in the spread of pathogens and the repercussions on the cost of animal products that diseases might have (consumers), training on good/best practices of cleaning and disinfection and the development of clear protocols (transporters), and a mixture of formal and informal training and training on communication skills (other actors) were considered important. The World Café was a useful method to have a first identification, discussion, and differentiation on livestock biosecurity training needs and expectations of the key actors, although additional follow-up research involving more participants from more diverse countries with different coverage of cultures and education would be beneficial. These needs and expectations are relevant and should be considered when designing new training courses

Allele frequencies for the new European Standard Set (ESS) loci and D1S1677 in the Belgian population

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Surface planarization of Cu and CuNiSn Micro-bumps embedded in polymer for below 20μm pitch 3DIC applications

Planarization techniques such as Surface planer (better known as Fly-cut) and chemical-mechanical polishing (CMP) can be used to improve the bump roughness and bump height uniformity within the die and wafer which can be beneficial for solder based bump stacking and Cu-Cu direct bonding [1]. In this paper the influence of both planarization techniques on 20μm pitch Cu and CuNiSn bumps embedded in polymer are studied. The polymer protects the bumps from the shearing force of the planarization process and will later serve as a underfill material for the resulting gap of a 3D stack. The microbump planarization process will be discussed. Furthermore characterization of the bump height uniformity across the wafer using SEM and High Resolution Profilometry (HRP) is reported

Alternative integration of ultra low-k dielectrics by template replacement approach

© 2015 IEEE. Replacement of sacrificial template by ultralow-k dielectric was studied as an alternative integration approach for Cu/low-k interconnect. Metallization structure was first formed by patterning a template material. After template removal, a spin-on porous low-k was deposited on the metal lines. Then, planarization of the excess low-k was performed by CMP. The proposed approach does solve the two major challenges in conventional Cu/low-k damascene integration approach: low-k plasma damage and metal penetration during barrier deposition on porous structures.status: publishe

Direct copper electrochemical deposition on Ru-based substrates for advanced interconnects target 30 nm and 1/2 pitch lines : from coupon to full-wafer experiments

Extending copper electrochemical deposition to 3x nm nodes and beyond requires a new plating approach that is not constrained by typical PVD copper seed step coverage performance. To this purpose, we propose a copper direct plating process on Plasma Enhanced Atomic Layer Deposition (PEALD) Ru-based resistive substrates, where the Cu seed is deposited in-situ during the front propagation from the edge to the center of the wafer. In order to understand the full-wafer copper direct plating process that occurs on these liners, the effect of plating tool advanced features, applied waveform, plating chemistry and substrate surface activation on the subsequent plated copper nucleation behavior are studied