Search for anomalous production of di-lepton events with missing transverse momentum in e(+)e(-) collisions at root s = 161 and 172 GeV

Events containing a pair of charged leptons and significant missing transverse momentum are selected from a data sample corresponding to a total integrated luminosity of 20.6 pb^-1 at centre-of-mass energies of 161 GeV and 172 GeV. The observed number of events, four at 161 GeV and nine at 172 GeV, is consistent with the number expected from Standard Model processes, predominantly arising from W+W- production with each W decaying leptonically. This topology is also an experimental signature for the pair production of new particles that decay to a charged lepton accompanied by one or more invisible particles. Further event selection criteria are described that optimise the sensitivity to particular new physics channels. No evidence for new phenomena is observed and limits on the production of scalar charged lepton pairs and other new particles are presented

Tests of the standard model and constraints on new physics from measurements of fermion-pair production at 130-172GeV at LEP

Production of events with hadronic and leptonic final states has been measured in e(+)e(-) collisions at centre-of-mass energies of 130-172 GeV, using the OPAL detector at LEP. Cross-sections and leptonic forward-backward asymmetries are presented, both including and excluding the dominant production of radiative Z gamma events, and compared to Standard Model expectations. The ratio R-b of the cross-section for production to the hadronic cross-section has been measured. In a model-independent fit to the Z lineshape, the data have been used to obtain an improved precision on the measurement of gamma-Z interference. The energy dependence of alpha(em) has been investigated. The measurements have also been used to obtain limits on extensions of the Standard Model described by effective four-fermion contact interactions, to search for t-channel contributions from new massive particles and to place limits on gaugino pair production with subsequent decay of the gaugino into a light gluino and a quark pair

Electroweak parameters of the z0 resonance and the standard model

Contains fulltext : 124399.pdf (publisher's version ) (Open Access

ATLAS beam test results

Many different configurations of electronics and semiconductor strip detectors were studied in 1995 using the ATLAS tracking detector test area at the H8 beam-line of the CERN SPS. A significant fraction of these investigations are presented elsewhere in this volume and this paper will concentrate on the results with silicon strip detectors read out with electronics preserving the pulse height information. Data has been collected with the ADAM, APV5 and FElix read-out chips on a number of different detectors. The first results are presented for read out with LHC electronics of detectors to the ATLAS-A specification of 112.5 μm pitch, employing n-strips in n-type silicon, capacitive coupling and intermediate strips. It is demonstrated that with adequate signal/noise, a spatial resolution of ≃13 μm is attainable with these detectors

Design and performance of the ABCD3TA ASIC for readout of silicon strip detectors in the ATLAS semiconductor tracker

The ABCD3TA is a 128-channel ASIC with binary architecture for the readout of silicon strip particle detectors in the Semiconductor Tracker of the ATLAS experiment at the Large Hadron Collider (LHC). The chip comprises fast front-end and amplitude discriminator circuits using bipolar devices, a binary pipeline for first level trigger latency, a second level derandomising buffer and data compression circuitry based on CMOS devices. It has been designed and fabricated in a BiCMOS radiation resistant process. Extensive testing of the ABCD3TA chips assembled into detector modules show that the design meets the specifications and maintains the required performance after irradiation up to a total ionising dose of 10 Mrad and a 1-MeV neutron equivalent fluence of 2×1014 n/cm2, corresponding to 10 years of operation of the LHC at its design luminosity. Wafer screening and quality assurance procedures have been developed and implemented in large volume production to ensure that the chips assembled into modules meet the rigorous acceptance criteria.</p