Effective current-driven memory operations for low-power ReRAM applications

© 2023 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. Al document ha d’aparèixer l’enllaç a la publicació original a IEEE, o bé al Digital Object Identifier (DOI).Resistive switching (RS) devices are electronic components which exhibit a resistive state that can be adjusted to different nonvolatile levels via electrical stressing, fueling the development of future resistive memories (ReRAM) and enabling innovative solutions for several applications. Most works so far have used voltage-based driving schemes for both WRITE and READ operations. However, results from current-driven WRITE operations have shown high uniformity in switching performance, and thus constitute a valid alternative to consider, but current-driven READ operations have rarely been explored. In this context, here we tested a current-based READ/WRITE memory driving scheme on commercial self-directed channel (SDC) devices, while operating constantly at low current levels between tenths of nA and 1.5 uA. We propose a novel method to carry out efficient READ operations exploiting the transient response of the voltage on the current-driven ReRAM memory cells. For READ operations performed at 100 nA, we calculated the cumulative probability distribution of the standard deviation of the measured voltage ( σV ) on the devices and we observed a ratio σV−HRS/σV−LRS∼10× . Moreover, the HRS and LRS states were distinguishable in all the tested devices with less than 0.5% error. Finally, the calculated energy consumption ( ESET≈10 nJ, ERESET≈30 nJ, and EREAD between 80–400 pJ) was competitive even when the duration of the READ/WRITE current pulses was suboptimal in the millisecond range. Therefore, the presented results validate the promising characteristics and the power-efficiency of the proposed READ method for current-driven ReRAM circuits and applications.This work was supported in part by the Chilean Government through the National Fund for Scientific and Technological Development (FONDECYT) under Grant 1221747; in part by the National Agency for Research and Development (ANID)-Basal under Grant FB0008; in part by the MICINN, Spain, through PRITES Project under Grant PID2019-105658RB-I00; and in part by FLEXRRAM Project under Grant TED2021-129643B-I00.Peer ReviewedPostprint (published version

Stochastic resonance exploration in current-driven ReRAM devices

© 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Advances in emerging resistive random-access memory (ReRAM) technology show promise for its use in future computing systems, enabling neuromorphic and memory-centric computing architectures. However, one aspect that holds back the widespread practical use of ReRAM is the behavioral variability of resistive switching devices. In this context, a radically new path towards ReRAM-based electronics concerns the exploitation of noise and the Stochastic Resonance (SR) phenomenon as a mechanism to mitigate the impact of variability. While SR has been already demonstrated in ReRAM devices and its potential impact has been analyzed for memory applications, related works have only focused on voltage input signals. In this work we present preliminary results concerning the exploration of SR in current-driven ReRAM devices, commercially available by Knowm Inc. Our results indicate that additive noise of amplitude s = 0.125uA can stabilize the cycling performance of the devices, whereas higher noise amplitude improves the HRS-LRS resistance window, thus could affect positively the Bit Error Rate (BER) metric in ReRAM memory applications.Supported by the Chilean research grants FONDECYT INICIACION 11180706 and ANID-Basal FB0008, and by the Spanish MCIN grants PID2019-105658RB-I00, and MCIN/AEI/10.13039/501100011033 grant PID2019-103869RB-C33.Peer ReviewedPostprint (author's final draft

Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combin ing 3D printing technology by DLP (Digital Light Processing) with a two - dimensional Drop - on - Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer - by - layer using polyme rization of photo sensitive resins. Concurrently, while the construction process is performed, the I nk J et printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photo sensitive resins have been filled with Low Te mperature Co - f iring Ceramic (LT CC) particles , in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order t o validate this technologyPostprint (author's final draft

Development of a multi-material additive manufacturing process for electronic devices

In order to increas e the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two -dimensional Drop- on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer -by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit em bedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co- firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for a chieving functional parts are discussed and a few prototypes have been built in order to validate this technologyPeer Reviewe

Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combin ing 3D printing technology by DLP (Digital Light Processing) with a two - dimensional Drop - on - Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer - by - layer using polyme rization of photo sensitive resins. Concurrently, while the construction process is performed, the I nk J et printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photo sensitive resins have been filled with Low Te mperature Co - f iring Ceramic (LT CC) particles , in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order t o validate this technolog

Development of a multimaterial additive manufacturing process for electronic devices

In order to increase the versatility of additive manufacturing multimaterial processes, a hybrid system has been developed, which is capable of combining 3D printing technology by DLP (Digital Light Processing) with a two-dimensional Drop-on-Demand Inkjet printing system. Through DLP technology based on digital micromirror devices (DMDs) it is possible to build up 3D geometries layer-by-layer using polymerization of photosensitive resins. Concurrently, while the construction process is performed, the InkJet printing system is used to deposit tiny drops of conductive inks on the substrate generated, which will thus constitute an electric circuit embedded within the three dimensional structure. On the other hand, photosensitive resins have been filled with Low Temperature Co-firing Ceramic (LTCC) particles, in order to modify the basis properties of the part by using sinterizable slurries. Finally the challenges in the sintering process for achieving functional parts are discussed and a few prototypes have been built in order to validate this technology.Peer Reviewe