Observation of nano-indent induced strain fields and dislocation generation in silicon wafers using micro-raman spectroscopy and white beam x-ray topography

In the semiconductor manufacturing industry, wafer handling introduces micro-cracks at the wafer edge. During heat treatment these can produce larger, long-range cracks in the wafer which can cause wafer breakage during manufacture. Two complimentary techniques, micro-Raman spectroscopy (μRS) and White Beam Synchrotron X-ray Topography (WBSXRT) were employed to study both the micro-cracks and the associated strain fields produced by nano-indentations in Si wafers, which were used as a means of introducing controlled strain in the wafers. It is shown that both the spatial lateral and depth distribution of these long range strain fields are relatively isotropic in nature. The Raman spectra suggest the presence of a region under tensile strain beneath the indents, which can indicate a crack beneath the indent and the data strongly suggests that there exists a minimum critical applied load below which cracking will not initiate

Three-dimensional X-ray diffraction imaging of process-induced dislocation loops in silicon

In the semiconductor industry, wafer handling introduces micro-cracks at the wafer edge and the causal relationship of these cracks to wafer breakage is a difficult task. By way of understanding the wafer breakage process, a series of nano-indents were introduced both into 20 20 mm (100) wafer pieces and into whole wafers as a means of introducing controlled strain. Visualization of the three-dimensional structure of crystal defects has been demonstrated. The silicon samples were then treated by various thermal anneal processes to initiate the formation of dislocation loops around the indents. This article reports the three-dimensional X-ray diffraction imaging and visualization of the structure of these dislocations. A series of X-ray section topographs of both the indents and the dislocation loops were taken at the ANKA Synchrotron, Karlsruhe, Germany. The topographs were recorded on a CCD system combined with a high-resolution scintillator crystal and were measured by repeated cycles of exposure and sample translation along a direction perpendicular to the beam. The resulting images were then rendered into three dimensions utilizing opensource three-dimensional medical tomography algorithms that show the dislocation loops formed. Furthermore this technique allows for the production of a video (avi) file showing the rotation of the rendered topographs around any defined axis. The software also has the capability of splitting the image along a segmentation line and viewing the internal structure of the strain fields

Non-destructive laboratory-based X-ray diffraction mapping of warpage in Si die embedded in IC packages

Reliability issues as a consequence of thermal/mechanical stresses created during packaging processes have been the main obstacle towards the realisation of high volume 3D Integrated Circuit (IC) integration technology for future microelectronics. However, there is no compelling laboratory-based metrology that can non-destructively measure or image stress/strain or warpage inside packaged chips, System-on-Chip (SoC) or System-in-Package (SiP), which is identified as a requirement by the International Technology Roadmap for Semiconductors (ITRS). In the work presented here, a triple-axis Jordan Valley Bede D1 X-ray diffractometer is used to develop a novel lab-based technique called X-ray diffraction 3-dimensional surface modeling (XRD/3DSM) for non-destructive analysis of manufacturing process-induced stress/warpage inside completely encapsulated packaged chips. The technique is demonstrated at room temperature and at elevated temperatures up to 115C by in situ XRD annealing experiments. The feasibility of this technique is confirmed through the charactersation of die stress inside encapsulated commercially available ultra-thin Quad Flat Non-lead (QFN) packages, as well as die stress in embedded QFN packages at various stages of the chip manufacturing proces

Synchrotron x-ray topographic and high-resolution diffraction analysis of mask-induced strain in epitaxial laterally overgrown GaAs layers

Synchrotron x-ray back reflection section topographs of epitaxial lateral overgrown (ELO) GaAs samples grown on (001) GaAs substrates show images of the GaAs layers bent due to the interaction between the layer and the SiO2 mask. The topographs are simulated under the assumption of orientational contrast. Using the same data the measured x-ray diffraction curve is simulated. The calculations, which are in good agreement with the measurements, are used to gain information on the tilted (001) lattice planes in each ELO layer. We show that the bending of ELO lattice planes reaches a maximum at the center of the ELO stripes, where misorientation is at a minimum, and decreases towards the edges of the stripes, where misorientation reaches a maximum

On the use of total reflection x-ray topography for the observation of misfit dislocation strain at the surface of a Si/Ge–Si heterostructure

Synchrotron x-ray topography was used in total reflection topography (TRT) mode to observe strain-induced surface bumps due to the presence of underlying misfit dislocations in strained-layer SiGe on Si epitaxial heterostructures. In these experiments, the x rays approached the sample surfaces at grazing incident angles below the critical angles for total external reflection for a number of reflections, and hence, surface strain features nominally less than a few tens of angstrøms from the sample surface have been observed. These are similar to the surface bumpiness observed by atomic force microscopy, albeit on a much larger lateral length scale. The fact that TRT mode images were taken was confirmed by the observation of conventional backreflection topographic images of misfit dislocations in all samples when the grazing incidence angle became greater than the critical angle

Crack propagation and fracture in silicon wafers under thermal stress

The behaviour of microcracks in silicon during thermal annealing has been studied using in situ X-ray diffraction imaging. Initial cracks are produced with an indenter at the edge of a conventional Si wafer, which was heated under temperature gradients to produce thermal stress. At temperatures where Si is still in the brittle regime, the strain may accumulate if a microcrack is pinned. If a critical value is exceeded either a new or a longer crack will be formed, which results with high probability in wafer breakage. The strain reduces most efficiently by forming (hhl) or (hkl) crack planes of high energy instead of the expected low-energy cleavage planes like {111}. Dangerous cracks, which become active during heat treatment and may shatter the whole wafer, can be identified from diffraction images simply by measuring the geometrical dimensions of the strain-related contrast around the crack tip. Once the plastic regime at higher temperature is reached, strain is reduced by generating dislocation loops and slip bands and no wafer breakage occurs. There is only a small temperature window within which crack propagation is possible during rapid annealing

Synchrotron radiation x-ray topography and defect selective etching analysis of threading dislocations in GaN

The crystal quality of bulk GaN crystals is continuously improving due to advances in GaN growth techniques. Defect characterization of the GaN substrates by conventional methods is impeded by the very low dislocation density and a large scale defect analysis method is needed. White beam synchrotron radiation x-ray topography (SR-XRT) is a rapid and non-destructive technique for dislocation analysis on a large scale. In this study, the defect structure of an ammonothermal c-plane GaN substrate was recorded using SR-XRT and the image contrast caused by the dislocation induced microstrain was simulated. The simulations and experimental observations agree excellently and the SR-XRT image contrasts of mixed and screw dislocations were determined. Apart from a few exceptions, defect selective etching measurements were shown to correspond one to one with the SR-XRT results.Peer reviewe