Finite element based surface roughness study for ohmic contact of microswitches

Finite element method (FEM) is used to model ohmic contact in microswitches. A determinist approach is adopted, including atomic force microscope (AFM) scanning real contact surfaces and generating rough surfaces with three-dimensional mesh. FE frictionless models are set up with the elastoplastic material and the simulations are performed with a loading-unloading cycle. Two material properties, gold and ruthenium, are studied in the simulations. The effect of roughness is investigated by comparing the models with several smoothing intensities and asperity heights. The comparison is quantitatively analyzed with relations of force vs. displacement, force vs. contact area and force vs. electrical contact resistance (ECR); further the evolution of spots in contact during a loading-unloading cycle is studied

Finite dimensional representations of the rational Cherednik algebra for G4G_4

In this paper, we study representations of the rational Cherednik algebra associated to the complex reflection group $G_4$. In particular, we classify the irreducible finite dimensional representations and compute their characters.Comment: 21 pages, 1 figur

Analyse multi physique des sources de défiabilisation du microcontact électrique à destination des interrupteurs MEMS

Les micro- et nanotechnologies (MNT) connaissent aujourd'hui un essor important dans des domaines très variés. On observe en particulier un développement des filières de micro-interrupteurs. En effet, les interrupteurs MEMS ont démontré un gain de performances significatif en comparaison avec les systèmes de commutation actuels. Ces composants sont donc devenus très attractifs pour de nombreuses applications grand public et haute fiabilité, notamment en raison de la facilité d'intégration des microsystèmes à d'autres composants passifs ou issus de la filière microélectronique. L'énorme potentiel de cette technologie a poussé la communauté scientifique à envisager les micro-interrupteurs comme technologie de substitution aux systèmes de commutation actuels pour les applications faibles à moyennes puissances. Cependant, ces interrupteurs MEMS n'ont pas encore atteint un niveau de fiabilité convenable pour entrer en phase d'industrialisation poussée. L'une des principales défaillances observées durant le fonctionnement du composant se traduit soit par l'augmentation de la résistance de contact en fonction du nombre de cycles, allant jusqu'à atteindre une résistance infinie, soit par le collage irrémédiable des deux électrodes de contact au cours des cycles de commutations, annihilant la commande du composant. Ces deux phénomènes limitent de manière drastique la durée de vie du micro-interrupteur. La fiabilité du microcontact électrique, demeure ainsi le point critique dans ce type de composant, en raison des forces de contact bien souvent très faibles, entrainant des aires de contact effectives extrêmement réduites et des températures à l'interface de contact relativement élevées. C'est pourquoi de nouvelles techniques de caractérisation du microcontact ont été développées pendant cette thèse afin d'étudier l'évolution de la résistance de contact en fonction du nombre de cycles et de la force appliquée. Ces bancs de test nous permettent d'analyser le comportement électromécanique et électrothermique du microcontact, afin de comprendre l'origine des mécanismes de défaillance à travers une approche physique. L'originalité des travaux réalisés dans cette thèse réside dans l'étude de la température à l'interface de contact, considérée ici comme le principal vecteur de défaillance des contacts dans les interrupteurs MEMS ohmiques. En effet, la hausse de la température de contact engendre les principaux mécanismes de défaillance du microcontact, à savoir l'adhésion, le transfert de matière et la croissance de films isolants en surface du contact. Plusieurs types de contact seront étudiés afin d'accroitre la compréhension des phénomènes physiques à l'origine des défaillances pour finalement proposer une configuration fiable, fonctionnant malgré les contraintes thermiques à l'interface de contact.Research on electrical contact characterization for microelectromechanical system (MEMS) switches has been driven by the necessity to reach a high-reliability level for micro-switch applications. One of the main failure observed when aging devices with gold contacts is the increase of the electrical contact resistance. It is related to degradations of the surface topography caused by heating, adhesion forces, etc. In this paper we investigate the performance of gold and an alternative material, ruthenium, using a methodology dedicated to MEMS contacts: a nanoindenter is used to actuate mechanically the structure, providing an accurate control of the force applied and of the resulting displacement. The electrical resistance is measured by cross rods technique "four wires" to avoid any measurement of the wire access resistances. A high resolution source meter with programmed voltage compliance and micro voltmeter is used. The test vehicles are surface micromachined on silicon substrate. Dedicated tests and modelling are presented with 5 microm² square bumps under mechanical load (until 250microN) and electrical current (1mA-100mA). Analyses of contact force dependence, temperature dependence, adhesion forces, evolution of the contact area, creep behavior and topological modifications are discussed. Regarding the results, better understanding of micro-contact behavior related to the impact of current at low- to medium-power levels is obtained. Contact heating until the softening temperature is found to be the main factor leading to shift of mechanical properties of contact materials and topological modifications. Finally an enhanced stability of the bimetallic contact was demonstrated considering sensitivity to power increase

Characterization of Au/Au, Au/Ru and Ru/Ru ohmic contacts in MEMS switches improved by a novel methodology

International audienceComparisons between several pairs of contact materials are done with a new methodology using a commercial nanoindenter coupled with electrical measurements on test vehicles specially designed to investigate microscale contact physics. Experimental measurements are obtained to characterize the response of a 5-μm2-square contact bump under electromechanical stress with increased applied current. The data provide a better understanding of microcontact behavior related to the impact of current at low- to medium-power levels. Contact temperature rise is observed, leading to shifts of the mechanical properties of contact materials and modifications of the contact surface. The stability of the contact resistance, when the contact force increases, is studied for contact pairs of soft (Au/Au contact), harder (Ru/Ru contact), and mixed material configuration (Au/Ru contact). An enhanced stability of the bimetallic contact Au/Ru is demonstrated, onsidering sensitivity to power increase related to creep effects and topological modifications of the contact surfaces. These results are compared to previous ones and discussed in a theoretical way by considering the temperature distribution around the hottest area at the contact interface

Validation of mechanical damage monitoring on aluminium freestanding thin films using electrical measurements

This paper describes a new technique allowing the monitoring of damage in metallic freestanding thin films during micro-tensile test by using electrical characterization. After a presentation of the set-up, results obtained on aluminium thin coatings by using two calculation methods for damage variable are presented and commented

Phase I/II Trial of Liver-derived Mesenchymal Stem Cells in Pediatric Liver-based Metabolic Disorders: A Prospective, Open Label, Multicenter, Partially Randomized, Safety Study of One Cycle of Heterologous Human Adult Liver-derived Progenitor Cells (HepaStem) in Urea Cycle Disorders and Crigler-Najjar Syndrome Patients

Background. Regenerative medicine using stem cell technology is an emerging field that is currently tested for inborn and acquired liver diseases. Objective. This phase I/II prospective, open label, multicenter, randomized trial aimed primarily at evaluating the safety of Heterologous Human Adult Liver–derived Progenitor Cells (HepaStem) in pediatric patients with urea cycle disorders (UCDs) or Crigler-Najjar (CN) syndrome 6 months posttransplantation. The secondary objective included the assessment of safety up to 12 months postinfusion and of preliminary efficacy. Methods. Fourteen patients with UCDs and 6 with CN syndrome were divided into 3 cohorts by body weight and intraportally infused with 3 doses of HepaStem. Clinical status, portal vein hemodynamics, morphology of the liver, de novo detection of circulating anti–human leukocyte antigen antibodies, and clinically significant adverse events (AEs) and serious adverse events to infusion were evaluated by using an intent-to-treat analysis. Results. The overall safety of HepaStem was confirmed. For the entire study period, patient-month incidence rate was 1.76 for the AEs and 0.21 for the serious adverse events, of which 38% occurred within 1 month postinfusion. There was a trend of higher events in UCD as compared with CN patients. Segmental left portal vein thrombosis occurred in 1 patient and intraluminal local transient thrombus in a second patient. The other AEs were in line with expectations for catheter placement, cell infusion, concomitant medications, age, and underlying diseases. Conclusions. This study led to European clinical trial authorization for a phase II study in a homogeneous patient cohort, with repeated infusions and intermediate doses

Antidepressants of the Serotonin-Antagonist Type Increase Body Fat and Decrease Lifespan of Adult Caenorhabditis elegans

It was recently suggested that specific antidepressants of the serotonin-antagonist type, namely mianserin and methiothepin, may exert anti-aging properties and specifically extend lifespan of the nematode C.elegans by causing a state of perceived calorie restriction (Petrascheck M, Ye X, Buck LB: An antidepressant that extends lifespan in adult Caenorhabditis elegans; Nature, Nov 22, 2007;450(7169):553–6, PMID 18033297). Using the same model organism, we instead observe a reduction of life expectancy when employing the commonly used, standardized agar-based solid-phase assay while applying the same or lower concentrations of the same antidepressants. Consistent with a well-known side-effect of these compounds in humans, antidepressants not only reduced lifespan but also increased body fat accumulation in C. elegans reflecting the mammalian phenotype. Taken together and in conflict with previously published findings, we find that antidepressants of the serotonin-antagonist type not only promote obesity, but also decrease nematode lifespan