13 research outputs found

    Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

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    Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are commonly used for TCB and the oxidation of these metals is limited (Au) or easily controlled (Cu). However, despite Al oxidation, our experimental results and theoretical considerations show that TCB using Al is feasible even at temperatures down to 300−350 °C using a commercial bonder without in-situ surface treatment capability.acceptedVersio

    Texture of Al films for wafer-level thermocompression bonding

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    Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. The resulting Si/Al and Si/SiO2/Al sample types were compared after annealing (300–550 °C) in vacuum. The Si/SiO2/Al film samples showed higher surface roughness than the Si/Al samples. The as-deposited films had (111) preferred orientation, while (100) and (110) oriented Al grains were also present in Si/SiO2/Al samples. The Si/SiO2/Al samples and Si/Al sample annealed at 550 °C had a conical texture. The observed evolution of the grain structure with annealing temperature is discussed in terms of native oxide, surface roughness, diffusivity and grain orientation dependent mechanical properties in order to shine light on previously observed differences in Alsingle bondAl thermocompression wafer-level bonding with Si/SiO2/Al and Si/Al wafers.acceptedVersio

    Al-Al wafer-level thermocompression bonding applied for MEMS

    No full text
    Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are commonly used for TCB and the oxidation of these metals is limited (Au) or easily controlled (Cu). However, despite Al oxidation, our experimental results and theoretical considerations show that TCB using Al is feasible even at temperatures down to 300−350 °C using a commercial bonder without in-situ surface treatment capability

    Chronology, stratigraphy and hydrological modelling of extensive wetlands and paleolakes in the hyperarid core of the Atacama Desert during the late quaternary

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    © 2018 Elsevier LtdThe halite-encrusted salt pans (salars) present at low elevations in the hyperarid core of the Atacama Desert in northern Chile are unique features of one of the driest and possibly oldest deserts on Earth. Here we show that these landscapes were shallow freshwater lakes and wetlands during the last glacial period and formed periodically between ∼46.9 ka and 7.7 ka. The moisture appears to have been sourced from increased Andean runoff and most of our chronologies for these deposits were coeval with the Central Andean Pluvial Event (17.5–14.2 ka and 13.8–9.7 ka), but we also find evidence for older as well as slightly younger wet phases. These environments supported a diverse hygrophytic-halophytic vegetation, as well as an array of diatoms and gastropods. Using a regional hydrological model, we estimate that recharge rates from 1.5 to 4 times present were required to activate and maintain these wetlands in the past. Activation in the late Pleistocene was part of a

    Microbial Community Structure and the Persistence of Cyanobacterial Populations in Salt Crusts of the Hyperarid Atacama Desert from Genome-Resolved Metagenomics

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    Although once thought to be devoid of biology, recent studies have identified salt deposits as oases for life in the hyperarid Atacama Desert. To examine spatial patterns of microbial species and key nutrient sources, we genomically characterized 26 salt crusts from three sites along a fog gradient. The communities are dominated by a large variety of Halobacteriales and Bacteroidetes, plus a few algal and Cyanobacterial species. CRISPR locus analysis suggests the distribution of a single Cyanobacterial population among all sites. This is in stark contrast to the extremely high sample specificity of most other community members. Only present at the highest moisture site is a genomically characterized Thermoplasmatales archaeon (Marine Group II) and six Nanohaloarchaea, one of which is represented by a complete genome. Parcubacteria (OD1) and Saccharibacteria (TM7), not previously reported from hypersaline environments, were found at low abundances. We found no indication of a N2 fixation pathway in the communities, suggesting acquisition of bioavailable nitrogen from atmospherically derived nitrate. Samples cluster by site based on bacterial and archaeal abundance patterns and photosynthetic capacity decreases with increasing distance from the ocean. We conclude that moisture level, controlled by coastal fog intensity, is the strongest driver of community membership
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